Abstract: A determination device able to determine a cause of generation of gas with a simple configuration is provided. The determination device includes a pressure gauge that detects pressure in a gas storage chamber that stores non-condensable gas generated in an absorber of an absorption refrigerator, and a hydrogen sensor that detects an amount of hydrogen discharged from the gas storage chamber. Further, a determining unit determines a cause of generation of the non-condensable gas stored in the gas storage chamber based on a detection result of the hydrogen sensor and a detection result of the pressure gauge.

Abstract: A determination device able to determine a cause of generation of gas with a simple configuration is provided. The determination device includes a pressure gauge that detects pressure in a gas storage chamber that stores non-condensable gas generated in an absorber of an absorption refrigerator, and a hydrogen sensor that detects an amount of hydrogen discharged from the gas storage chamber. Further, a determining unit determines a cause of generation of the non-condensable gas stored in the gas storage chamber based on a detection result of the hydrogen sensor and a detection result of the pressure gauge.

Abstract: A Cu core ball is provided that prevents any soft errors and decreases any connection failure. The Cu core ball includes a solder plating film formed on the surface of a Cu ball that is a Sn solder plating film or is made of a lead-free solder alloy, a principal ingredient of which is Sn. The solder plating film contains U of 5 ppb or less and Th of 5 ppb or less. The Cu ball has a purity of not less than 99.9% Cu and not more than 99.995% Cu. Pb and/or Bi contents therein are at a total of 1 ppm or more. The sphericity thereof is 0.95 or more. The obtained Cu core ball has an ? dose of 0.0200 cph/cm2 or less.

Abstract: A Cu core ball is provided that prevents any soft errors and decreases any connection failure. The Cu core ball includes a solder plating film formed on the surface of a Cu ball that is a Sn solder plating film or is made of a lead-free solder alloy, a principal ingredient of which is Sn. The solder plating film contains U of 5 ppb or less and Th of 5 ppb or less. The Cu ball has a purity of not less than 99.9% Cu and not more than 99.995% Cu. Pb and/or Bi contents therein are at a total of 1 ppm or more. The sphericity thereof is 0.95 or more. The obtained Cu core ball has an ? dose of 0.0200 cph/cm2 or less.