Patents by Inventor Tomohiko Iino

Tomohiko Iino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Water-soluble soldering flux
    Patent number: 5074928
    Abstract: A water-soluble soldering flux having good solderability, removability with water, and insulation resistance comprises, as activators, a combination of tartaric acid and a hydrohalide salt of mono-, di-, or tri-ethanolamine.
    Type: Grant
    Filed: November 23, 1990
    Date of Patent: December 24, 1991
    Assignees: Nippondenso Co., Ltd., Senju Metal Industry Co., Ltd.
    Inventors: Masaki Sanji, Toshihiko Taguchi, Tomohiko Iino, Kouichi Ootuka
  • Support device for plating an item having fine parts
    Patent number: 4770119
    Abstract: A method and device of performing plating of an item having a row of fine parts, e.g. a flatpack IC are disclosed. The method comprises immersing said item in a bath of molten solder, removing said item from said bath while maintaining said item in an attitude such that said row of fine parts is sloped with respect to the surface of said molten solder, and causing flux to exert a fluxing action on said molten solder which adheres to said fine parts, thereby decreasing the surface tension of the solder adhering to said fine parts and preventing bridges of solder from forming between said fine parts.
    Type: Grant
    Filed: February 17, 1987
    Date of Patent: September 13, 1988
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Yuuji Kawamata, Tomohiko Iino, Ryoichi Suzuki, Noriyuki Haga
  • Method of performing plating of an item having fine parts and a support device therefor
    Patent number: 4695481
    Abstract: A method and device of performing plating of an item having a row of fine parts, e.g. a flatpack IC are disclosed. The method comprises immersing said item in a bath of molten solder, removing said item from said bath while maintaining said item in an attitude such that said row of fine parts is sloped with respect to the surface of said molten solder, and causing flux to exert a fluxing action on said molten solder which adheres to said fine parts, thereby decreasing the surface tension of the solder adhering to said fine parts and preventing bridges of solder from forming between said fine parts.
    Type: Grant
    Filed: March 27, 1986
    Date of Patent: September 22, 1987
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Yuuji Kawamata, Tomohiko Iino, Ryoichi Suzuki, Noriyuki Haga