Patents by Inventor Tomohiko Nawata

Tomohiko Nawata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board, electronic device including a circuit board, and method of manufacturing a circuit board
    Patent number: 8420952
    Abstract: A circuit board includes a board, a first conductive land over the board, a second conductive land over the board, a resist extending over the board, and a conductive material within the opening. The second conductive land is distanced from the first conductive land. The resist has an opening that extends over at least a portion of the first conductive land, at least a portion of the second conductive land, and at least a portion of an intervening region of the board. The intervening region extends between the first and second conductive lands. The conductive material extends over the at least a portion of the intervening region, the at least a portion of the first conductive land, and the at least a portion of the second conductive land.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: April 16, 2013
    Assignee: Kyocera Corporation
    Inventor: Tomohiko Nawata
  • Circuit Board, Electronic Device Including a Circuit Board, and Method of Manufacturing a Circuit Board
    Publication number: 20110273856
    Abstract: A circuit board includes a board, a first conductive land over the board, a second conductive land over the board, a resist extending over the board, and a conductive material within the opening. The second conductive land is distanced from the first conductive land. The resist has an opening that extends over at leat a portion of the first conductive land, at least a portion of the second conductive land, and at least a portion of an intervening region of the board. The intervening region extends between the first and second conductive lands. The conductive material extends over the at least a portion of the intervening region, the at least a portion of the first conductive land, and the at least a portion of the second conductive land.
    Type: Application
    Filed: July 20, 2011
    Publication date: November 10, 2011
    Applicant: KYOCERA CORPORATION
    Inventor: Tomohiko NAWATA
  • Circuit board, electronic device including a circuit board, and method of manufacturing a circuit board
    Patent number: 8008581
    Abstract: A circuit board includes a board, a first conductive pad provided on the board, a second conductive pad provided with a first distance from the first conductive pad. A mask extends over the board and has an opening that extends over at least a part of the first conductive pad, at least a part of the second conductive pad, and at least a part of an intervening region of the board between the first and second conductive pads. A conductive material is provided in the opening, and extends over the at least a part of the first conductive pad, the at least a part of the intervening region, and the at least a part of the second conductive pad.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: August 30, 2011
    Assignee: Kyocera Corporation
    Inventors: Tomohiko Nawata, Makiko Nawata, legal representative
  • Circuit Board, Electronic Device Including a Circuit Board, and Method of Manufacturing a Circuit Board
    Publication number: 20070103182
    Abstract: A circuit board includes a board, a first conductive pad provided on the board, a second conductive pad provided with a first distance from the first conductive pad. A mask extends over the board and has an opening that extends over at least a part of the first conductive pad, at least a part of the second conductive pad, and at least a part of an intervening region of the board between the first and second conductive pads. A conductive material is provided in the opening, and extends over the at least a part of the first conductive pad, the at least a part of the intervening region, and the at least a part of the second conductive pad.
    Type: Application
    Filed: August 24, 2006
    Publication date: May 10, 2007
    Applicant: KYOCERA CORPORATION
    Inventor: Tomohiko Nawata