Patents by Inventor Tomohiko SAKURAI

Tomohiko SAKURAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190276407
    Abstract: A pyridonecarboxylic acid derivative or a salt thereof is represented by Formula (1), where R1 is hydrogen, a halogen atom, a lower alkyl group, or an amino group; R2 is —NH—R6, where R6 is hydrogen, a lower alkyl group, an amino lower alkyl group, or the like; —O—R7, where R7 is hydrogen, a lower alkyl group, or the like; —(CH2)m—R8, where R8 is an amino group or the like, m is 1, 2, 3 or 4; or a cyclic amino group of Formula (2), where Y represents NH or C—R9aR9b, where R9a and R9b are each independently hydrogen, a lower alkyl group, an amino group, a lower alkyl amino group, or the like; n and p are 1 or 2; R3 is hydrogen, a halogen atom, a lower alkyl group, or the like; R4 is hydrogen or a carboxyl group-protecting group; and R5 is hydrogen or a hydroxyl group-protecting group.
    Type: Application
    Filed: June 14, 2017
    Publication date: September 12, 2019
    Applicant: WAKUNAGA PHARMACEUTICAL CO., LTD.
    Inventors: Tomohiko KINOSHITA, Yasuhiro KURAMOTO, Satoshi INOUE, Kouji NISHIMURA, Tatsuya HIRANO, Mai ARAI, Asuka SAKURAI, Daichi KAZAMORI, Ayuka SASAKI
  • Publication number: 20190249000
    Abstract: A resin composition includes a resin A, a resin C, and a solvent. The resin A includes a sulfonic-acid-group-containing structural unit in an amount exceeding 5 mol % with respect to total structural units included in the resin A. The resin A has a content of a fluorine atom of 30 mass % or less with respect to a total mass of the resin A. The resin C includes a fluorine atom in a larger content per unit mass than the content of a fluorine atom per unit mass in the resin A. A content of the resin A in the resin composition is lower than a content of the resin C in the resin composition in terms of mass.
    Type: Application
    Filed: April 26, 2019
    Publication date: August 15, 2019
    Applicant: JSR Corporation
    Inventors: Tomohiko SAKURAI, Sosuke Osawa, Hiromitsu Nakashima
  • Publication number: 20170329228
    Abstract: A resist pattern-forming method includes applying a photoresist composition directly or indirectly on a front face of a substrate to form a photoresist film. A topcoat layer is laminated directly or indirectly on a front face of the photoresist film. The photoresist film is subjected to liquid immersion lithography in a presence of a liquid immersion liquid on a front face of the topcoat layer. Part of the topcoat layer is removed after subjecting the photoresist film to the liquid immersion lithography. The photoresist film is developed after the part of the topcoat layer is removed.
    Type: Application
    Filed: May 11, 2017
    Publication date: November 16, 2017
    Applicant: JSR CORPORATION
    Inventors: Tomohiko SAKURAI, Sousuke OOSAWA, Hiromitsu NAKASHIMA, Kousuke TERAYAMA
  • Patent number: 9541827
    Abstract: It is an object of the present invention to improve the curability of a resin composition and a photosensitive composition suitably employed to form e.g., a surface protecting film and an interlaminar insulating film of e.g., an electronic part, while reducing the internal stress remaining in a substrate when the composition is used to form a cured film on the substrate. The photosensitive composition includes a resin (A) having a phenolic hydroxyl group, a crosslinking agent (B1) having at least two oxazoline groups and a crosslinking agent (B2) having at least two groups represented by —CH2OR (wherein R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an acetyl group) and a photosensitive acid-generating agent (C).
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: January 10, 2017
    Assignee: JSR Corporation
    Inventors: Tomohiko Sakurai, Masaaki Hanamura
  • Publication number: 20140234777
    Abstract: It is an object of the present invention to improve the curability of a resin composition and a photosensitive composition suitably employed to form e.g., a surface protecting film and an interlaminar insulating film of e.g., an electronic part, while reducing the internal stress remaining in a substrate when the composition is used to form a cured film on the substrate. The photosensitive composition includes a resin (A) having a phenolic hydroxyl group, a crosslinking agent (B1) having at least two oxazoline groups and a crosslinking agent (B2) having at least two groups represented by —CH2OR (wherein R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an acetyl group) and a photosensitive acid-generating agent (C).
    Type: Application
    Filed: January 29, 2014
    Publication date: August 21, 2014
    Applicant: JSR CORPORATION
    Inventors: Tomohiko SAKURAI, Masaaki HANAMURA
  • Publication number: 20130012618
    Abstract: Provided are a resin composition capable of forming a cured film excellent in elongation properties; a polymer suitable as a component contained in the composition; a cured film formed from the composition; and an electronic part including the cured film. The resin composition includes (A) a polymer containing a structural unit represented by the formula (a1) and a structural unit represented by the formula (a2); and (F) a solvent, wherein in the formula (a1), R1s are each independently a hydrogen atom or hydroxyl group, provided that at least one R1 is hydroxyl group; and R2 is a hydrogen atom or a C1-4 alkyl group; and in the formula (a2), R3s are each independently a group having a cationic polymerizable group, or a hydrogen atom, provided that at least one R3 is a group having a cationic polymerizable group; and R4 is a hydrogen atom or a C1-4 alkyl group.
    Type: Application
    Filed: July 3, 2012
    Publication date: January 10, 2013
    Applicant: JSR Corporation
    Inventors: Akito HIRO, Masaaki HANAMURA, Futoshi YAMATO, Yuuji SHIMOYAMA, Jun MUKAWA, Hikaru MIZUNO, Akari SAKO, Tomohiko SAKURAI