Patents by Inventor Tomohiko UCHIYAMA

Tomohiko UCHIYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9788410
    Abstract: In the printed circuit board 100 in the power supply device, cover layers C1 and C2 are formed on a surface other than the connection areas 95A? and 95B? within a coil pattern EC, which corresponds to a surface-shaped exposure area exposed to the outside so that the size of the surface-shaped exposure area to which the conductive pattern E is exposed is adjusted, so that an effect, which restrains a conductor from being damaged, especially at a time of carrying the printed circuit board 100 while maintaining a heat radiating property of the conductor, is achieved.
    Type: Grant
    Filed: August 12, 2014
    Date of Patent: October 10, 2017
    Assignee: TDK CORPORATION
    Inventors: Tomohiko Uchiyama, Yasuhiro Murai
  • Publication number: 20150048917
    Abstract: In the printed circuit board 100 in the power supply device, cover layers C1 and C2 are formed on a surface other than the connection areas 95A? and 95B? within a coil pattern EC, which corresponds to a surface-shaped exposure area exposed to the outside so that the size of the surface-shaped exposure area to which the conductive pattern E is exposed is adjusted, so that an effect, which restrains a conductor from being damaged, especially at a time of carrying the printed circuit board 100 while maintaining a heat radiating property of the conductor, is achieved.
    Type: Application
    Filed: August 12, 2014
    Publication date: February 19, 2015
    Inventors: Tomohiko UCHIYAMA, Yasuhiro MURAI