Abstract: A gate driver includes: driver boards mountable on an IGBT module which is a driving-target external device; gate driver circuits which are formed on the driver boards and each apply a drive signal generated using power and a signal which are externally input through an input connector, to semiconductor elements of the IGBT module; and an insulating surrounding member disposed to surround a peripheral edge of the input-side driver board.

Abstract: A drive circuit is provided. When the switching element is in turn-on state and a collector-emitter voltage of the switching element is equal to or higher than a first predetermined voltage value, the first diode is turned on; the first transistor and the second transistor are turned on; and, after a mask time in which a first capacitor is started to be charged with a current from a current source and a voltage value at two ends becomes equal to or higher than a second predetermined voltage value higher than the first predetermined voltage value, an abnormality detection signal is output to the control unit. The control unit stops an output of the pulse signal to the switching element in response to the abnormality detection signal.

Abstract: An electronic component 100 includes: a circuit board module 104 which is composed of a plurality of layers, and in which a primary circuit 120 and secondary circuits 122, 124 are each formed using wring patterns of a first layer L1 to an eighth layer L8; and a magnetic core 106 which magnetically couples the primary circuit 120 and the secondary circuits 122, 124. The circuit board module 104 includes: a primary winding 120b and secondary windings 122b, 124b which are formed spirally around the magnetic core 106; and a third layer L3 and a sixth layer L6 interposed between a fourth layer L4 of the primary winding 120b and a second layer L2 of the secondary winding 122b and between a fifth layer L5 of the primary winding 120b and a seventh layer L7 of the secondary winding 124b.

Abstract: A gate driver includes: driver boards mountable on an IGBT module which is a driving-target external device; gate driver circuits which are formed on the driver boards and each apply a drive signal generated using power and a signal which are externally input through an input connector, to semiconductor elements of the IGBT module; and an insulating surrounding member disposed to surround a peripheral edge of the input-side driver board.

Abstract: An electronic component 100 includes: a circuit board module 104 which is composed of a plurality of layers, and in which a primary circuit 120 and secondary circuits 122, 124 are each formed using wring patterns of a first layer L1 to an eighth layer L8; and a magnetic core 106 which magnetically couples the primary circuit 120 and the secondary circuits 122, 124. The circuit board module 104 includes: cutout portions 104b which are formed in a cutout shape from side edge portions toward an inner side and which position the magnetic core 106 at a predetermined attachment position in a state of housing the magnetic core 106; and widened portions 104c which continue from the cutout portions 104b and are formed in a cutout shape from the side edge portions toward the inner side of the circuit board module 104, and which are formed on sides of the magnetic core 106 so as to be larger than a width W1 for housing of the cutout portions 104b.

Abstract: An electronic component 100 includes: a circuit board module 104 which is composed of a plurality of layers, and in which a primary circuit 120 and secondary circuits 122, 124 are each formed using wring patterns of a first layer L1 to an eighth layer L8; and a magnetic core 106 which magnetically couples the primary circuit 120 and the secondary circuits 122, 124. The circuit board module 104 includes: a primary winding 120b and secondary windings 122b, 124b which are formed spirally around the magnetic core 106; and a third layer L3 and a sixth layer L6 interposed between a fourth layer L4 of the primary winding 120b and a second layer L2 of the secondary winding 122b and between a fifth layer L5 of the primary winding 120b and a seventh layer L7 of the secondary winding 124b.

Abstract: An electronic component 100 includes: a circuit board module 104 which is composed of a plurality of layers, and in which a primary circuit 120 and secondary circuits 122, 124 are each formed using wring patterns of a first layer L1 to an eighth layer L8; and a magnetic core 106 which magnetically couples the primary circuit 120 and the secondary circuits 122, 124. The circuit board module 104 includes: cutout portions 104b which are formed in a cutout shape from side edge portions toward an inner side and which position the magnetic core 106 at a predetermined attachment position in a state of housing the magnetic core 106; and widened portions 104c which continue from the cutout portions 104b and are formed in a cutout shape from the side edge portions toward the inner side of the circuit board module 104, and which are formed on sides of the magnetic core 106 so as to be larger than a width W1 for housing of the cutout portions 104b.

Abstract: Provided is an internal combustion engine of a vehicle. An upper surface of a head cover supporting plug top coils is covered with an engine cover. A plug top coil cover is fixed to the upper surface of the head cover. Thereby, an upper passage is formed between the engine cover and the plug top coil cover, and a lower passage is formed between the head cover and the plug top coil cover. The lower passage includes a labyrinth defined by first wall parts provided for the head cover and second wall parts provided for the plug top coil cover. Since it becomes difficult for high-temperature air to flow along the lower passage facing the plug top coils, and easy for it to flow along the upper passage away from the plug top coils, the overheating of the plug top coils caused by contact with the high-temperature air is suppressed.