Patents by Inventor Tomohiro DOI

Tomohiro DOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240043089
    Abstract: There is provided a front structure of a handlebar vehicle that allows clutch and brake operations to be easily performed with one hand of the rider, a clutch lever that activates a clutch device and a brake lever of a brake device that activates a rear-wheel brake being arranged around a grip provided at a side-end part of a steering handlebar. The brake device is provided with a hydraulic master cylinder provided with a cylinder hole that accommodates a piston, and a brake lever that activates the piston. A clutch grip operation part of the clutch lever and a brake grip operation part of the brake lever extend along the grip and are able to rotate in the same rotation direction, and the clutch lever is disposed higher in the body of the vehicle than the brake lever.
    Type: Application
    Filed: December 13, 2021
    Publication date: February 8, 2024
    Applicant: Hitachi Astemo, Ltd.
    Inventors: Tomohiro Doi, Hiroaki Watanabe
  • Publication number: 20230375051
    Abstract: A disc brake for a vehicle capable of suppressing uneven abrasion of a lining of a friction pad depending on the rigidity of a caliper body and the material of the lining of the friction pad and capable of easily changing an operation feeling. In this disc brake for a vehicle, an inlet-side torque transmitting member 7 for receiving a braking torque of a friction pad 4 and an outlet-side torque transmitting member 8 are each mounted to a friction pad storage portion 3g of a caliper body 3. A first torque transmitting portion 7a of the inlet-side torque transmitting member 7 and a second torque transmitting portion 8a of the outlet-side torque transmitting member 8 are formed so that a thickness (T1) of the first torque transmitting portion 7a in the disc circumferential direction and a thickness (T2) of the second torque transmitting portion 8a in the disc circumferential direction differ from each other.
    Type: Application
    Filed: September 21, 2021
    Publication date: November 23, 2023
    Applicant: Hitachi Astemo, Ltd.
    Inventors: Tomohiro DOI, Shota UEHARA
  • Patent number: 11112760
    Abstract: A control device (70) of a plant which controls operation amounts of a plurality of types of equipment constituting the plant, the control device includes a prediction model deriving unit (71) that derives a prediction model from which a monitoring target value is output, an adjustment amount calculating unit (72) that calculates adjustment amounts of operation amounts in the case where the monitoring target value becomes a desired value and calculates differences between the operation amounts of existing control and the calculated operation amounts as first adjustment amounts, a constraint condition setting unit (73) that sets constraint conditions based on a measurement value and operation conditions of the plant 1, and an operation amount calculating unit (74) that calculates second adjustment amounts to which the constraint conditions are applied and calculates a plurality of the adjusted operation amounts based on each of the calculated second adjustment amounts.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: September 7, 2021
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Kazunari Ide, Takaharu Hiroe, Ryo Sase, Yoshikatsu Ikawa, Toshio Ishiwaki, Tomohiro Doi, Hiroshi Kitayama
  • Patent number: 11081605
    Abstract: A semiconductor laminate includes a substrate formed of a group III-V compound semiconductor and a quantum well structure disposed on the substrate. The quantum well structure includes a second element layer formed of a group III-V compound semiconductor and containing Sb and a first element layer formed of a group III-V compound semiconductor and disposed in contact with the second element layer. In the first element layer, the thickness of a region in which the content of Sb decreases in a direction away from the substrate from 80% of the maximum content of Sb in the second element layer to 6% of the maximum content is from 0.5 nm to 3.0 nm inclusive.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: August 3, 2021
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takuma Fuyuki, Tomohiro Doi, Takashi Go, Takashi Ishizuka
  • Publication number: 20200203542
    Abstract: A semiconductor laminate includes a substrate formed of a group III-V compound semiconductor and a quantum well structure disposed on the substrate. The quantum well structure includes a second element layer formed of a group III-V compound semiconductor and containing Sb and a first element layer formed of a group III-V compound semiconductor and disposed in contact with the second element layer. In the first element layer, the thickness of a region in which the content of Sb decreases in a direction away from the substrate from 80% of the maximum content of Sb in the second element layer to 6% of the maximum content is from 0.5 nm to 3.0 nm inclusive.
    Type: Application
    Filed: August 24, 2018
    Publication date: June 25, 2020
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takuma FUYUKI, Tomohiro DOI, Takashi GO, Takashi ISHIZUKA