Abstract: There is provided an Al wiring material which can achieve sufficient bond reliability of bonded parts in a high-temperature environment at the time when a semiconductor device operates. The Al wiring material containing one or more of Pd and Pt so as to satisfy 3?x1a?90 or 10?x1b?250, and 3?(x1a+x1b)?300, where x1a and x1b are respectively a content of Pd [mass ppm] and a content of Pt [mass ppm], with the balance comprising Al, and an average crystal grain diameter on a cross-section perpendicular to a longitudinal direction of the Al wiring material is 3 to 35 ?m.

Abstract: There is provided a novel Al wiring material that achieves both of a suppression of chip damage and a thermal shock resistance. In aspect 1, the Al wiring material includes an Al core material and an Al coating layer formed on a surface of the Al core material, and satisfies 1.2?H1h/H1s where H1h is a Vickers hardness of the Al core material (Hv) and H1s is a Vickers hardness of the Al coating layer (Hv). In aspect 2, the Al wiring material includes an Al core material and an Al coating layer formed on a surface of the Al core material, and satisfies 1.2?H2h/H2s where H2s is a Vickers hardness of the Al core material (Hv) and H2h is a Vickers hardness of the Al coating layer (Hv).

Abstract: To provide an Al bonding wire exhibiting a favorable high-temperature and high-humidity service life in a high-temperature and high-humidity environment required for next-generation vehicle-mounted power devices. The Al bonding wire for semiconductor devices containing equal to or larger than 3 mass ppm and equal to or smaller than 500 mass ppm of one or more of Pd and Pt in total, in which, as a result of measuring a crystal orientation on a cross section parallel to a wire axis direction including a wire axis of the bonding wire, an orientation ratio of a <100> crystal orientation angled at 15 degrees or less to the wire axis direction is equal to or higher than 30% and equal to or lower than 90%.

Abstract: A flame retardant suitable for manufacturing a polymer composition is provided. The polymer composition is used for forming a cured film in which a balance among flame retardancy, adhesion, chemical resistance, heat resistance, and elasticity, and so on, is provided. A flame-retardant polymer composition with an excellent balance among the above properties is also provided. The flame retardant of the invention has a structure of Formula (1), (2), or (3): (in which, R1 is hydrogen or methyl, R2 is C2-20 alkylene or C2-20 alkylene in which any —CH2— is replaced by —O—, R3 and R4 are C1-20 alkyl, phenyl, and phenyl substituted by C1-5 alkyl or phenyl, R3 and R4 may also be an integrally-formed cyclic group, and p and q are 0 or 1).

Abstract: The compound of the invention is represented by Formula (1a) or Formula (1b) wherein R1 is a monovalent group; P1 and P2 are a monovalent group having an acrylic group and a hydroxyl group; A1, A2, and B1 are a divalent cyclic group; X1, X2, X3, X4, Y1 and Y2 are a bonding group.

Abstract: An ink-jet ink suitable for forming a cured film with a balance of flame resistance, adhesion, chemical resistance, heat resistance, and softness, and a cured film with an excellent balance of the above properties are provided.

Abstract: A flame retardant suitable for manufacturing a polymer composition is provided. The polymer composition is used for forming a cured film in which a balance among flame retardancy, adhesion, chemical resistance, heat resistance, and elasticity, and so on, is provided. A flame-retardant polymer composition with an excellent balance among the above properties is also provided. The flame retardant of the invention has a structure of Formula (1), (2), or (3): (in which, R1 is hydrogen or methyl, R2 is C2-20 alkylene or C2-20 alkylene in which any —CH2— is replaced by —O—, R3 and R4 are C1-20 alkyl, phenyl, and phenyl substituted by C1-5 alkyl or phenyl, R3 and R4 may also be an integrally-formed cyclic group, and p and q are 0 or 1).

Abstract: The compound of the invention is represented by Formula (1a) or Formula (1b) wherein R1 is a monovalent group; P1 and P2 are a monovalent group having an acrylic group and a hydroxyl group; A1, A2, and B1 are a divalent cyclic group; X1, X2, X3, X4, Y1 and Y2 are a bonding group.