Patents by Inventor Tomohiro Fukao

Tomohiro Fukao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147627
    Abstract: One aspect of the present invention relates to a method for manufacturing a substrate with a conductive pattern, the method including: a base forming step of forming a plating base in a desired pattern on at least a portion of one surface of a stretchable substrate, wherein the stretchable substrate has a tensile modulus at 20° C. of 0.1 MPa or more and 500 MPa or less, an elongation at break of 100% or more and 1000% or less, and a storage modulus at 250° C. of 0.1 MPa or more; a bending step of bending the stretchable substrate; and a conductive pattern forming step of plating the plating base after performing the bending step to form a conductive pattern on the stretchable substrate.
    Type: Application
    Filed: December 7, 2023
    Publication date: May 2, 2024
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro FUKAO, Tomoaki SAWADA, Kyosuke MICHIGAMI
  • Publication number: 20240147609
    Abstract: A method for manufacturing a stretchable circuit board includes preparing a laminate in which a metal layer and a first stretchable insulating layer are in contact with each other and a peel strength between the metal layer and the first stretchable insulating layer is 0.5 N/mm or more and 3.0 N/mm or less, a second stretchable insulating layer, and a fluid; forming a via leading from a first surface, in contact with the metal layer, of the first stretchable insulating layer to a second surface opposite to the first surface; filling the fluid in the via; laminating the second stretchable insulating layer on the second surface to seal the via; and patterning the metal layer.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 2, 2024
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro FUKAO, Tomoaki SAWADA, Kyosuke MICHIGAMI, Qianying LI
  • Patent number: 11963558
    Abstract: A circuit mounted article to be fixed to a fabric is provided and includes a circuit board having flexibility, an electronic component mounted on a fabric facing face side, which faces the fabric, of the circuit board, and further a reinforcing portion to be used for fixing of the circuit mounted article to the fabric on the fabric facing face side of the circuit board.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: April 23, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takatoshi Abe, Tomohiro Fukao, Tomoaki Sawada, Susumu Fukushima
  • Publication number: 20240027053
    Abstract: An elastic resin sheet that is a resin sheet formed using a resin composition containing a thermosetting resin and a curing agent, in which when a maximum height of a surface roughness on a first surface of the resin sheet is Rz1 (?m), a maximum height of a surface roughness on a second surface facing the first surface is Rz2 (?m), and a thickness is t (?m), the Rz1, the Rz2, and the thickness t (?m) satisfy relation of the following Formula (1): (Rz1+Rz2)/t?0.5 (1), the elastic resin sheet includes a light-diffusing portion having irregularities with an arithmetic mean roughness Ra of 0.3 ?m or more and 5.0 ?m or less on at least one of the first surface and the second surface, and the elastic resin sheet has an initial tensile modulus of 0.5 MPa or more and 500 MPa or less.
    Type: Application
    Filed: October 4, 2023
    Publication date: January 25, 2024
    Inventors: Tomohiro FUKAO, Tomoaki Sawada, Kyosuke Michigami, Keiko Kashihara, Chihiro Horii
  • Patent number: 11864310
    Abstract: A stretchable laminate to be fixed to a fabric includes a stretchable circuit board including a stretchable insulating layer having an elongation rate of 10% or more, a fabric base material, and an adhesive layer that bonds the stretchable circuit board and the fabric base material together.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: January 2, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takatoshi Abe, Tomohiro Fukao, Tomoaki Sawada, Kyosuke Michigami
  • Publication number: 20230167215
    Abstract: An aspect of the present invention relates to a resin composition containing an acrylic resin and a curing agent, in which the acrylic resin contains a polymerization unit (A) of a (meth)acrylate having an epoxy group, a polymerization unit (B) of a (meth)acrylate having a cyano group, and a polymerization unit (C) of a (meth)acrylate having an isobornyl group, a weight average molecular weight of the acrylic resin is 50,000 or more and 3,000,000 or less, and a storage modulus of a cured product of the resin composition at 200° C. is 0.1 MPa or more and 3.5 MPa or less.
    Type: Application
    Filed: January 24, 2023
    Publication date: June 1, 2023
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro FUKAO, Tomoaki SAWADA, Kyosuke MICHIGAMI
  • Patent number: 11503706
    Abstract: A stretchable circuit board includes a stretchable base material, a stretchable wiring, and a land part that is in contact with the stretchable base material. The land part is formed of a patterned metal foil, or a printed product of an electroconductive ink containing metal particles. The stretchable base material has a tensile modulus at 25° C. room temperature of 0.5 MPa to 0.5 GPa.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: November 15, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takatoshi Abe, Tomoaki Sawada, Tomohiro Fukao
  • Publication number: 20220208411
    Abstract: An aspect of the present invention relates to a conductive resin composition containing an epoxy resin, a curing agent, and a conductive powder, in which a loss modulus of a dried product or semi-cured product of the conductive resin composition at 170° C. is 0.1 MPa or more and 15 MPa or less.
    Type: Application
    Filed: December 20, 2021
    Publication date: June 30, 2022
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Tomohiro FUKAO, Tomoaki SAWADA, Takatoshi ABE, Kyosuke MICHIGAMI
  • Publication number: 20220201850
    Abstract: A stretchable laminate to be fixed to a fabric includes a stretchable circuit board including a stretchable insulating layer having an elongation rate of 10% or more, a fabric base material, and an adhesive layer that bonds the stretchable circuit board and the fabric base material together.
    Type: Application
    Filed: April 16, 2020
    Publication date: June 23, 2022
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takatoshi ABE, Tomohiro FUKAO, Tomoaki SAWADA, Kyosuke MICHIGAMI
  • Publication number: 20220183154
    Abstract: A fiber sheet includes: a resin layer containing a thermosetting resin; and a fiber layer, wherein the fiber sheet is stretchable by 1% or more, and an initial tensile elastic modulus of the fiber sheet is 1 MPa or more and 1 GPa or less.
    Type: Application
    Filed: March 26, 2020
    Publication date: June 9, 2022
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro FUKAO, Tomoaki SAWADA, Takatoshi ABE, Kyosuke MICHIGAMI
  • Publication number: 20220175057
    Abstract: A circuit mounted article to be fixed to a fabric is provided and includes a circuit board having flexibility, an electronic component mounted on a fabric facing face side, which faces the fabric, of the circuit board, and further a reinforcing portion to be used for fixing of the circuit mounted article to the fabric on the fabric facing face side of the circuit board.
    Type: Application
    Filed: April 16, 2020
    Publication date: June 9, 2022
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takatoshi ABE, Tomohiro FUKAO, Tomoaki SAWADA, Susumu FUKUSHIMA
  • Patent number: 11345784
    Abstract: One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: May 31, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kyosuke Michigami, Tomoaki Sawada, Tomohiro Fukao, Takatoshi Abe, Andy Behr
  • Publication number: 20220167497
    Abstract: Provided is a stretchable circuit board including a stretchable insulating layer, and a wiring, in which the wiring is formed of a combination of a metal wiring portion that forms a main portion of the wiring, and a conductive stretchable portion disposed ancillary to the metal wiring portion.
    Type: Application
    Filed: March 26, 2020
    Publication date: May 26, 2022
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro FUKAO, Tomoaki SAWADA, Takatoshi ABE, Kyosuke MICHIGAMI, Makoto TAKASHIRO, Susumu FUKUSHIMA, Daisuke HONDA
  • Patent number: 11239004
    Abstract: A conductive composition is provided and at least includes an acrylic resin and a conductive powder, wherein the acrylic resin at least contains a polymer unit (A) of a (meth)acrylate having an epoxy group and a polymer unit (B) of a (meth)acrylate having an isobornyl group, and an amount of the polymer unit (B) is 5.0 parts by mass or more and 50.0 parts by mass or less based on 100 parts by mass of the acrylic resin.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: February 1, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro Fukao, Tomoaki Sawada, Takatoshi Abe
  • Publication number: 20210363308
    Abstract: One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).
    Type: Application
    Filed: November 6, 2019
    Publication date: November 25, 2021
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kyosuke MICHIGAMI, Tomoaki SAWADA, Tomohiro FUKAO, Takatoshi ABE, Andy BEHR
  • Publication number: 20210337660
    Abstract: A stretchable circuit board includes a stretchable base material, a stretchable wiring, and a land part that is in contact with the stretchable base material. The land part is formed of a patterned metal foil, or a printed product of an electroconductive ink containing metal particles. The stretchable base material has a tensile modulus at 25° C. room temperature of 0.5 MPa to 0.5 GPa.
    Type: Application
    Filed: July 9, 2021
    Publication date: October 28, 2021
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takatoshi ABE, Tomoaki SAWADA, Tomohiro FUKAO
  • Patent number: 11096276
    Abstract: The present application relates to a circuit board for use in electronic components. Specifically, the present application relates to a stretchable circuit board including a stretchable base material, a stretchable wiring, and a land part that is in contact with the stretchable base material.
    Type: Grant
    Filed: September 3, 2018
    Date of Patent: August 17, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takatoshi Abe, Tomoaki Sawada, Tomohiro Fukao
  • Publication number: 20210161004
    Abstract: The present application relates to a circuit board for use in electronic components. Specifically, the present application relates to a stretchable circuit board including a stretchable base material, a stretchable wiring, and a land part that is in contact with the stretchable base material.
    Type: Application
    Filed: September 3, 2018
    Publication date: May 27, 2021
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takatoshi ABE, Tomoaki SAWADA, Tomohiro FUKAO
  • Publication number: 20210027909
    Abstract: A conductive composition is provided and at least includes an acrylic resin and a conductive powder, wherein the acrylic resin at least contains a polymer unit (A) of a (meth)acrylate having an epoxy group and a polymer unit (B) of a (meth)acrylate having an isobornyl group, and an amount of the polymer unit (B) is 5.0 parts by mass or more and 50.0 parts by mass or less based on 100 parts by mass of the acrylic resin.
    Type: Application
    Filed: March 29, 2019
    Publication date: January 28, 2021
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro FUKAO, Tomoaki SAWADA, Takatoshi ABE
  • Publication number: 20170248896
    Abstract: Image forming apparatus, including: image bearer; charging unit for electrically charging image bearer surface; developing unit for developing with toner, electrostatic latent image formed over image bearer by exposure unit for performing light exposure; transfer unit for transferring developed toner to receiving member; and cleaning unit for cleaning toner remaining over image bearer without being transferred, wherein the toner contains: external additives; and base particles made of at least binder resin and colorant, external additive content of the toner is from 4 to 7 parts by mass relative to 100 parts by mass of base particles, primary particles of at least one external additive have a number average particle diameter of 0.01 to 0.05 ?m, cleaning unit includes an elastic-body blade having surface elastic modulus of from 15 to 25 N/mm2 and surface friction coefficient of from 0.5 to 0.7 at an abutment part thereof abutting on image bearer.
    Type: Application
    Filed: July 17, 2015
    Publication date: August 31, 2017
    Inventors: Naoki NAKATAKE, Takeshi YAMASHITA, Tetsushi SAKUMA, Mitsutoshi KICHISE, Tsuyoshi NOZAKI, Yoshihiro MIKURIYA, Yoshimichi ISHIKAWA, Atsushi YAMAMOTO, Kazuoki FUWA, Tomohiro FUKAO, Tomoharu MIKI