Abstract: There is provided with a method for treating cancer, comprising administering a pharmaceutical composition to a patient with cancer in combination with an anti-cancer agent, the pharmaceutical composition. A compound is represented by General Formula (I) or a pharmaceutically acceptable salt thereof: where R1 is an acyl residue from a fatty acid.

Abstract: With a view to simultaneously achieving reduction in sputter adhesion to an electronic article and improvement in durability required for maintenance of a film, the electronic article (10) has a film (3) which is formed on the surface of an underlayer member (1) and which is composed of a calcined and cured product of a film solution of a binder resin comprising a fluorine-based resin and a ceramic filler, wherein the fluorine-based resin is distributed increasingly more in the film (3) toward the surface on the side opposite to the underlayer member (1).

Abstract: A method for assembling an apparatus including a display sheet having a non-transparent part in at least a part of the display sheet, has a bonding step of bonding the display sheet to a housing. The bonding step has a first step of attaching the display sheet to the housing via a UV curable adhesive, and a second step of causing an ultraviolet light emitting apparatus to irradiate, from an external surface side of the display sheet. The display sheet is attached to the housing with ultraviolet light after the first step so that the ultraviolet light passes through at least a part of the non-transparent part of the display sheet and cures the UV curable adhesive.

Abstract: A cure degree evaluation method for evaluating a cure degree of an active energy ray-curable resin composition is a method for evaluating the cure degree of the active energy ray-curable resin composition includes the steps of: irradiating the active energy ray-curable resin composition with an active energy ray; and evaluating the cure degree of the active energy ray-curable resin composition in accordance with a color of the active energy ray-curable resin composition. The active energy ray-curable resin composition contains at least a radical polymerization compound, a leuco dye, and a radical polymerization initiator.

Abstract: Disclosed is a one-pack type epoxy resin composition containing an epoxy resin, dicyandiamide, an epoxy resin adduct compound, and a non-latent imidazole compound. The one-pack type epoxy resin composition is capable of being cured at a low temperature, while having excellent heat resistance and sealing properties. Also disclosed is use of the one-pack type epoxy resin composition.

Abstract: The present invention provides (A) an electronic part including a metal part combined with a non-metal part so as to cover the non-metal part, which electronic part can be assembled (i) with excellent workability, (ii) without requiring a high-temperature condition, and (iii) in a short period of time and (B) a method for manufacturing the electronic part. An electronic part (10) in accordance with the present invention includes (I) a non-metal part (11) and (II) a metal part (14) covering a covered region (11b) provided on a surface of the non-metal part (11). The covered region (11b) and the metal part (14) are combined together via an adhesive layer (12) provided by curing an ultraviolet anaerobic curing adhesive containing a photopolymerization initiator and organic peroxide.

Abstract: Provided are (i) a one-pack epoxy resin which exhibits excellent storage stability in terms of not only composition viscosity but also flowability and (ii) use thereof. The one-pack type epoxy resin composition, contains, as main components, (A) epoxy resin; (B) a modified aliphatic polyamine compound; and (C) inorganic filler treated with a long-chain hydrocarbon-group containing compound. Therefore, the present invention achieves (i) the one-pack type epoxy resin composition which exhibits the excellent storage stability in terms of not only the viscosity but also the flowability and (ii) use thereof.

Abstract: An epoxy resin composition is a one-part epoxy resin composition for hermetic sealing of an electronic component or an electrical component, containing: a liquid epoxy resin; dicyandiamide; and a filler, the filler having an average particle size between 0.1 ?m and 1 ?m, the filler containing particles not less than 5 ?m in particle size in an amount of not more than 20 wt %, and the amount of the filler contained in the one-part epoxy resin composition being between 5 and 60 parts by weight relative to 100 parts by weight of the liquid epoxy resin. This achieves a one-part liquid epoxy resin composition in which a great variety of curing agents can be used and dissociation of an epoxy resin and a curing agent is suppressed even when used in a gap of approximately several tens of micrometers.

Abstract: A method for assembling an apparatus including a display sheet having a non-transparent part in at least a part of the display sheet, has a bonding step of bonding the display sheet to a housing. The bonding step has a first step of attaching the display sheet to the housing via a UV curable adhesive, and a second step of causing an ultraviolet light emitting apparatus to irradiate, from an external surface side of the display sheet. The display sheet is attached to the housing with ultraviolet light after the first step so that the ultraviolet light passes through at least a part of the non-transparent part of the display sheet and cures the UV curable adhesive.

Abstract: Provided are a method for evaluating a cure degree of an active energy ray-curable resin composition simply, highly accurately, and quantitatively, a cure degree evaluation sheet for use in the method, and a cure degree evaluation system. A cure degree evaluation method in accordance with the present invention for evaluating a cure degree of an active energy ray-curable resin composition is a method for evaluating the cure degree of the active energy ray-curable resin composition, the method including the steps of: irradiating the active energy ray-curable resin composition with an active energy ray; and evaluating the cure degree of the active energy ray-curable resin composition in accordance with a color of the active energy ray-curable resin composition, the active energy ray-curable resin composition containing at least a radical polymerization compound, a leuco dye, and a radical polymerization initiator.

Abstract: Disclosed is a one-pack type epoxy resin composition containing an epoxy resin, dicyandiamide, an epoxy resin adduct compound, and a non-latent imidazole compound. The one-pack type epoxy resin composition is capable of being cured at a low temperature, while having excellent heat resistance and sealing properties. Also disclosed is use of the one-pack type epoxy resin composition.

Abstract: Provided is a method for bonding glass members for optical communication, which can achieve sufficient bonding strength and resistance to separation between the glass member and the adhesive layer. The method is characterized by vaporizing a silane-coupling agent by heating, treating glass members for optical communication with the silane-coupling agent vapor, and bonding the glass members to each other with an adhesive.

Abstract: Provided is a microlens having an inorganic compound layer directly formed on the surface of a base lens material that is resistant to cracking and wrinkling of the inorganic compound layer under high-temperature and high-humidity environment and also to cracking of the base lens material by repeated temperature fluctuation, and an optical device using the microlens. A microlens, comprising a hardened product obtained by polymerization of a polymerizable composition containing a polymerizable monomer and metal oxide fine particles having an average diameter of 1 to 80 nm as essential components and an inorganic compound layer coated on the surface thereof. An optical device equipped with the microlens.

Abstract: The present invention enables appropriate behavior of an individual who has problems with memory, and behavior support thereof with certainty. The individual who has problems with memory always carries the portable communication terminal and loads and collects various types of information along with an ID through the communication network as behavior monitoring information. Also various types of provided information (e.g. map information) are collected. When a specific status information (e.g.

Abstract: The present invention enables appropriate behavior of an individual who has problems with memory, and behavior support thereof with certainty. The individual who has problems with memory always carries the portable communication terminal and loads and collects various types of information along with an ID through the communication network as behavior monitoring information. Also various types of provided information (e.g. map information) are collected. When a specific status information (e.g.