Abstract: A coil device includes a core containing a magnetic material and a wire disposed in a coil shape around at least a part of the core. 70% or more of a volume of a middle leg portion of the core is located below a venting surface of a heat-dissipating resin. Between a first base portion of the core and one end of the middle leg portion is an air layer. The air layer is located below the venting surface of the heat-dissipating resin.

Abstract: A coil device includes a core containing a magnetic material and a wire disposed in a coil shape around at least a part of the core. The core includes a middle leg portion and a first base portion. The middle leg portion has a winding portion of the wire disposed therearound. The first base portion is disposed apart by a predetermined distance from one end of the middle leg portion along a winding axis of the winding portion. 70% or more, preferably 80% or more, more preferably 90% or more, or still more preferably 95% or more of a volume of the middle leg portion is located below a venting surface of a heat-dissipating resin.

Abstract: A coil device has a core including a magnetic material and a wire disposed in a coil shape around at least a part of the core. 70% or more of a volume of a middle leg portion of the core is located below an atmosphere open surface of a heat dissipation resin. An outer division gap of the core is provided in a middle or an end portion of the outer leg portion, and a partial adhesive portion in which an adhesive is interposed and an air layer in which an adhesive is not interposed are provided in the outer division gap.

Abstract: The present disclosure provides a coil device that can be reduced in height, has a small installation area of a case, and is excellent in heat dissipation. A coil device according to the present disclosure includes: a device body including a bobbin and a coil unit of a wire wound around the bobbin; a terminal block arranging a lead portion drawn out from a wire of the coil unit thereon; and a case capable of accommodating the device body. The case includes a support arm extending outside the case, and the terminal block is held by the support arm.

Abstract: A coil device 1 comprises a second bobbin 20 provided with a second coil 92; cores 30b and 30c attached to the second bobbin 20; a case 40 accommodating the second bobbin 20 and the cores 30b and 30c; and a heat dissipating resin 100 filling the case 40. The case 40 comprises a case body 41 covering the second bobbin 20 with the cores 30b and 30c from above and from below and having an opening 42 that is opened laterally. The second bobbin 20 comprises protrusions 24 protruding from the case body 41 through the opening 42.

Abstract: A coil device 1 includes cores 30b and 30c; flat coils 93a to 93d each having a flat wire; a bobbin 20 having a through-hole 210 in which legs 33b and 33c of the cores 30b and 30c are disposed and accommodation grooves 220a to 220d into which the flat coils 93a to 93d are laterally inserted; and a retainer member 80 inserted into the through-hole 210 and disposed at inner circumferential sides of the flat coils 93a to 93d.

Abstract: A coil device including; a bobbin including a winding part wound with a first wire and a second wire around an outer circumference face of the winding part, and flanges and formed at ends of the winding part in an axis direction; and a terminal block formed separately from the bobbin and installed to the bobbin The terminal block is arranged at a position spaced away from the outer circumference face of the winding part in a direction perpendicular to the axis direction of the winding part.

Abstract: A curing agent for epoxy resin which comprises at least one selected from the compound of the formula (1) and its salt, as an effective component wherein X is —(CH2)n- or —(CH2)1-Y—(CH2)m- , Y is —N(R1)—, —O— or —S—, R1 is alkyl having 1 to 8 carbon atoms or amino. n is a number of 2, 3, 5 to 11, 1 and m are each a number of 1 to 8.

Abstract: The present invention provides an aqueous solution of an epoxy resin and a solid thereof, which is obtained by the following manner that an epoxy compound or a solution of the epoxy compound in organic solvent, and an amine compound of the formula (1), an aqueous solution thereof, a solution of the amine compound in organic solvent, or a solution thereof in a mixture of water and organic solvent, are mixed together so that the epoxy compound and the amine compound are reacted or polymerized to obtain a solution of an epoxy resin, to which water is added and heated to remove the organic solvent and unreacted amine compound, and a process for preparing the same NH2N(R1)(R2)  (1) wherein R1 and R2 are the same or different and each is alkyl having 1 to 6 carbon atoms, alkylene having 2 to 11 carbon atoms or a group represented by —R3—N(R4)—R5— which are formed when both are bonded, R3 and R5 are the same or different and each is alkylene having 1 to 6 carbon atoms, and R4 is a

Abstract: A curing agent for epoxy resin which comprises at least one selected from 1-aminopyrrolidine and its salt.

Abstract: 1-Aminopyrrolidine which is obtained by reacting hydrazine hydrate with a compound represented by the following formula (I):X.sup.1 --C.sub.4 H.sub.8 --X.sup.2 (I)wherein X.sup.1 and X.sup.2 are the same or different, and each represents a leaving group, in methanol; and a process for producing 1-aminopyrrolidine, comprising the step of reacting hydrazine hydrate with the above compound represented by formula (I) in methanol.