Abstract: A solid-liquid separation device of the present invention is a solid-liquid separation device, in which a filtration belt (1), a seal belt (8), and a squeezing belt (15) are wound around an outer circumference of a separation roll (7) rotated in a circumferential direction and are able to run along a rotational direction of the separation roll (7), an object (P) to be processed supplied between the filtration belt (1) and the seal belt (8) is sandwiched between the filtration belt (1) and the seal belt (8) on the outer circumference of the separation roll (7) and squeezed by the squeezing belt (15), and the object (P) to be processed is dehydrated by being ventilated by ejecting a ventilation gas toward a radially outer side of the separation roll (7) via a ventilation gas chamber (10) formed in an inner circumferential portion of the separation roll (7), in which the seal belt (8) is a woven fabric of multifilament or a woven fabric obtained by combination of multifilament and monofilament and is a thinner t

Abstract: A thermoelectric module according to the present disclosure includes: a pair of insulating substrates, each insulating substrate including a one main surface in a plan view, and a rectangular facing region of the one main surface, the rectangular facing regions facing each other; wiring conductors located on the one main surfaces of the pair of insulating substrates, respectively; a pair of metal plates located on other main surfaces opposite to the one main surfaces of the pair of insulating substrates, respectively; and a plurality of thermoelectric elements located between the one main surfaces of the pair of insulating substrates. At least one insulating substrate and at least one metal plate include a protrusion protruding from a one side of the rectangular facing region in the plan view, and a metal pattern located on the one main surface of the protrusion, the metal pattern not electrically connected to the wiring conductor.

Abstract: A thermoelectric module according to the disclosure includes: a pair of support substrates including mutually opposed regions; wiring conductors disposed on opposed one principal surfaces of the pair of support substrates, respectively; a plurality of thermoelectric elements disposed between the one principal surfaces; a lead member joined to one wiring conductor of the wiring conductors, the one wiring conductor being located on either one support substrate of the pair of support substrates; and an electrically conductive joining material which joins the one wiring conductor and the lead member together. A bonding interface between the electrically conductive joining material and the wiring conductor is smaller in width on a side close to the thermoelectric elements than on a side away from the thermoelectric elements, as viewed in a section in a direction perpendicular to an axial direction of the lead member.

Abstract: A thermoelectric module according to the present disclosure includes: a pair of insulating substrates, each insulating substrate including a one main surface in a plan view, and a rectangular facing region of the one main surface, the rectangular facing regions facing each other; wiring conductors located on the one main surfaces of the pair of insulating substrates, respectively; a pair of metal plates located on other main surfaces opposite to the one main surfaces of the pair of insulating substrates, respectively; and a plurality of thermoelectric elements located between the one main surfaces of the pair of insulating substrates. At least one insulating substrate and at least one metal plate include a protrusion protruding from a one side of the rectangular facing region in the plan view, and a metal pattern located on the one main surface of the protrusion, the metal pattern not electrically connected to the wiring conductor.

Abstract: A thermoelectric module includes a pair of support substrates having mutually opposed regions; wiring conductors each disposed on one principal surfaces of the pair of support substrates, the one principal surfaces being opposed to each other; a plurality of thermoelectric elements disposed between the one principal surfaces; a lead member joined to one wiring conductor disposed on one support substrate; and a cover material which covers a junction where the lead member is joined to the one wiring conductor disposed on the one support substrate. The one support substrate has a first protruding portion including the junction, and the other support substrate has a second protruding portion located so as not to overlap the junction as seen in a direction perpendicular to the one principal surface. The cover material is joined to the first protruding portion and the second protruding portion.

Abstract: A thermoelectric module includes a pair of support substrates having mutually opposed regions; wiring conductors each disposed on one principal surfaces of the pair of support substrates, the one principal surfaces being opposed to each other; a plurality of thermoelectric elements disposed between the one principal surfaces; a lead member joined to one wiring conductor disposed on one support substrate; and a cover material which covers a junction where the lead member is joined to the one wiring conductor disposed on the one support substrate. The one support substrate has a first protruding portion including the junction, and the other support substrate has a second protruding portion located so as not to overlap the junction as seen in a direction perpendicular to the one principal surface. The cover material is joined to the first protruding portion and the second protruding portion.

Abstract: A camera module is provided wherein an image pickup device, a camera optical system and a driver, for aligning and focusing the camera optical system, are mounted on a board; wherein a connection terminal, to be electrically connected to the driver, is formed on a mounting face of the board; and wherein the connection terminal formed on the board is connected to the driver via a flexible wiring board.

Abstract: A camera module is provided wherein an image pickup device, a camera optical system and a driver, for aligning and focusing the camera optical system, are mounted on a board; wherein a connection terminal, to be electrically connected to the driver, is formed on a mounting face of the board; and wherein the connection terminal formed on the board is connected to the driver via a flexible wiring board.