Patents by Inventor Tomohiro Fuwa

Tomohiro Fuwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component built-in wiring board and method for manufacturing the same
    Patent number: 11935801
    Abstract: An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: March 19, 2024
    Assignee: IBIDEN CO., LTD.
    Inventors: Yusuke Tanaka, Tomohiro Futatsugi, Yuichi Nakamura, Yoshiki Matsui, Keinosuke Ino, Tomohiro Fuwa, Seiji Izawa
  • Electronic component built-in wiring board and method for manufacturing the same
    Patent number: 11437290
    Abstract: An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: September 6, 2022
    Assignee: IBIDEN CO., LTD.
    Inventors: Yusuke Tanaka, Tomohiro Futatsugi, Yuichi Nakamura, Yoshiki Matsui, Keinosuke Ino, Tomohiro Fuwa, Seiji Izawa
  • ELECTRONIC COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20220254693
    Abstract: An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.
    Type: Application
    Filed: April 27, 2022
    Publication date: August 11, 2022
    Applicant: IBIDEN CO., LTD.
    Inventors: Yusuke TANAKA, Tomohiro FUTATSUGI, Yuichi NAKAMURA, Yoshiki MATSUI, Keinosuke INO, Tomohiro FUWA, Seiji IZAWA
  • ELECTRONIC COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20200357712
    Abstract: An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.
    Type: Application
    Filed: May 8, 2020
    Publication date: November 12, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Yusuke TANAKA, Tomohiro Futatsugi, Yuichi Nakamura, Yoshiki Matsui, Keinosuke Ino, Tomohiro Fuwa, Seiji Izawa