Patents by Inventor Tomohiro Giga

Tomohiro Giga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Probe card and method for manufacturing probe card
    Publication number: 20070134824
    Abstract: A probe card that is manufactured inexpensively. The probe card includes a base plate, a flexible substrate, and a contact probe. The contact probe is a flexible substrate formed from polyimide resin. The contact probe has a plurality of parallel wires. Each wire has a distal end that functions as a contact. The contact probe is produced by cutting a general purpose substrate having a plurality of parallel wires formed at a predetermined pitch. The number of the parallel wires is equal to the number of pads of an LSI chip.
    Type: Application
    Filed: January 26, 2007
    Publication date: June 14, 2007
    Applicant: FUJITSU LIMITED
    Inventors: Yoshikazu Arisaka, Kunihiro Itagaki, Shigenobu Ishihara, Tomohiro Giga, Naoyoshi Kikuchi
  • Probe card and method for manufacturing probe card
    Patent number: 7180312
    Abstract: A probe card that is manufactured inexpensively. The probe card includes a base plate, a flexible substrate, and a contact probe. The contact probe is a flexible substrate formed from polyimide resin. The contact probe has a plurality of parallel wires. Each wire has a distal end that functions as a contact. The contact probe is produced by cutting a general purpose substrate having a plurality of parallel wires formed at a predetermined pitch. The number of the parallel wires is equal to the number of pads of an LSI chip.
    Type: Grant
    Filed: March 25, 2003
    Date of Patent: February 20, 2007
    Assignee: Fujitsu Limited
    Inventors: Yoshikazu Arisaka, Kunihiro Itagaki, Shigenobu Ishihara, Tomohiro Giga, Naoyoshi Kikuchi
  • Probe card
    Publication number: 20060022688
    Abstract: A probe card is commonly used for a plurality of kinds of semiconductor chips. The probe card has a probe card substrate and a multi-layer structure interconnection substrate connected to the probe card substrate. A plurality of probe needles extend from the multi-layer structure interconnection substrate. At least one power supply plane is provided between the multi-layer structure interconnection substrate and extreme ends of the probe needles. The power supply plane is configured and arranged to be exchangeable with a different plane.
    Type: Application
    Filed: December 21, 2004
    Publication date: February 2, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Tomohiro Giga, Kenji Togashi
  • Probe card and method for manufacturing probe card
    Publication number: 20030184330
    Abstract: A probe card that is manufactured inexpensively. The probe card includes a base plate, a flexible substrate, and a contact probe. The contact probe is a flexible substrate formed from polyimide resin. The contact probe has a plurality of parallel wires. Each wire has a distal end that functions as a contact. The contact probe is produced by cutting a general purpose substrate having a plurality of parallel wires formed at a predetermined pitch. The number of the parallel wires is equal to the number of pads of an LSI chip.
    Type: Application
    Filed: March 25, 2003
    Publication date: October 2, 2003
    Applicant: FUJITSU LIMITED
    Inventors: Yoshikazu Arisaka, Kunihiro Itagaki, Shigenobu Ishihara, Tomohiro Giga, Naoyoshi Kikuchi