Patents by Inventor Tomohiro Horinouchi

Tomohiro Horinouchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11912855
    Abstract: The present invention provides a resin composition for molding capable of producing a molded article that has excellent heat distortion resistance, excellent mechanical properties, high impact resistance, and high transparency and has a smaller change in weight at high temperature. The present invention also provides a molded article and a joint each produced from the resin composition for molding.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: February 27, 2024
    Assignees: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Tomohiro Horinouchi, Hiroshi Taniguchi
  • Publication number: 20220363887
    Abstract: The present invention aims to provide a resin composition for molding that makes it possible to achieve excellent continuous productivity and to produce a molded article having high surface smoothness, capable of reducing defective molding, less likely to crack during use, and also having excellent shock resistance. The present invention also aims to provide a molded article including the resin composition for molding. Provided is a resin composition for molding, containing: a chlorinated polyvinyl chloride resin; and a melt additive, the resin composition containing three components including a A100 component, a B100 component, and a C100 component, and having a percentage of the C100 component [C100 component/(A100 component+B100 component+C100 component)] of 30% or less, the three components being identified by measuring the resin composition by a solid echo method using pulse NMR at 100° C.
    Type: Application
    Filed: September 29, 2020
    Publication date: November 17, 2022
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Mitsuo MATSUMOTO, Ryota YAMASUGI, Tomohiro HORINOUCHI, Yoshito ARAI, Yasunari KUSAKA, Nami NAKAJIMA
  • Publication number: 20220348755
    Abstract: The present invention provides a resin composition for molding having excellent thermal meltability and capable of providing a molded article that is less likely to crack from a resin weld during use and has excellent surface gloss, and a molded article including the resin composition for molding. Provided is a resin composition for molding, containing: a chlorinated polyvinyl chloride resin; a polyvinyl chloride resin; and a melt additive, the resin composition having an area ratio of a peak B observed in a range of 0.6 to 1.0 ppm to a peak A observed in a range of 9.5 to 10 ppm (Area of peak B/Area of peak A) of 1 to 1,000 when a 1H NMR spectrum is measured by solution NMR.
    Type: Application
    Filed: September 29, 2020
    Publication date: November 3, 2022
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Tomohiro HORINOUCHI, Mitsuo MATSUMOTO, Ryota YAMASUGI, Yoshito ARAI, Yasunari KUSAKA, Nami NAKAJIMA
  • Publication number: 20220177690
    Abstract: The present invention provides a resin composition for molding capable of producing a molded article that has excellent heat distortion resistance, excellent mechanical properties, high impact resistance, and high transparency and has a smaller change in weight at high temperature. The present invention also provides a molded article and a joint each produced from the resin composition for molding.
    Type: Application
    Filed: March 27, 2020
    Publication date: June 9, 2022
    Applicants: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Tomohiro HORINOUCHI, Hiroshi TANIGUCHI
  • Publication number: 20200017762
    Abstract: A wavelength conversion material contains a cured product of a curable composition that contains a (meth)allyl compound, a (meth)acryl compound, a photopolymerization initiator, and a quantum dot phosphor.
    Type: Application
    Filed: September 26, 2017
    Publication date: January 16, 2020
    Applicant: Hitachi Chemical Company, Ltd.
    Inventors: Yoichiro MANSEI, Yoshitaka KATSUTA, Eiji KOBAYASHI, Kazuhiro YOSHIDA, Tomomi KAWAMURA, Tomoyuki NAKAMURA, Masayuki WADA, Tomohiro HORINOUCHI, Kohei MUKAIGAITO, Shigeaki FUNYU, Takahiro TANABE
  • Publication number: 20160237281
    Abstract: The present invention relates to a photocurable resin composition including (A) a compound having (meth)acryloyl group, (B) a photopolymerization initiator, and (C) a plasticizer, a content of the photopolymerization initiator (B) being 4.0 to 10% by mass.
    Type: Application
    Filed: September 26, 2014
    Publication date: August 18, 2016
    Inventors: Yuuki MIYAMOTO, Youichi KIMURA, Tetsuya OKAZAKI, Hiroka SHINDOU, Masayuki WADA, Tomohiro HORINOUCHI
  • Publication number: 20150309632
    Abstract: To provide a photocurable liquid resin composition which may be suitably applied for the purpose of filling a space between a protective panel and an image display unit or the like in an image display device, has an appropriate viscosity, is excellent in curing properties at a low dose and shaded part curing properties, is favorable in moist heat resistance reliability of a cured material, and is able to not only sufficiently suppress bleedout but also enhance resistance to yellowing after photocuring when used as a structural member of an image display device; an image display device using the same; and a method for manufacturing an image display device. Disclosed is a photocurable liquid resin composition including (A) a compound having a (meth)acryloyl group, (B) a photopolymerization initiator, (C) a plasticizer, and (D) an antioxidant, the component (D) including a compound having a hindered phenol structure in a molecule thereof.
    Type: Application
    Filed: November 14, 2013
    Publication date: October 29, 2015
    Inventors: Yuuki MIYAMOTO, Tomohiro HIRATA, Youichi Kimura, Keishi HAMADA, Tetsuya OKAZAKI, Hiroka SHINDOU, Masayuki WADA, Tomohiro HORINOUCHI
  • Patent number: D567211
    Type: Grant
    Filed: May 15, 2006
    Date of Patent: April 22, 2008
    Assignee: TOA Corporation
    Inventor: Tomohiro Horinouchi