Abstract: A radiation imaging apparatus includes a radiation detection sensor, a support base, a bonding member, and a wiring member. The radiation detection sensor is configured to detect radiation and is formed using a flexible substrate. The support base supports radiation detection sensor. The bonding member bonds a first region of the radiation detection sensor to the support base. The first region is located in a central portion of the radiation detection sensor. The wiring member is connected to a predetermined edge portion of the radiation detection sensor. A second region is a region of the radiation detection sensor that includes the predetermined edge portion, and the second region opposes the support base but is not adhered to the support base.

Abstract: A radiation detection apparatus includes a plurality of sensor units each including a semiconductor layer that converts radiation into a charge, a first surface located on a radiation incident side, and a second surface located on an opposite side to the first surface, a support member, an elastic member located between the second surface of each of the plurality of sensor units and the support member, and a substrate that covers the first surface of each of the plurality of sensor units. The elastic member presses each of the plurality of sensor units toward the substrate.

Abstract: A radiation detector manufacturing method is provided. The method includes: preparing a structure including a support base, a flexible base member arranged on the support base and having a principal surface including a pixel region in which a plurality of pixels are arranged, a scintillator arranged so as to cover the pixel region, and a protective layer arranged so as to cover the scintillator; and removing the support base from the flexible base member. The principal surface includes a peripheral region not covered with the protective layer. The method further includes, before the removing, arranging a reinforcing member in contact with the peripheral region, in a position overlapping the peripheral region and not overlapping the scintillator, in orthogonal projection to the principal surface.

Abstract: A radiation imaging apparatus including: a first scintillator layer configured to convert a radiation (R) which has entered the first scintillator layer into light; a second scintillator layer configured to convert a radiation transmitted through the first scintillator layer into light; a fiber optic plate (FOP) provided between the first scintillator layer and the second scintillator layer; and an imaging portion configured to convert the light generated in the first scintillator layer and the light generated in the second scintillator layer into an electric signal.

Abstract: A scintillator panel including a scintillator layer that converts incident radiation into light and a scintillator base that supports the scintillator layer, a sensor panel including a sensor substrate that is disposed on a side of the scintillator layer that is opposite to the scintillator base and has a photoelectric conversion portion that converts the light into an electric signal, and a sensor base that is disposed on the side of the sensor substrate that is opposite to the scintillator layer and supports the sensor substrate, and a sealing member that seals a gap between the scintillator panel and the sensor panel at an edge of the scintillator panel are comprised. The sensor panel is provided with a convex member for narrowing the gap at a position in a vertical direction to a surface of the sensor panel from the edge of the scintillator panel.

Abstract: A radiation imaging apparatus includes a sensor base, a sensor array that includes a plurality of sensor chips arranged in an array, and in which three or more sensor chips out of the plurality of sensor chips are arranged in one row of the sensor array, a scintillator positioned on a side opposite to the sensor base with respect to the sensor array, a bonding member that bonds the sensor array and the scintillator, and a plurality of bonding sheets that are separated from each other and bond the sensor base and the plurality of sensor chips. Two adjacent sensor chips out of the three or more sensor chips are bonded to the sensor base using separate bonding sheets out of the plurality of bonding sheets.

Abstract: A radiation imaging apparatus including: a first scintillator layer configured to convert a radiation (R) which has entered the first scintillator layer into light; a second scintillator layer configured to convert a radiation transmitted through the first scintillator layer into light; a fiber optic plate (FOP) provided between the first scintillator layer and the second scintillator layer; and an imaging portion configured to convert the light generated in the first scintillator layer and the light generated in the second scintillator layer into an electric signal.

Abstract: A scintillator panel including a scintillator layer that converts incident radiation into light and a scintillator base that supports the scintillator layer, a sensor panel including a sensor substrate that is disposed on a side of the scintillator layer that is opposite to the scintillator base and has a photoelectric conversion portion that converts the light into an electric signal, and a sensor base that is disposed on the side of the sensor substrate that is opposite to the scintillator layer and supports the sensor substrate, and a sealing member that seals a gap between the scintillator panel and the sensor panel at an edge of the scintillator panel are comprised. The sensor panel is provided with a convex member for narrowing the gap at a position in a vertical direction to a surface of the sensor panel from the edge of the scintillator panel.

Abstract: An imaging table includes: a bucky apparatus to which a radiation imaging apparatus capable of being installed; a top plate connected to the bucky apparatus and allowing a subject to get on the top plate; and a rotation mechanism arranged to connect the bucky apparatus and the top plate in a relatively rotatable manner. The imaging table of the present invention can easily correspond to a plurality of imaging techniques.

Abstract: A radiation imaging apparatus includes a sensor base, a sensor array that includes a plurality of sensor chips arranged in an array, and in which three or more sensor chips out of the plurality of sensor chips are arranged in one row of the sensor array, a scintillator positioned on a side opposite to the sensor base with respect to the sensor array, a bonding member that bonds the sensor array and the scintillator, and a plurality of bonding sheets that are separated from each other and bond the sensor base and the plurality of sensor chips. Two adjacent sensor chips out of the three or more sensor chips are bonded to the sensor base using separate bonding sheets out of the plurality of bonding sheets.

Abstract: A radiation detection apparatus includes a plurality of detection substrates on which photoelectrical conversion elements are arranged, a plate configured to support the plurality of detection substrates, a scintillator, and a plurality of bonding material members configured to bond the plurality of detection substrates and the scintillator. The plurality of bonding material members bond one-side surfaces of the plurality of detection substrates and a one-side surface of the scintillator, and the plurality of bonding material members are separated from each other and arranged so that outer edges of the plurality of bonding material members are not positioned between the plurality of detection substrates.

Abstract: An imaging table includes: a bucky apparatus to which a radiation imaging apparatus capable of being installed; a top plate connected to the bucky apparatus and allowing a subject to get on the top plate; and a rotation mechanism arranged to connect the bucky apparatus and the top plate in a relatively rotatable manner. The imaging table of the present invention can easily correspond to a plurality of imaging techniques.

Abstract: A radiation detection apparatus includes a plurality of detection substrates on which photoelectrical conversion elements are arranged, a plate configured to support the plurality of detection substrates, a scintillator, and a plurality of bonding material members configured to bond the plurality of detection substrates and the scintillator. The plurality of bonding material members bond one-side surfaces of the plurality of detection substrates and a one-side surface of the scintillator, and the plurality of bonding material members are separated from each other and arranged so that outer edges of the plurality of bonding material members are not positioned between the plurality of detection substrates.