Abstract: Provided is a composition with a viscosity in which coating is possible even with a small amount of solvent, has excellent curability, and in which an Si-based pressure-sensitive adhesive (PSA) (e.g., PSA layer) formed by a curing reaction has a low (e.g., 50° C. or lower) glass transition temperature (Tg) despite having high PSA strength and tack, has favorable wettability, and has favorable mechanical strength and elongation; and an application of the same.

Abstract: This disclosure relates to a curable silicone composition that contains little to no solvent, has excellent transparency and adhesion to a substrate, and has a low overall haze value, and also relates to a cured product thereof. The curable silicone composition comprises: 100 mass parts of (A) a chain organopolysiloxane having an aliphatic unsaturated carbon-carbon bond-containing group and a degree of siloxane polymerization (DP) within a range of 10 to 1000; 1 to 100 mass parts of (B) a chain organopolysiloxane having an aliphatic unsaturated carbon-carbon bond-containing group and having a DP within a range of 1001 to 10,000; 0 to 100 mass parts of (C) an organopolysiloxane resin; (D) a polyorganohydrogen siloxane; and (E) a catalytic amount of a hydrosilylation reaction catalyst. Optionally, the composition further comprises: 0 to 60 mass parts of (F) an organic solvent, for 100 mass parts of the sum of components (A) to (D).

Abstract: Provided is a silicone adhesive composition and an application thereof, that has a viscosity that enables coating even with a small amount of solvent content, has excellent curability due to hydrosilylation reaction, cures, has sufficient adhesive strength for practical use, and has excellent mechanical strength and elongation of the adhesive layer after curing, and can form a pressure-sensitive adhesive layer having sufficient adhesive strength for practical use.

Abstract: A curable silicone composition is disclosed. The curable silicone composition comprises: (A) a linear organopolysiloxane having at least two silicon atom-bonded alkenyl groups per molecule, wherein at least 5 mole % of all silicon atom-bonded organic groups are aryl groups; (B) an organopolysiloxane containing siloxane units represented by the general formula R13SiO1/2 where each R1 represents an independently selected monovalent hydrocarbon group, and siloxane units represented by the general formula SiO4/2, wherein the amount of alkenyl groups is at least 6% by weight; (C) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product with little weight reduction, little change in hardness, and little crack generation after thermal aging.

Abstract: A photocurable liquid silicone composition is disclosed. The photocurable liquid silicone composition comprises: (A) a straight chain organopolysiloxane having at least two alkenyl groups with 2 to 12 carbon atoms in a molecule, and not containing a mercaptoalkyl group; (B) an organopolysiloxane having at least two mercaptoalkyl groups in a molecule; (C) a branched chain organopolysiloxane, wherein alkenyl groups and mercaptoalkyl groups are not included; (D) a photo radical initiator containing a phosphorus atom; and (E) a hindered phenol compound. The photocurable liquid silicone composition is rapidly cured by irradiating with long wavelength light while providing excellent storage stability and coatability at room temperature and at low temperatures (e.g. approximately 0° C.), and provides a cured product that maintains transparency even when left under high temperature and high humidity conditions, with minimal clouding or discoloration.

Abstract: Provided is a resin-linear organopolysiloxane block copolymer which has a high degree of freedom in formulation due to excellent compatibility with other materials, in addition to exhibiting excellent film forming properties and followability of a film, while the stickiness of a film is suppressed. The resin-linear organopolysiloxane block copolymer has: a resin structure (A1) block that has siloxane units represented by R1SiO3/2 (wherein R1 represents a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) and SiO4/2; and a linear structure (A2) block represented by (R2SiO2/2)n (wherein n represents a number of 5 or more while R represents an alkyl group, a fluoroalkyl group, or an aryl group) in each molecule. The resin structure (A1) and the linear structure (A2) are linked to each other by an Si—O—Si bond, and an Si atom bonded to the resin structure (A1) constitutes an RSiO3/2 unit.

Abstract: The present invention pertains to a curable organopolysiloxane composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per module, (B) an organopolysiloxane resin represented by average unit formula: (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d. In the formula, R1's are the same or different from each other, and represent a hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond but at least two of the R1's per molecule represent hydrogen atoms, R2 represents a monovalent hydrocarbon group not having an aliphatic unsaturated bond, and a, b, and c are numbers satisfying 0<a<1, 0<b<1, and 0?c?0.2, and 0<d<1, respectively, but are also numbers satisfying 0.6?a/d 1.5, 1.5?b/d?3, and a+b+c+d=1, and (C) a catalyst for hydrosilylation reaction. This composition has excellent adhesiveness to a semiconductor element, and can form a cured product in which only a small number of bubbles are produced.

Abstract: A cosmetic composition and a topical composition containing a resin-linear organopolysiloxane block copolymer are provided, which are excellent in compatibility with other cosmetic raw materials, so as to have a high degree of freedom in formulation design, excellent film forming properties and film following properties, and suppressed tackiness of the film. The resin-linear organopolysiloxane block copolymer contains a resin-linear organopolysiloxane block copolymer (A) having a structure in which a resin structure (A1) block having a siloxane unit represented by R1SiO3/2 (where R1 is a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) or by SiO4/2 and a linear structure (A2) block represented by (R2SiO2/2)n (where n is a number of 5 or more, R is an alkyl group, a fluoroalkyl group, or an aryl group) are connected by a Si—O—Si bond and has an R1SiO3/2 unit.

Abstract: A curable silicone composition comprises: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule and free of a polyether structure; (C) a polyether-modified silicone having a siloxane dendron structure and a polyether structure; and (D) a hydrosilylation reaction catalyst. The curable silicone composition can be used to form an optical semiconductor device having minimal contamination of a case during manufacturing of the optical semiconductor device, good efficiency of light extraction from a light emitting element, and minimal color unevenness or chromaticity deviation. The optical semiconductor device is notable in that a light emitting element is sealed or covered by a cured material of the composition, in addition to having minimal contamination of a case, good efficiency of light extraction, and minimal chromaticity deviation.

Abstract: A curable silicone composition is disclosed. The composition comprises: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; (C) a polyether-modified silicone comprising repeating units represented by a general formula herein and having a number average molecular weight of 1,000 to 100,000; and (D) a hydrosilylation catalyst. The composition can be used to form an optical semiconductor device having minimal contamination of a case during manufacturing of the optical semiconductor device, good efficiency of light extraction from a light emitting element, and minimal color unevenness or chromaticity deviation. The optical semiconductor device notable in that a light emitting element is sealed or covered by a cured material of the composition, in addition to having minimal contamination of a case, good efficiency of light extraction, and minimal color unevenness or chromaticity deviation.

Abstract: A curable silicone composition includes at least: (A) an organopolysiloxane represented by an average composition formula and having at least two alkenyl groups in the molecule thereof; (B) an organopolysiloxane having at least two silicon-atom-bonded hydrogen atoms in the molecule thereof, at least 5 mol % of silicon-atom-bonded groups other than hydrogen atoms being aryl groups; (C) an organopolysiloxane represented by an average unit formula and having an alkenyl group, an aryl group, and an epoxy-containing organic group; and (D) a hydrosilylation catalyst. The silicone composition can be cured to form an optical semiconductor device having good efficiency.

Abstract: Provided is a resin-linear organopolysiloxane block copolymer which has a high degree of freedom in formulation due to excellent compatibility with other materials, in addition to exhibiting excellent film forming properties and followability of a film, while the stickiness of a film is suppressed. The resin-linear organopolysiloxane block copolymer has: a resin structure (A1) block that has siloxane units represented by R1SiO3/2 (wherein R1 represents a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) and SiO4/2; and a linear structure (A2) block represented by (R2SiO2/2)n (wherein n represents a number of 5 or more while R represents an alkyl group, a fluoroalkyl group, or an aryl group) in each molecule. The resin structure (A1) and the linear structure (A2) are linked to each other by an Si—O—Si bond, and an Si atom bonded to the resin structure (A1) constitutes an RSiO3/2 unit.

Abstract: A silicone resin-linear co-polymer is disclosed. The silicone resin-linear copolymer includes a resinous structure having the general formula (1): (R1R2R3SiO1/2)x(R4SiO3/2)y ??(1) wherein each R1, R2, R3 and R4 is an independently selected substituted or unsubstituted hydrocarbyl group, with the proviso that in one molecular at least two of R1, R2, and R3 are aryl groups; and x and y are each from >0 to <1 such that x+y=1; and a linear structure having the general formula (2): (R5R6SiO2/2) ??(2) wherein R5 and R6 are each independently selected substituted or unsubstituted hydrocarbyl groups. End use applications and related methods of the silicone resin-linear copolymer are also disclosed.

Abstract: A cosmetic composition and a topical composition containing a resin-linear organopolysiloxane block copolymer are provided, which are excellent in compatibility with other cosmetic raw materials, so as to have a high degree of freedom in formulation design, excellent film forming properties and film following properties, and suppressed tackiness of the film. The resin-linear organopolysiloxane block copolymer contains a resin-linear organopolysiloxane block copolymer (A) having a structure in which a resin structure (A1) block having a siloxane unit represented by R1SiO3/2 (where R1 is a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) or by SiO4/2 and a linear structure (A2) block represented by (R2SiO2/2)n (where n is a number of 5 or more, R is an alkyl group, a fluoroalkyl group, or an aryl group) are connected by a Si—O—Si bond and has an R1SiO3/2 unit.

Abstract: A photocurable liquid silicone composition is disclosed. The photocurable liquid silicone composition comprises: (A) a straight chain organopolysiloxane having at least two alkenyl groups with 2 to 12 carbon atoms in a molecule, and not containing a mercaptoalkyl group; (B) an organopolysiloxane having at least two mercaptoalkyl groups in a molecule; (C) a branched chain organopolysiloxane, wherein alkenyl groups and mercaptoalkyl groups are not included; (D) a photo radical initiator containing a phosphorus atom; and (E) a hindered phenol compound. The photocurable liquid silicone composition is rapidly cured by irradiating with long wavelength light while providing excellent storage stability and coatability at room temperature and at low temperatures (e.g. approximately 0° C.), and provides a cured product that maintains transparency even when left under high temperature and high humidity conditions, with minimal clouding or discoloration.

Abstract: The present invention pertains to a curable organopolysiloxane composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per module, (B) an organopolysiloxane resin represented by average unit formula: (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d. In the formula, R1's are the same or different from each other, and represent a hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond but at least two of the R1's per molecule represent hydrogen atoms, R2 represents a monovalent hydrocarbon group not having an aliphatic unsaturated bond, and a, b, and c are numbers satisfying 0<a<1, 0<b<1, and 0?c?0.2, and 0<d<1, respectively, but are also numbers satisfying 0.6?a/d 1.5, 1.5?b/d?3, and a+b+c+d=1, and (C) a catalyst for hydrosilylation reaction. This composition has excellent adhesiveness to a semiconductor element, and can form a cured product in which only a small number of bubbles are produced.

Abstract: A curable silicone composition is disclosed. The curable silicone composition comprises: (A) a linear organopolysiloxane having at least two silicon atom-bonded alkenyl groups per molecule, wherein at least 5 mole % of all silicon atom-bonded organic groups are aryl groups; (B) an organopolysiloxane containing siloxane units represented by the general formula R13SiO1/2 where each R1 represents an independently selected monovalent hydrocarbon group, and siloxane units represented by the general formula SiO4/2, wherein the amount of alkenyl groups is at least 6% by weight; (C) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product with little weight reduction, little change in hardness, and little crack generation after thermal aging.

Abstract: Provided is a resin-linear organopolysiloxane block copolymer which has a high degree of freedom in formulation due to excellent compatibility with other materials, in addition to exhibiting excellent film forming properties and followability of a film, while the stickiness of a film is suppressed. The resin-linear organopolysiloxane block copolymer has: a resin structure (A1) block that has siloxane units represented by R1SiO3/2 (wherein R1 represents a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) and SiO4/2; and a linear structure (A2) block represented by (R2SiO2/2)n (wherein n represents a number of 5 or more while R represents an alkyl group, a fluoroalkyl group, or an aryl group) in each molecule. The resin structure (A1) and the linear structure (A2) are linked to each other by an Si—O—Si bond, and an Si atom bonded to the resin structure (A1) constitutes an RSiO3/2 unit.

Abstract: A silicone resin-linear copolymer is disclosed which has a resinous structure (A1) including R1SiO3/2 units, and a linear structure (A2) including repeated R22SiO2/2 units, wherein R1 is a propyl group and each R2 is an independently selected substituted or unsubstituted hydrocarbyl group, and wherein the resinous structure (A1) and the linear structure (A2) are bonded together in the silicone resin-linear copolymer via a siloxane bond.

Abstract: The present invention relates to a curable silicone composition comprising: (A) a diorganopolysiloxane having at least two alkenyl groups in a molecule, (B) at least two types of resinous organopolysiloxanes having different mass average molecular weights, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, and (D) a hydrosilylation reaction catalyst. The curable silicone composition enables the production of an optical semiconductor device in which the marked viscosity elevation of the resulting composition can be inhibited, in which the fluidity and packing properties are outstanding and that has outstanding gas barrier properties when used as a sealant, and in which the device has outstanding initial optical output efficiency even when organopolysiloxane resin is blended in order to form cured product with moderate hardness and strength.