Patents by Inventor Tomohiro Imao

Tomohiro Imao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface treatment composition and surface treatment method using same
    Patent number: 9028709
    Abstract: A surface treatment composition of the present invention contains a first surfactant, a second surfactant, a basic compound, and water. The surface treatment composition has a pH of 8 or more. The second surfactant has a weight-average molecular weight one-half or less that of the first surfactant. The sum of the content of the first surfactant and the content of the second surfactant is 0.00001 to 0.1% by mass.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: May 12, 2015
    Assignee: Fujimi Incorporated
    Inventors: Kohsuke Tsuchiya, Hitoshi Morinaga, Noboru Yasufuku, Shuhei Takahashi, Tomohiro Imao
  • Wetting agent for semiconductors, and polishing composition and polishing method employing it
    Patent number: 8632693
    Abstract: To provide a wetting agent for semiconductors and a polishing composition whereby the wettability of a semiconductor substrate surface can be improved, and microdefects such as particle attachments can be remarkably reduced. A wetting agent for semiconductors, comprising a water soluble polymer compound having a low viscosity and water, and a polishing composition. A 0.3 wt % aqueous solution of the water soluble polymer compound has a viscosity of less than 10 mPa·s at 25° C.
    Type: Grant
    Filed: July 1, 2009
    Date of Patent: January 21, 2014
    Assignee: Fujimi Incorporated
    Inventors: Hitoshi Morinaga, Shuhei Takahashi, Shogaku Ide, Tomohiro Imao, Naoyuki Ishihara
  • SURFACE TREATMENT COMPOSITION AND SURFACE TREATMENT METHOD USING SAME
    Publication number: 20130181159
    Abstract: A surface treatment composition of the present invention contains a first surfactant, a second surfactant, a basic compound, and water. The surface treatment composition has a pH of 8 or more. The second surfactant has a weight-average molecular weight one-half or less that of the first surfactant. The sum of the content of the first surfactant and the content of the second surfactant is 0.00001 to 0.1% by mass.
    Type: Application
    Filed: September 23, 2011
    Publication date: July 18, 2013
    Inventors: Kohsuke Tsuchiya, Hitoshi Morinaga, Noboru Yasufuku, Shuhei Takahashi, Tomohiro Imao
  • WETTING AGENT FOR SEMICONDUCTORS, AND POLISHING COMPOSITION AND POLISHING METHOD EMPLOYING IT
    Publication number: 20100003821
    Abstract: To provide a wetting agent for semiconductors and a polishing composition whereby the wettability of a semiconductor substrate surface can be improved, and microdefects such as particle attachments can be remarkably reduced. A wetting agent for semiconductors, comprising a water soluble polymer compound having a low viscosity and water, and a polishing composition. A 0.3 wt % aqueous solution of the water soluble polymer compound has a viscosity of less than 10 mPa·s at 25° C.
    Type: Application
    Filed: July 1, 2009
    Publication date: January 7, 2010
    Applicant: FUJIMI INCORPORATED
    Inventors: Hitoshi Morinaga, Shuhei Takahashi, Shogaku Ide, Tomohiro Imao, Naoyuki Ishihara