Abstract: A method for producing a circuit board includes a first step of arranging a circuit alignment jig having a pierced portion for receiving a circuit conductor corresponding to a circuit pattern on an insulating layer formed on a metal substrate, a second step is inserting the circuit conductor into the pierced portion, and a third step is pressing the circuit conductor to the insulating layer together with the circuit alignment jig.

Abstract: A cylindrical core portion, at least a part of which is made of a noble metal alloy and which has a diameter larger than a maximum diameter of a shape obtained by lathe machining, and a hollow-cylindrical peripheral portion, which is made of a material different from the material of the core portion, are included. The core portion is arranged in a hollow portion of the peripheral portion with no space. The material applied to the peripheral portion is a free-cutting material selected from a group of, for example, free-cutting brass, free-cutting phosphor bronze, free cutting nickel silver, and free-cutting beryllium copper. The noble metal alloy applied to the core portion is, for example, alloy mainly consisting of silver, palladium, gold, platinum, zinc, copper, iron, and nickel, alloy mainly consisting of palladium, silver, and copper, or alloy mainly consisting of silver, platinum, zinc, gold, and copper.

Abstract: An electrical contact member and a contact probe that are durable and economical are provided. For this purpose, an outer peripheral portion, which has a symmetrical shape with respect to a central axis in a longitudinal direction and has a hollow portion, and a core portion, which has an approximate bar shape extending in the longitudinal direction and filling the hollow portion, are included. One of the outer peripheral portion and the core portion is made of a noble metal alloy, and the other is made of a conductive material other than the noble metal alloy. The one of the outer peripheral portion and the core portion, which is made of the noble metal alloy, projects further than the other at one end portion in the longitudinal direction.

Abstract: A conductive contact holder includes a holder substrate and a holding member. The holder substrate is made of a conductive material and has an opening for holding a conductive contact for inputting and outputting a signal to and from a circuit structure. The holding member is formed by filling the opening with an insulating material, smoothing the surface of the insulating material, and forming a hole through the insulating material for inserting the conductive contact.

Abstract: A cylindrical core portion, at least a part of which is made of a noble metal alloy and which has a diameter larger than a maximum diameter of a shape obtained by lathe machining, and a hollow-cylindrical peripheral portion, which is made of a material different from the material of the core portion, are included. The core portion is arranged in a hollow portion of the peripheral portion with no space. The material applied to the peripheral portion is a free-cutting material selected from a group of, for example, free-cutting brass, free-cutting phosphor bronze, free cutting nickel silver, and free-cutting beryllium copper. The noble metal alloy applied to the core portion is, for example, alloy mainly consisting of silver, palladium, gold, platinum, zinc, copper, iron, and nickel, alloy mainly consisting of palladium, silver, and copper, or alloy mainly consisting of silver, platinum, zinc, gold, and copper.

Abstract: A conductive contact holder includes a holder substrate and a holding member. The holder substrate is made of a conductive material and has an opening for holding a conductive contact for inputting and outputting a signal to and from a circuit structure. The holding member is formed by filling the opening with an insulating material, smoothing the surface of the insulating material, and forming a hole through the insulating material for inserting the conductive contact.

Abstract: A surface finishing apparatus mirror-finishes a three-dimensional surface of a workpiece. The surface finishing apparatus has an ejector to eject a water jet to a concave surface of a dimple die and a feeder to feed microscopic grains so that the microscopic grains are propelled by the water jet to hit and mirror-finish the concave surface. The dimple die is movably supported so that the concave surface is entirely hit with the water jet. The water jet has a speed in the range of 200 m/sec to 1000 m/sec. The microscopic grains have grain diameters in the range of 4 nm to 100 nm.