Abstract: A cable assembly includes a first bonding member formed of a thermoplastic resin and configured to couple an insulation and a connector housing to suppress movement of the flat cable relative to the connector. The connector housing includes a mounting surface on which the flat cable is mounted. The first bonding member includes a first portion provided inside the contour of the insulation when viewed from the first direction substantially perpendicular to the mounting surface, and a second portion extending from the first portion and provided outside the contour when viewed from the first direction. The first portion has a first projected area defined inside the contour when viewed from the first direction. The second portion has a second projected area defined outside the contour when viewed from the first direction. The first projected area is larger than the second projected area.

Abstract: A power receiving apparatus receives power from an electric cable through which an AC current flows in a noncontact manner, and supplies the power to a target equipment. The power receiving apparatus includes: a coupler provided in a state where a position thereof relative to the electric cable is fixed. The coupler includes a magnetic core disposed to surround the electric cable, and a coil wound around the magnetic core. The magnetic core includes first and second core portions that are divided from each other by a core division plane. In the second core portion, a facing surface is formed in a flat shape to be disposed along the core division plane while facing the first core portion, and a nonmagnetic body is disposed along the facing surface to cover the facing surface, and sandwiched between the first and second core portions.

Abstract: A cable connector assembly includes a cable connector, a first flat cable, and a second flat cable. The first flat cable includes a first conductor exposure portion. The second flat cable includes a second conductor exposure portion. The cable connector includes a restriction portion contactable with the first flat cable to restrict the first conductor exposure portion from moving toward the second conductor exposure portion in a first direction.

Abstract: A rotary connector device includes a stator, a rotator, an electrical cable, an electrical connector, and a connector coupling portion. The stator includes a first stator and a second stator. The connector coupling portion is configured to couple the electrical connector to the first stator. The connector coupling portion is configured to support the electrical connector in a cantilever manner with respect to the first stator such that a second surface becomes a free end in a state where the electrical connector is positioned in a first position and where the second stator is detached from the first stator.

Abstract: At least one processor detects a position of a moving object moving in a second imaging range based on an image signal from a second camera. If the at least one processor determines that there is the moving object outside a first imaging range and inside the second imaging range based on the position of the moving object, the at least one processor estimates an approach area through which the moving object passes at a time of entering the first imaging range in a periphery of the first imaging range based on the position of the moving object. A display displays first notification information for notifying the approach area on a display screen together with a first live view image captured by a first camera.

Abstract: Provided is a resin which has high elongation, low stress, high sensitivity and high film retention ratio if used in a photosensitive resin composition. A photosensitive resin composition that contains a resin which has a structure represented by general formula (1) and/or general formula (2), and which is characterized in that (a) 10-80% by mole of an organic group having an alicyclic structure and 4-40 carbon atoms is contained as the R1 moiety of general formulae (1) and (2), and (b) 10-80% by mole of an organic group having a polyether structure with 20-100 carbon atoms is contained as the R2 moiety of general formulae (1) and (2).

Abstract: An adhesive composition for semiconductor devices which comprises an epoxy resin, a phenoxy resin, and a hardener, wherein part or all of the epoxy resin comprises at least one type of epoxy resin selected from the followings: (a) a dimer acid modified epoxy resin (b) a phosphorus containing epoxy resin having an epoxy equivalent of 2000 to 6000. Said adhesive composition has satisfactory flexural properties even in a high-temperature environment while retaining an excellent toughness of the adhesive and is excellent in soldering heat resistance, adhesive property, flame retardancy and electrical properties. The adhesive composition can suitable be used for cover lay films, adhesive sheets and copper-clad polyimide films.