Patents by Inventor Tomohiro Koiwa

Tomohiro Koiwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermosetting composition, and sealing article and sealing structure using the same
    Publication number: 20040197571
    Abstract: A sealing article and sealing structure are described that include a thermosetting composition. The thermosetting composition includes an epoxy-containing material, a curing agent for the epoxy-containing material, a non-metallic filler, and a plasticizer. The epoxy-containing material includes a how hygroscopic epoxylated ethylene-type thermoplastic resin or a low hygroscopic epoxylated styrene-type thermoplastic resin.
    Type: Application
    Filed: April 3, 2003
    Publication date: October 7, 2004
    Inventors: Yuji Hiroshige, Shuichi Kitano, Tomohiro Koiwa, Kotaro Shinozaki
  • Sealant composition, article and method
    Patent number: 6582824
    Abstract: A composition comprises a curable epoxy-containing material, a first thermoplastic polyurethane component, a curative for the epoxy-containing material, and optionally, a second thermoplastic polyurethane component that is different than the first thermoplastic polyurethane component. The compositions are useful for sealing discontinuities in a substrate surface, especially those found in motor vehicles. Sealant articles and methods of sealing discontinuities are also disclosed.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: June 24, 2003
    Assignee: 3M Innovative Properties Company
    Inventors: Stefan Weigl, Gertrud A. Klein, Shuichi Kitano, Kotaro Shinozaki, Tomohiro Koiwa, Kazuyoshi Shiozaki