Abstract: An SPR sensor cell is an SPR sensor cell including an optical waveguide to be brought into contact with a sample. The optical waveguide includes an under clad layer, a core layer provided in the under clad layer such that at least a part thereof is exposed from the under clad layer, and a metal particle layer covering the core layer exposed from the under clad layer to be brought into contact with the sample.

Abstract: Provided are an SPR sensor cell having very excellent detection sensitivity and an SPR sensor. The SPR sensor cell includes a detection unit and a sample mounting portion adjacent to the detection unit. The detection unit includes an under clad layer, a core layer provided so that at least a part thereof is adjacent to the under clad layer, and a metal layer covering the core layer. The core layer has a refractive index of 1.43 or less and an absorption coefficient of 9.5×10?2 (mm?1) or less.

Abstract: Provided are an SPR sensor cell having very excellent detection sensitivity and an SPR sensor. The SPR sensor cell includes: a detection unit; and a sample mounting portion adjacent to the detection unit. The detection unit includes an under clad layer, a core layer provided so that at least a part thereof is adjacent to the under clad layer, and a metal layer covering the core layer. The core layer contains 35 wt % or more of a halogen.

Abstract: An SPR sensor includes an SPR sensor cell. The SPR sensor cell includes an optical waveguide to be brought into contact with a sample. The optical waveguide includes an under clad layer, a core layer provided in the under clad layer such that at least a portion thereof is exposed from the under clad layer, a metal layer covering the core layer exposed from the under clad layer, and a cover layer to be brought into contact with a sample, the cover layer covering the metal layer. The water wettability of the cover layer is higher than water wettability of the metal layer.

Abstract: An SPR sensor cell is an SPR sensor cell including an optical waveguide to be brought into contact with a sample. The optical waveguide includes an under clad layer, a core layer provided in the under clad layer such that at least a part thereof is exposed from the under clad layer, and a metal particle layer covering the core layer exposed from the under clad layer to be brought into contact with the sample.

Abstract: To provide a polymer which selectively adsorbs an acidic water-soluble target substance, a polymer which has a specific recognition site for an acidic water-soluble target substance, a production process thereof, and an acidic water-soluble target substance-adsorbing agent. A polymer which selectively adsorbs at least one kind of an acidic water-soluble target substance, in which the polymer has a cross-linked structure formed through a two-step reaction including a Michael addition reaction of a polymer having an amino group and/or imino group with an unsaturated carbonyl cross-linker, and a subsequent radical polymerization.

Abstract: To provide a pressure-sensitive adhesive sheet used during processing articles such as semiconductor wafers and laminate sheet used for such a pressure-sensitive adhesive sheet, which does not contaminate or break the semiconductor wafers during the processing and can minimize the curl of the articles due to residual stress of the pressure-sensitive adhesive sheet, a multi-layer sheet includes a composite film containing a urethane polymer and a vinyl-based polymer as effective components and a first film made of a material different from that of the composite film, wherein the urethane polymer is formed from a polyolefin diol and a polyisocyanate. A pressure-sensitive adhesive sheet is obtained by providing a pressure-sensitive adhesive layer on at least one side of the multi-layer sheet.

Abstract: To provide a polymer which selectively adsorbs an acidic water-soluble target substance, a polymer which has a specific recognition site for an acidic water-soluble target substance, a production process thereof, and an acidic water-soluble target substance-adsorbing agent. A polymer which selectively adsorbs at least one kind of an acidic water-soluble target substance, in which the polymer has a cross-linked structure formed through a two-step reaction including a Michael addition reaction of a polymer having an amino group and/or imino group with an unsaturated carbonyl cross-linker, and a subsequent radical polymerization.

Abstract: To provide a pressure-sensitive adhesive that is used in processing an article such as a semiconductor wafer that causes neither contamination nor breakage of the semiconductor wafer during the processing, the pressure-sensitive adhesive sheet has a base, an intermediate layer, and a pressure-sensitive adhesive layer in order. The intermediate layer includes a composite film that contains an acrylic-based polymer and a vinyl-based polymer as active ingredients. The urethane polymer contains a component having a weight-average molecular weight of 10,000 or less in a differential molecular weight curve in a content of less than 10%.

Abstract: To provide a pressure-sensitive adhesive that is used in processing an article such as a semiconductor wafer, the pressure-sensitive adhesive sheet is one that has a base, an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an elastic modulus at elongation at 23° C. of 1 MPa or more and 100 MPa or less, the intermediate layer includes an acrylic polymer obtained by polymerization of a (meth) acrylic monomer mixture containing 1% by weight or more and 20% by weight or less of a nitrogen-containing acrylic monomer, the acrylic polymer containing 20% by weight or less of a polymer component having a molecular weight of 100,000 or less, and the base includes at least one film having an elastic modulus at in tension at 23° C. of 0.6 GPa or more.

Abstract: To provide a pressure-sensitive adhesive sheet, which is used in processing an article such as a semiconductor wafer, the pressure-sensitive adhesive sheet has a base, an intermediate layer and a pressure-sensitive adhesive layer in this order, wherein the intermediate layer has an elastic modulus in tension at 23° C. of 10 MPa or more and 100 Mpa or less, the intermediate layer includes an acrylic-based polymer obtained by polymerization of a mixture containing 70 to 99 parts by weight of a (meth)acrylate monomer and 1 to 30 parts by weight of an unsaturated carboxylic acid based on 100 parts by weight of total monomers, and the base includes at least one film having an elastic modulus in tension at 23° C. of 0.6 GPa or more.

Abstract: To provide a pressure-sensitive adhesive sheet for use in processing wafers and the like articles, that produces less cutting sludge of the pressure-sensitive adhesive sheet and that can follow up unevenness of a wafer even when a difference in height of the unevenness is large, the pressure-sensitive adhesive sheet includes a base having on one surface thereof an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an initial elastic modulus of 0.5 N/mm2 or less, a loss tangent (tan?) at 20° C. to 70° C. of 0.

Abstract: To provide a pressure-sensitive adhesive sheet used during processing articles such as semiconductor wafers and laminate sheet used for such a pressure-sensitive adhesive sheet, which does not contaminate or break the semiconductor wafers during the processing and can minimize the curl of the articles due to residual stress of the pressure-sensitive adhesive sheet, a multi-layer sheet includes a composite film containing a urethane polymer and a vinyl-based polymer as effective components and a first film made of a material different from that of the composite film, wherein the urethane polymer is formed from a polyolefin diol and a polyisocyanate. A pressure-sensitive adhesive sheet is obtained by providing a pressure-sensitive adhesive layer on at least one side of the multi-layer sheet.