Abstract: A semiconductor device according to an embodiment includes: an insulating substrate having a first metal layer and a second metal layer; a semiconductor chip on the first metal layer having an upper electrode and a lower electrode connected to the first metal layer; a bonding wire having a first end portion connected to the upper electrode and a second end portion connected to the second metal layer; a first resin layer covering the semiconductor chip and the bonding wire, the first resin layer containing a first resin; a second resin layer covering a bonding portion between the first end portion and the upper electrode containing a second resin having a Young's modulus higher than that of the first resin; a third resin layer on the first resin layer, the third resin layer containing a third resin having a moisture permeability lower than that of the first resin.

Abstract: A vehicle lighting device includes: a socket; a substrate, provided on a side of an end part of the socket; light-emitting elements, provided on the substrate; a frame part, having a frame shape, provided on the substrate, and surrounding the light-emitting elements; and a sealing part, provided on an inner side of the frame part and covering the light-emitting elements. When viewing from a direction along a central axis of the vehicle lighting device, a profile of the frame part is square or circular. If the profile of the frame part is square, a dimension of a side on the inner side of the frame part is 3.2 mm or more and 4.8 mm or less. If the profile of the frame part is circular, an inner diameter of the frame part is 4.5 mm or more and 6.8 mm or less.

Abstract: A vehicle lighting device includes a socket; a substrate; and one first and four second light emitting elements. A square luminance distribution region is defined on light irradiation sides of first and second light emitting elements. A center of distribution region overlaps central axis of device. Distribution region is equally divided into four square first regions whose corners overlap center of distribution region. Each of first regions is equally divided into nine square second regions. A length of one side of second region is 0.8 mm. Luminance of distribution region is 90% or more of a total luminance of light emitted from device. In twenty second regions arranged along sides of distribution region, luminance of one second region is 2% or less of total luminance. In sixteen second regions provided inside twenty second regions, luminance of one second region is 3% or more and 10% or less of total luminance.

Abstract: A vehicle lighting device includes a socket; a substrate; and one first and four second light emitting elements. A square luminance distribution region is defined on light irradiation sides of first and second light emitting elements. A center of distribution region overlaps central axis of device. Distribution region is equally divided into four square first regions whose corners overlap center of distribution region. Each of first regions is equally divided into nine square second regions. A length of one side of second region is 0.8 mm. Luminance of distribution region is 90% or more of a total luminance of light emitted from device. In twenty second regions arranged along sides of distribution region, luminance of one second region is 2% or less of total luminance. In sixteen second regions provided inside twenty second regions, luminance of one second region is 3% or more and 10% or less of total luminance.

Abstract: An earphone device includes a housing having a driver unit, and a sound guide tube mounted on a front surface of the housing to protrude from the front surface, in which the sound guide tube is disposed at a position deviated from a center position of the housing.

Abstract: A catalyst includes a carrier, and a metal obtained by reducing a metal ion supported on the carrier 1) in a supercritical state or 2) in a polar organic solvent, wherein the carrier is an inorganic porous body having a hierarchical porous structure. By employing the catalyst, it is possible to exhibit better catalytic activity than a conventional catalyst. Heat generation and spontaneous ignition are prevented because no organic porous body is used.

Abstract: A substrate treating method for performing a heat treatment of a substrate that has a treated film formed thereon in a heat treating space of a heat treating chamber. The method includes an exhaust step of exhausting gas within the heat treating space formed by a cover enclosing surroundings of a heat treating plate; an inert gas supply step of supplying inert gas from an upper portion of the heat treating space into the heat treating space and supplying inert gas into a gap between an outer peripheral surface of the heat treating plate and an inner wall of the cover; and a heat treating step of performing the heat treatment of the substrate in the heat treating space. The heat treating step is performed after the exhaust step and the inert gas supply step.

Abstract: An oxygen concentration is lowered in accordance with a set lowering process, and thereafter a heat treatment is performed. Accordingly, the heat treatment is performed to a substrate W while the oxygen concentration in a heat treating space HS is lowered. Consequently, a treatment atmosphere within the heat treating space is able to be made suitable for a heat treatment process, leading to appropriate film deposition. In addition, the oxygen concentration is lowered in accordance with a concentration level in recipes. This avoids an excessively lowered oxygen concentration, leading to prevention of reduced throughput.

Abstract: A device includes: a storage section which stores a solution containing an organic compound; a catalyst holding section to hold a solid catalyst; and a microwave irradiation mechanism which irradiates the solution passing through the catalyst holding section with a microwave, wherein the solid catalyst is a molded catalyst containing a noble metal supported on a carrier that has an average particle diameter larger than 100 ?m. A hydrogen production method includes irradiating a solution containing an organic compound, the solution passing through a catalyst holding section holding a solid catalyst, with a microwave, the solid catalyst being a molded catalyst containing a noble metal supported on a carrier that has an average particle diameter larger than 100 ?m. Both device and method do not require a high-temperature heat source, enable easy collection, replacement, of the catalyst, and can be used for production of hydrogen.

Abstract: Provided is a flexible container that can be easily opened. Provided is a flexible container for holding contents that includes an outer bag, an inner bag, a first binding member, and a lid. The outer bag includes a bottom surface portion in which a lower opening is formed. The inner bag is a tubular inner bag that is housed in the outer bag, configured to be filled with contents, and includes a discharge port portion. The discharge port portion forms a discharge path for discharging the contents and extends to a lower side of the bottom surface portion via the lower opening. The first binding member is tied around the discharge port portion to close the discharge path. The lid is attached to an outer side of the bottom surface portion to close the lower opening and cover the discharge port portion. The discharge port portion is narrowed to close the discharge path. The first binding member is tied around the discharge port portion to maintain a state in which the discharge port portion is narrowed.

Abstract: An oxygen concentration is lowered in accordance with a set lowering process, and thereafter a heat treatment is performed. Accordingly, the heat treatment is performed to a substrate W while the oxygen concentration in a heat treating space HS is lowered. Consequently, a treatment atmosphere within the heat treating space is able to be made suitable for a heat treatment process, leading to appropriate film deposition. In addition, the oxygen concentration is lowered in accordance with a concentration level in recipes. This avoids an excessively lowered oxygen concentration, leading to prevention of reduced throughput.

Abstract: Disclosed is a substrate treating method for performing a heat treatment of a substrate having a treated film formed thereon in a heat treating space of a heat treating chamber. The method includes an exhaust step of performing exhaust of gas within the heat treating space, an inert gas supply step of supplying inert gas into the heat treating space, and a heat treating step of performing the heat treatment of the substrate in the heat treating space.

Abstract: Disclosed is a substrate treating method for treating a substrate with a directed self-assembly material applied thereto. The substrate treating method includes a heating step and a cooling step. The heating step includes heating the substrate to perform phase separation of the directed self-assembly material by maintaining an interior of a treatment container in a non-oxidizing gas atmosphere and placing the substrate at a heating position. The cooling step includes cooling the substrate by maintaining the interior of the treatment container in the non-oxidizing gas atmosphere, placing the substrate at a cooling position further away from the heating unit than the heating position, supplying non-oxidizing gas into the treatment container, and exhausting gas within the treatment container.

Abstract: A vehicle luminaire may include: an attachment portion which includes a concave portion opening to one end face; a light-emitting module, which includes a substrate and at least one light-emitting element provided on the substrate, provided inside the concave portion; and a plurality of bayonets provided on an outer side surface of the attachment portion. When the attachment portion is viewed from a direction along a center axis of the attachment portion, the bayonets are provided at a predetermined interval. The attachment portion includes an opening portion provided in a region between the plurality of bayonets. An opening dimension of the opening portion is larger than a width dimension of each bayonet.

Abstract: Disclosed is a substrate treating method for performing a heat treatment of a substrate in a heat treating space. The method includes a loading step of loading the substrate on support pins, an exhaust step of exhausting gas within the heat treating space, an inert gas supply step of supplying inert gas into the heat treating space, an under-substrate space gas discharging step of discharging gas within an under-substrate space between the substrate and the top face of the heat treating plate, and a heat treating step of retracting the support pins into the heat treating plate, and performing the heat treatment of the substrate placed on the top face of the heat treating plate in the heat treating space.

Abstract: A vehicle luminaire according to an embodiment includes: an attachment portion which includes a concave portion opening to one end face; a light-emitting module which includes a substrate and at least one light-emitting element provided on the substrate and is provided inside the concave portion; and a plurality of bayonets which are provided on an outer side surface of the attachment portion. When the attachment portion is viewed from a direction along a center axis of the attachment portion, the plurality of bayonets are provided at a predetermined interval. The attachment portion includes an opening portion provided in a region between the plurality of bayonets. An opening dimension of the opening portion is larger than a width dimension of the bayonet.

Abstract: A substrate treating method for performing a heat treatment of a substrate that has a treated film formed thereon in a heat treating space of a heat treating chamber. The method includes an exhaust step of exhausting gas within the heat treating space formed by a cover enclosing surroundings of a heat treating plate; an inert gas supply step of supplying inert gas from an upper portion of the heat treating space into the heat treating space and supplying inert gas into a gap between an outer peripheral surface of the heat treating plate and an inner wall of the cover; and a heat treating step of performing the heat treatment of the substrate in the heat treating space. The heat treating step is performed after the exhaust step and the inert gas supply step.

Abstract: A catalyst includes a carrier, and a metal obtained by reducing a metal ion supported on the carrier 1) in a supercritical state or 2) in a polar organic solvent, wherein the carrier is an inorganic porous body having a hierarchical porous structure. By employing the catalyst, it is possible to exhibit better catalytic activity than a conventional catalyst. Heat generation and spontaneous ignition are prevented because no organic porous body is used.

Abstract: Disclosed is a substrate treating apparatus including a treatment container, a pin, a seal housing, a seal member, and an exhaust port. The treatment container includes an opening. The pin is disposed between an interior of the treatment container and an exterior of the treatment container through the opening, and is configured to reciprocate along an axis thereof. The seal housing is disposed in the exterior of the treatment container. The seal housing is in close contact with the treatment container around the opening, and accommodates a part of the pin. The seal member is in close contact with an inner peripheral surface of the seal housing, and in close contact with an outer peripheral surface of the pin so as to be slidable relative to the pin. The exhaust port is in connection with the seal housing in a communicated manner.