Abstract: A sheet laminator includes a sheet lamination device, a heater, and circuitry. The sheet lamination device performs a sheet laminating operation on an object by application of heat and pressure. The heater heats the sheet lamination device. The circuitry changes between a first mode in which the heater constantly heats the sheet lamination device while the sheet lamination device is turned on and a second mode in which the heater starts heating the sheet lamination device in response to a request of the sheet laminating operation and stops heating the sheet lamination device after a given time has elapsed from completion of the sheet laminating operation. The circuitry adjusts the given time in the second mode.

Abstract: A photocurable composition which has excellent storage stability and is cured rapidly in bonding an opaque material, and a product. The photocurable composition contains (A) a compound having an unsaturated double bond, (B) at least one compound selected from the group consisting of compounds represented by the general formulae (1), (2), and (3), and (C) a sensitizer. In the general formulae (1), (2), and (3), R1 to R3 are each independently a substituent containing at least one group selected from the group consisting of a nitro group, a cyano group, a hydroxy group, an acetyl group, a carbonyl group, a substituted or unsubstituted allyl group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkoxy group, an unsubstituted or substituted aryl group, an unsubstituted or substituted aryloxy group, a heterocyclic ring structure-containing group, and a group having a plurality of rings.

Abstract: Provided are a photocurable composition which has excellent storage stability and is cured rapidly in bonding an opaque material, and a product. The photocurable composition contains (A) a compound having an unsaturated double bond, (B) at least one compound selected from the group consisting of compounds represented by the general formulae (1), (2), and (3), and (C) a sensitizer. In the general formulae (1), (2), and (3), R1 to R3 are each independently a substituent containing at least one group selected from the group consisting of a nitro group, a cyano group, a hydroxy group, an acetyl group, a carbonyl group, a substituted or unsubstituted allyl group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkoxy group, an unsubstituted or substituted aryl group, an unsubstituted or substituted aryloxy group, a heterocyclic ring structure-containing group, and a group having a plurality of rings.

Abstract: Provided are a photocurable composition which has excellent storage stability and is cured rapidly in bonding an opaque material, and a product. The photocurable composition contains (A) a compound having an unsaturated double bond, (B) at least one compound selected from the group consisting of compounds represented by the general formulae (1), (2), and (3), and (C) a sensitizer. In the general formulae (1), (2), and (3), R1 to R3 are each independently a substituent containing at least one group selected from the group consisting of a nitro group, a cyano group, a hydroxy group, an acetyl group, a carbonyl group, a substituted or unsubstituted allyl group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkoxy group, an unsubstituted or substituted aryl group, an unsubstituted or substituted aryloxy group, a heterocyclic ring structure-containing group, and a group having a plurality of rings.

Abstract: Provided is a method of producing a pressure-sensitive adhesive containing a cured product of a curable composition containing a crosslinkable silicon group-containing organic polymer and an adhesion-imparting resin as a pressure-sensitive adhesive layer; curing of the curable composition does not proceed when heated during production, i.e., the curable composition has excellent stability when heated, and the crosslinking reaction of the curable composition proceeds by some sort of trigger. The pressure-sensitive adhesive contains, as a pressure-sensitive adhesive layer, a cured product of a curable composition containing (A) a crosslinkable silicon group-containing organic polymer, (B) an adhesion-imparting resin, (C) a Si—F bond-containing silicon compound, and (D) a photobase generator.

Abstract: Provided is a method of producing a pressure-sensitive adhesive containing a cured product of a curable composition containing a crosslinkable silicon group-containing organic polymer and an adhesion-imparting resin as a pressure-sensitive adhesive layer; curing of the curable composition does not proceed when heated during production, i.e., the curable composition has excellent stability when heated, and the crosslinking reaction of the curable composition proceeds by some sort of trigger. The pressure-sensitive adhesive contains, as a pressure-sensitive adhesive layer, a cured product of a curable composition containing (A) a crosslinkable silicon group-containing organic polymer, (B) an adhesion-imparting resin, (C) a Si—F bond-containing silicon compound, and (D) a photobase generator.