Patents by Inventor Tomohiro Mita

Tomohiro Mita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CIRCUIT BOARD, CONDUCTIVE FILM FORMING METHOD AND ADHESIVENESS IMPROVER
    Publication number: 20150021071
    Abstract: In a conductive film formed by photo sintering of a film composed of copper particulates, adhesiveness to a base material of the conductive film is improved. A circuit board includes a circuit including a conductive film, and a substrate. The circuit board further includes a resin layer between the substrate and the conductive film. The substrate is made of a non-thermoplastic base material. The resin layer contains a thermoplastic resin. The conductive film is formed by photo sintering of a film composed of copper particulates, and thus improving adhesiveness of the conductive film to the base material through the resin layer.
    Type: Application
    Filed: February 28, 2013
    Publication date: January 22, 2015
    Applicant: ISHIHARA CHEMICAL CO., LTD.
    Inventors: Yuichi Kawato, Tomohiro Mita, Yusuke Maeda, Tomio Kudo