Abstract: A method for manufacturing a semiconductor device includes: forming an insulating film on a surface of a semiconductor layer of a semiconductor substrate; forming a contact hole in the insulating film; forming a conductor material on the insulating film to be in contact with the semiconductor layer through the contact hole; and patterning the conductor material using an alignment key included in the conductor material.

Abstract: A package includes: a semiconductor element; a case having an opening and housing the semiconductor element; and a lid having a rectangular parallelepiped shape and occluding the opening of the case. In the package, the lid is joined to an end portion of the opening of the case, and includes a bent portion surrounded by a portion joining the lid to the case and extending along a longitudinal side of the lid.

Abstract: An inertial sensor includes oscillating-type angular velocity sensing element (32), IC (34) for processing signals supplied from angular velocity sensing element (32), capacitor (36) for processing signals, and package (38) for accommodating angular velocity sensing element (32), IC (34), capacitor (36). Element (32) and IC (34) are housed in package (38) via a vibration isolator, which is formed of TAB tape (46), plate (40) on which IC (34) is placed, where angular velocity sensing element (32) is layered on IC (34), and outer frame (44) placed outside and separately from plate (40) and yet coupled to plate (40) via wiring pattern (42).

Abstract: An inertial sensor includes oscillating-type angular velocity sensing element (32), IC (34) for processing signals supplied from angular velocity sensing element (32), capacitor (36) for processing signals, and package (38) for accommodating angular velocity sensing element (32), IC (34), capacitor (36). Element (32) and IC (34) are housed in package (38) via a vibration isolator, which is formed of TAB tape (46), plate (40) on which IC (34) is placed, where angular velocity sensing element (32) is layered on IC (34), and outer frame (44) placed outside and separately from plate (40) and yet coupled to plate (40) via wiring pattern (42).

Abstract: A package includes: a semiconductor element; a case having an opening and housing the semiconductor element; and a lid having a rectangular parallelepiped shape and occluding the opening of the case. In the package, the lid is joined to an end portion of the opening of the case, and includes: a bent portion formed in a more interior position on the lid than a joint portion corresponding to a longitudinal side and along the joint portion corresponding to the longitudinal side, in a top view, among sides of the lid which are joined to the case; and a flat portion not including a bent portion formed in a more interior position on the lid than a joint portion corresponding to a short side and along the joint portion corresponding to the short side, in the top view, among the sides of the lid which are joined to the case.

Abstract: A placing member is configured to be supported from an outside by a terminal electrically connected to a terminal electrode, and an X-axis-direction extended portion, a Y-axis-direction extended portion, and a Z-axis-direction extended portion are provided in the terminal. This configuration provides an angular velocity sensor, in which a problem such that Y-axis-direction and Z-axis-direction vibrations applied from the outside cannot be damped is eliminated, and all the vibrations in three axis directions can be damped.

Abstract: A placing member is configured to be supported from an outside by a terminal electrically connected to a terminal electrode, and an X-axis-direction extended portion, a Y-axis-direction extended portion, and a Z-axis-direction extended portion are provided in the terminal. This configuration provides an angular velocity sensor, in which a problem such that Y-axis-direction and Z-axis-direction vibrations applied from the outside cannot be damped is eliminated, and all the vibrations in three axis directions can be damped.

Abstract: A placing member is configured to be supported from an outside by a terminal electrically connected to a terminal electrode, and an X-axis-direction extended portion, a Y-axis-direction extended portion, and a Z-axis-direction extended portion are provided in the terminal. This configuration provides an angular velocity sensor, in which a problem such that Y-axis-direction and Z-axis-direction vibrations applied from the outside cannot be damped is eliminated, and all the vibrations in three axis directions can be damped.

Abstract: A placing member is configured to be supported from an outside by a terminal electrically connected to a terminal electrode, and an X-axis-direction extended portion, a Y-axis-direction extended portion, and a Z-axis-direction extended portion are provided in the terminal. This configuration provides an angular velocity sensor, in which a problem such that Y-axis-direction and Z-axis-direction vibrations applied from the outside cannot be damped is eliminated, and all the vibrations in three axis directions can be damped.

Abstract: An inertial sensor includes oscillating-type angular velocity sensing element (32), IC (34) for processing signals supplied from angular velocity sensing element (32), capacitor (36) for processing signals, and package (38) for accommodating angular velocity sensing element (32), IC (34), capacitor (36). Element (32) and IC (34) are housed in package (38) via a vibration isolator, which is formed of TAB tape (46), plate (40) on which IC (34) is placed, where angular velocity sensing element (32) is layered on IC (34), and outer frame (44) placed outside and separately from plate (40) and yet coupled to plate (40) via wiring pattern (42).

Abstract: An inertial sensor includes oscillating-type angular velocity sensing element (32), IC (34) for processing signals supplied from angular velocity sensing element (32), capacitor (36) for processing signals, and package (38) for accommodating angular velocity sensing element (32), IC (34), capacitor (36). Element (32) and IC (34) are housed in package (38) via a vibration isolator, which is formed of TAB tape (46), plate (40) on which IC (34) is placed, where angular velocity sensing element (32) is layered on IC (34), and outer frame (44) placed outside and separately from plate (40) and yet coupled to plate (40) via wiring pattern (42).

Abstract: An inertial sensor includes oscillating-type angular velocity sensing element, IC for processing signals supplied from angular velocity sensing element, capacitor for processing signals, and package for accommodating angular velocity sensing element, IC, capacitor. Element and IC are housed in package via a vibration isolator, which is formed of TAB tape, plate on which IC is placed, where angular velocity sensing element is layered on IC, and outer frame placed outside and separately from plate and yet coupled to plate via wiring pattern.

Abstract: An inertial sensor includes oscillating-type angular velocity sensing element (32), IC (34) for processing signals supplied from angular velocity sensing element (32), capacitor (36) for processing signals, and package (38) for accommodating angular velocity sensing element (32), IC (34), capacitor (36). Element (32) and IC (34) are housed in package (38) via a vibration isolator, which is formed of TAB tape (46), plate (40) on which IC (34) is placed, where angular velocity sensing element (32) is layered on IC (34), and outer frame (44) placed outside and separately from plate (40) and yet coupled to plate (40) via wiring pattern (42).

Abstract: The angular velocity sensor of the present invention has one end connected to holding section and the other end connected to weighting section. According to the angular velocity sensor, driving arm has a dog-leg structure of arms extending in a direction perpendicular to a connecting direction of holding section and weighting section.

Abstract: A placing member (80) is configured to be supported from an outside by a terminal (81) electrically connected to a terminal electrode, and an X-axis-direction extended portion (84), a Y-axis-direction extended portion (82), and a Z-axis-direction extended portion (83) are provided in the terminal (81). This configuration provides an angular velocity sensor, in which a problem such that Y-axis-direction and Z-axis-direction vibrations applied from the outside cannot be damped is eliminated, and all the vibrations in three axis directions can be damped.

Abstract: The angular velocity sensor of the present invention has one end connected to holding section and the other end connected to weighting section. According to the angular velocity sensor, driving arm has a dog-leg structure of arms extending in a direction perpendicular to a connecting direction of holding section and weighting section.

Abstract: An inertial sensor includes oscillating-type angular velocity sensing element, IC for processing signals supplied from angular velocity sensing element, capacitor for processing signals, and package for accommodating angular velocity sensing element, IC, capacitor. Element and IC are housed in package via a vibration isolator, which is formed of TAB tape, plate on which IC is placed, where angular velocity sensing element is layered on IC, and outer frame placed outside and separately from plate and yet coupled to plate via wiring pattern.

Abstract: An angular velocity sensor includes a tuning fork unit; a base block provided with a terminal for outputting an output signal from the tuning fork unit to the exterior; a cover for housing the tuning fork unit in a space defined by combination with the base block; a circuit board for fixing the terminal on the base block, the circuit board being provided with a processing circuit for processing the output signal from the tuning fork unit; and a casing for housing the base block, the cover, and the circuit board. The terminal on the base block is fixed to the circuit board, with a clearance being defined by the base block and the circuit board. The terminal on the base block in the clearance has a flexure portion, and the flexure portion absorbs a vibration of a high frequency applied from the exterior.

Abstract: A high-reliability complex sensor is protected against vibration and electromagnetic wave noise from outside. A shield case is provided with a power conjunction terminal, GND conjunction terminal, angular velocity conjunction terminal, X axis acceleration conjunction terminal and Y axis acceleration conjunction terminal. Both a power supply terminal of an angular velocity detection device and a power supply terminal of an acceleration detection device are electrically connected with a power connector terminal of a protection case, via the power conjunction terminal of the shield case. Both a GND terminal of the angular velocity detection device and a GND terminal of the acceleration detection device are electrically connected with a GND connector terminal of the protection case, via the GND conjunction terminal of the shield case. A circuit board is contained completely within the shield case.

Abstract: The An angular velocity sensor of the present invention has one end connected to a holding section and the other another end connected to a weighting section. According to the angular velocity sensor, a driving arm has a dog-leg bent structure of arms extending in a direction perpendicular to a connecting direction of the holding section and the weighting section.