Abstract: A semiconductor memory device includes a stacked body in which a first insulating layer and a first conductive layer are alternately stacked in a first direction. A columnar body includes a first insulating portion extending in the first direction in the stacked body, a first semiconductor portion provided between the first insulating portion and the stacked body, and a third insulating portion provided between a second insulating portion provided between the first semiconductor portion and the stacked body, and the second insulating portion and the stacked body, and has a first end and a second end opposite to the first end. A second conductive layer is provided on the stacked body and is electrically connected to the first semiconductor portion at the first end of the columnar body.

Abstract: A holding case has an intermediate packing member for only a card-type object. The intermediate packing member has a cavity for receiving the card-type object and holding mechanism for holding the card-type object. The holding mechanism has first and second claws which projects into the cavity. The second claw formed on a beam which is formed by forming a slit beside a base of the second claw. The beam bends in response to external force supplied from the outside, consequently projecting degree of the second claw into said cavity changes in response to the external force. An external casing member is based on ISO standards for a CD case.