Patents by Inventor Tomohiro Noda

Tomohiro Noda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190070820
    Abstract: A triangle sandwich packaging machine includes paired grips for holding vicinities of both sides of a bag mouth of a triangle sandwich packaging bag, a mover intermittently moving the paired grips in every one of packaging stations, and a spatula inserting mechanism for forming a crest on the triangle sandwich packaging bag held by the paired grips to shape an opening. Also provided is a triangle sandwich packaging method including a moving step of intermittently moving the paired grips holding the triangle sandwich packaging bag in every one of the packaging stations, an opening step of opening the triangle sandwich packaging bag into a sectorial shape and a spatula inserting step of forming a crest on the triangle sandwich packaging bag held by the paired grips to shape an opening and inserting a spatula for shaping the opening.
    Type: Application
    Filed: August 31, 2018
    Publication date: March 7, 2019
    Applicants: GENERAL PACKER CO., LTD., KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Tomohiro Noda, Tomoya Hyodo, Haruhiko Koike, Tomohiro Kamishio, Teruhisa Kitagawa, Koichi Kirihara
  • Publication number: 20180202063
    Abstract: A surface treatment system includes a surface treatment tank, a first guide rail and a second guide rail that extend at a position offset from a position over the upper opening of the surface treatment tank, and a plurality of transfer jigs that respectively hold a workpiece and are supported by the first guide rail and the second guide rail. The transfer jig includes a horizontal arm section, a first guide target section that is guided by the first guide rail, a second guide target section that is guided by the second guide rail, and a vertical arm section that is suspended from the horizontal arm section at a position between the first guide target section and the second guide target section, and holds the workpiece.
    Type: Application
    Filed: March 13, 2018
    Publication date: July 19, 2018
    Applicant: ALMEX PE INC.
    Inventors: Tomohiro NODA, Shigeyuki WATANABE, Katsumi ISHII
  • Publication number: 20160237588
    Abstract: A surface treatment system includes a surface treatment tank, a first guide rail and a second guide rail that extend at a position offset from a position over the upper opening of the surface treatment tank, and a plurality of transfer jigs that respectively hold a workpiece and are supported by the first guide rail and the second guide rail. The transfer jig includes a horizontal arm section, a first guide target section that is guided by the first guide rail, a second guide target section that is guided by the second guide rail, and a vertical arm section that is suspended from the horizontal arm section at a position between the first guide target section and the second guide target section, and holds the workpiece.
    Type: Application
    Filed: April 28, 2016
    Publication date: August 18, 2016
    Applicant: ALMEX PE INC.
    Inventors: Tomohiro NODA, Shigeyuki WATANABE, Katsumi ISHII
  • Patent number: 9346632
    Abstract: A surface treatment system includes a surface treatment tank, a first guide rail and a second guide rail that extend at a position offset from a position over the upper opening of the surface treatment tank, and a plurality of transfer jigs that respectively hold a workpiece and are supported by the first guide rail and the second guide rail. The transfer jig includes a horizontal arm section, a first guide target section that is guided by the first guide rail, a second guide target section that is guided by the second guide rail, and a vertical arm section that is suspended from the horizontal arm section at a position between the first guide target section and the second guide target section, and holds the workpiece.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: May 24, 2016
    Assignee: ALMEX PE INC.
    Inventors: Tomohiro Noda, Shigeyuki Watanabe, Katsumi Ishii
  • Patent number: 9165763
    Abstract: A substrate is rotated at a first rotation number (first step). The rotation of the substrate is decelerated to 1500 rpm that is a second rotation number and the substrate is rotated at the second rotation number for 0.5 seconds (second step). The rotation of the substrate is further decelerated to a third rotation number and the substrate is rotated at the third rotation number (third step). The rotation of the substrate is accelerated to a fourth rotation number and the substrate is rotated at the fourth rotation number (fourth step). A resist solution is continuously supplied to a center portion of the substrate from a middle of the first step to a middle of the third step.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: October 20, 2015
    Assignee: Tokyo Electron Limited
    Inventors: Katsunori Ichino, Koji Takayanagi, Tomohiro Noda
  • Patent number: 8940137
    Abstract: A continuous plating apparatus, when the number of the workpieces simultaneously transferred in the plating tank in a completely immersed state is N, (N+1) cathode relay members that extend in a workpiece transfer direction and (N+1) power supply units being provided outside the plating tank, anode terminals of the power supply units being connected to opposed anodes that are provided in the plating tank, cathode terminals of the power supply units being respectively connected to the cathode relay members so that power is supplied to each of the workpieces transferred in the plating tank from a corresponding power supply unit among the power supply units through a corresponding cathode relay member among the cathode relay members, and each of the power supply units being able to be controlled by constant current control when being transferred in the plating tank in a completely immersed state, by current gradual increase control when being carried into the plating tank in a partially immersed state, and by cu
    Type: Grant
    Filed: October 30, 2008
    Date of Patent: January 27, 2015
    Assignee: Almex Pe Inc.
    Inventors: Tomohiro Noda, Kazutoshi Akamatsu
  • Publication number: 20140083842
    Abstract: A serial plating system includes a plurality of nozzles that are disposed in a plating tank at a position opposite to a plurality of workpieces, and that discharge a plating solution toward the plurality of workpieces, and a plurality of anodes that are disposed in the plating tank at a position opposite to the plurality of workpieces that are serially transferred in the plating tank, one nozzle among the plurality of nozzles and at least one anode among the plurality of anodes being alternately and repeatedly disposed along a transfer direction in which the plurality of workpieces are serially transferred. The plurality of nozzles and the plurality of anodes may be disposed to overlap in a side view along the transfer direction.
    Type: Application
    Filed: September 25, 2012
    Publication date: March 27, 2014
    Inventors: Hitoshi USUDA, Tomohiro Noda
  • Publication number: 20130295777
    Abstract: A substrate is rotated at a first rotation number (first step). The rotation of the substrate is decelerated to 1500 rpm that is a second rotation number and the substrate is rotated at the second rotation number for 0.5 seconds (second step). The rotation of the substrate is further decelerated to a third rotation number and the substrate is rotated at the third rotation number (third step). The rotation of the substrate is accelerated to a fourth rotation number and the substrate is rotated at the fourth rotation number (fourth step). A resist solution is continuously supplied to a center portion of the substrate from a middle of the first step to a middle of the third step.
    Type: Application
    Filed: July 3, 2013
    Publication date: November 7, 2013
    Inventors: Katsunori ICHINO, Koji TAKAYANAGI, Tomohiro NODA
  • Patent number: 8518222
    Abstract: A continuous plating apparatus, when the number of the workpieces simultaneously transferred in the plating tank in a completely immersed state is N, (N+1) cathode relay members that extend in a workpiece transfer direction and (N+1) power supply units being provided outside the plating tank, anode terminals of the power supply units being connected to opposed anodes that are provided in the plating tank, cathode terminals of the power supply units being respectively connected to the cathode relay members so that power is supplied to each of the workpieces transferred in the plating tank from a corresponding power supply unit among the power supply units through a corresponding cathode relay member among the cathode relay members, and each of the power supply units being able to be controlled by constant current control when being transferred in the plating tank in a completely immersed state, by current gradual increase control when being carried into the plating tank in a partially immersed state, and by cu
    Type: Grant
    Filed: October 30, 2008
    Date of Patent: August 27, 2013
    Inventors: Tomohiro Noda, Kazutoshi Akamatsu
  • Patent number: 8501274
    Abstract: A substrate is rotated at a first rotation number (first step). The rotation of the substrate is decelerated to 1500 rpm that is a second rotation number and the substrate is rotated at the second rotation number for 0.5 seconds (second step). The rotation of the substrate is further decelerated to a third rotation number and the substrate is rotated at the third rotation number (third step). The rotation of the substrate is accelerated to a fourth rotation number and the substrate is rotated at the fourth rotation number (fourth step). A resist solution is continuously supplied to a center portion of the substrate from a middle of the first step to a middle of the third step.
    Type: Grant
    Filed: August 12, 2010
    Date of Patent: August 6, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Katsunori Ichino, Koji Takayanagi, Tomohiro Noda
  • Publication number: 20130081939
    Abstract: A serial plating system includes a plating tank that receives a plating solution, a plurality of workpieces that are serially transferred along a transfer path being simultaneously plated in the plating tank, a common cathode that is electrically connected to the plurality of workpieces via a plurality of transfer jigs that respectively hold the plurality of workpieces, a plurality of split anodes that are disposed in the plating tank so as to face the transfer path, and a plurality of power supplies that are respectively connected to a corresponding split anode among the plurality of split anodes and the common cathode, and independently control current supplied to the corresponding split anode among the plurality of split anodes.
    Type: Application
    Filed: September 25, 2012
    Publication date: April 4, 2013
    Applicant: ALMEX PE INC.
    Inventor: Tomohiro NODA
  • Publication number: 20130001073
    Abstract: A surface treatment system includes a surface treatment tank, a first guide rail and a second guide rail that extend at a position offset from a position over the upper opening of the surface treatment tank, and a plurality of transfer jigs that respectively hold a workpiece and are supported by the first guide rail and the second guide rail. The transfer jig includes a horizontal arm section, a first guide target section that is guided by the first guide rail, a second guide target section that is guided by the second guide rail, and a vertical arm section that is suspended from the horizontal arm section at a position between the first guide target section and the second guide target section, and holds the workpiece.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 3, 2013
    Applicant: ALMEX PE INC.
    Inventors: Tomohiro NODA, Shigeyuki WATANABE, Katsumi ISHII
  • Publication number: 20110052807
    Abstract: A substrate is rotated at a first rotation number (first step). The rotation of the substrate is decelerated to 1500 rpm that is a second rotation number and the substrate is rotated at the second rotation number for 0.5 seconds (second step). The rotation of the substrate is further decelerated to a third rotation number and the substrate is rotated at the third rotation number (third step). The rotation of the substrate is accelerated to a fourth rotation number and the substrate is rotated at the fourth rotation number (fourth step). A resist solution is continuously supplied to a center portion of the substrate from a middle of the first step to a middle of the third step.
    Type: Application
    Filed: August 12, 2010
    Publication date: March 3, 2011
    Applicant: Tokyo Electron Limited
    Inventors: Katsunori Ichino, Koji Takayanagi, Tomohiro Noda
  • Publication number: 20100151126
    Abstract: There are provided a substrate coating method and a substrate coating apparatus to achieve the uniformity of a coating-liquid film and the improvement of the yield by inhibiting the bubbles generated during the application of a coating liquid. Also, there are provided a substrate coating method and a substrate coating apparatus to achieve the effective availability of the coating liquid and the uniformity of the coating-liquid film. According to one example, a substrate coating method includes forming a liquid pool of deionized water by rotating the substrate at low speed of a first rotation speed and supplying deionized water to the center of the substrate, mixing the water-soluble coating liquid with the deionized water by supplying the coating liquid to the center of the substrate in a state where the substrate is rotated at the first rotation speed, and forming the coating-liquid film by rotating the substrate at a second rotation speed higher than the first rotation speed.
    Type: Application
    Filed: December 15, 2009
    Publication date: June 17, 2010
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Tomohiro ISEKI, Kentaro YOSHIHARA, Tomohiro NODA, Kousuke YOSHIHARA
  • Publication number: 20090114530
    Abstract: A continuous plating apparatus, when the number of the workpieces simultaneously transferred in the plating tank in a completely immersed state is N, (N+1) cathode relay members that extend in a workpiece transfer direction and (N+1) power supply units being provided outside the plating tank, anode terminals of the power supply units being connected to opposed anodes that are provided in the plating tank, cathode terminals of the power supply units being respectively connected to the cathode relay members so that power is supplied to each of the workpieces transferred in the plating tank from a corresponding power supply unit among the power supply units through a corresponding cathode relay member among the cathode relay members, and each of the power supply units being able to be controlled by constant current control when being transferred in the plating tank in a completely immersed state, by current gradual increase control when being carried into the plating tank in a partially immersed state, and by cu
    Type: Application
    Filed: October 30, 2008
    Publication date: May 7, 2009
    Inventors: Tomohiro Noda, Kazutoshi Akamatsu