Patents by Inventor Tomohiro Osawa

Tomohiro Osawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11904518
    Abstract: [Problem] The objective of the present invention is to provide a sheet expressing a good tactile sensation and a molded product thereof. [Solution] A sheet expressing a good tactile sensation and a molded product thereof are provided by configuring a thermoplastic resin sheet having a base layer and hairlike bodies arranged regularly on at least one surface thereof, wherein a continuous phase is formed without a structural boundary between the base layer and the hairlike bodies.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: February 20, 2024
    Assignee: Denka Company Limited
    Inventors: Junpei Fujiwara, Yasushi Hirokawa, Tomohiro Osawa
  • Publication number: 20220298602
    Abstract: A combustion ash handling method of handling combustion ash discharged from a combustion furnace that combusts a petroleum-based fuel includes: separating the combustion ash into a heavy component and a light component by a dry-type separation technique; feeding the light component to the combustion furnace as a fuel; and recovering the heavy component. A metal such as vanadium is separated and extracted from the heavy component of the combustion ash.
    Type: Application
    Filed: April 24, 2020
    Publication date: September 22, 2022
    Applicant: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Hiroyuki MORI, Seiji TABATA, Suguru YABARA, Tomohiro OSAWA
  • Publication number: 20190283301
    Abstract: [Problem] The objective of the present invention is to provide a sheet expressing a good tactile sensation and a molded product thereof. [Solution] A sheet expressing a good tactile sensation and a molded product thereof are provided by configuring a thermoplastic resin sheet having a base layer and hairlike bodies arranged regularly on at least one surface thereof, wherein a continuous phase is formed without a structural boundary between the base layer and the hairlike bodies.
    Type: Application
    Filed: July 20, 2017
    Publication date: September 19, 2019
    Applicant: Denka Company Limited
    Inventors: Junpei FUJIWARA, Yasushi HIROKAWA, Tomohiro OSAWA
  • Patent number: 10202506
    Abstract: Disclosed is an electronic component packaging sheet including a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet includes (A) 80,000 to 220,000 Mw of a styrene-conjugated diene block copolymer; (B) 200,000 to 400,000 Mw of a polystyrene resin; and (C) 150,000 to 210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer includes (D) an acrylic copolymer resin; and (E) a polythiophene type polymer, particularly a polythiophene type polymer/anionic polymer ion complex. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.
    Type: Grant
    Filed: October 6, 2011
    Date of Patent: February 12, 2019
    Assignee: DENKA COMPANY LIMITED
    Inventors: Junpei Fujiwara, Tomohiro Osawa, Masatoshi Kawata
  • Patent number: 10137660
    Abstract: Provided is a water-repellent, thermoplastic resin sheet provided with a textured layer having a microtexture on one surface side, and a water repellent layer formed with an approximately constant thickness on the aforementioned one surface side of the textured layer, wherein at least the surface region on the one surface side of the textured layer is a cross-linked material which maintains the microtexture even after heated drawing, and the water-repellent layer is formed from an olefin copolymer resin containing hydrophobic oxide particles. Also provided is a molded article, such as a molded container, formed by thermoforming the thermoplastic resin sheet.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: November 27, 2018
    Assignee: Denka Company Limited
    Inventors: Junpei Fujiwara, Tomohiro Osawa, Shogo Hoshino, Toshio Nagano, Atsushi Takei
  • Patent number: 9908311
    Abstract: Provided is a water-repellent, thermoplastic resin sheet including a textured layer which is formed from a polyethylene resin composition comprising a water repellent agent and which has a microscopic texture on one surface side, wherein at least the surface region of the textured layer is a cross-linked material which maintains the microscopic texture even after heated drawing. Also provided is a molded article, such as a molded container, formed by thermoforming the thermoplastic resin sheet.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: March 6, 2018
    Assignee: DENKA COMPANY LIMITED
    Inventors: Junpei Fujiwara, Atsushi Takei, Tomohiro Osawa
  • Publication number: 20150314554
    Abstract: Provided is a water-repellent, thermoplastic resin sheet provided with a textured layer having a microtexture on one surface side, and a water repellent layer formed with an approximately constant thickness on the aforementioned one surface side of the textured layer, wherein at least the surface region on the one surface side of the textured layer is a cross-linked material which maintains the microtexture even after heated drawing, and the water-repellent layer is formed from an olefin copolymer resin containing hydrophobic oxide particles. Also provided is a molded article, such as a molded container, formed by thermoforming the thermoplastic resin sheet.
    Type: Application
    Filed: July 18, 2013
    Publication date: November 5, 2015
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Junpei FUJIWARA, Tomohiro OSAWA, Shogo HOSHINO, Toshio NAGANO, Atsushi TAKEI
  • Publication number: 20150306852
    Abstract: Provided is a water-repellent, thermoplastic resin sheet including a textured layer which is formed from a polyethylene resin composition comprising a water repellent agent and which has a microscopic texture on one surface side, wherein at least the surface region of the textured layer is a cross-linked material which maintains the microscopic texture even after heated drawing. Also provided is a molded article, such as a molded container, formed by thermoforming the thermoplastic resin sheet.
    Type: Application
    Filed: July 18, 2013
    Publication date: October 29, 2015
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Junpei FUJIWARA, Atsushi TAKEI, Tomohiro OSAWA
  • Publication number: 20130209748
    Abstract: Disclosed is an electronic component packaging sheet including a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet includes 80,000 to 220,000 Mw of a styrene-conjugated diene block copolymer; 200,000 to 400,000 Mw of a polystyrene resin; and 150,000 to 210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer includes an acrylic copolymer resin; and carbon nanotubes. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.
    Type: Application
    Filed: October 6, 2011
    Publication date: August 15, 2013
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Junpei Fujiwara, Tomohiro Osawa, Masatoshi Kawata
  • Publication number: 20130189496
    Abstract: Disclosed is an electronic component packaging sheet including a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet includes (A) 80,000 to 220,000 Mw of a styrene-conjugated diene block copolymer; (B) 200,000 to 400,000 Mw of a polystyrene resin; and (C) 150,000 to 210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer includes (D) an acrylic copolymer resin; and (E) a polythiophene type polymer, particularly a polythiophene type polymer/anionic polymer ion complex. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.
    Type: Application
    Filed: October 6, 2011
    Publication date: July 25, 2013
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Junpei Fujiwara, Tomohiro Osawa, Masatoshi Kawata