Patents by Inventor Tomohiro Osawa
Tomohiro Osawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11904518Abstract: [Problem] The objective of the present invention is to provide a sheet expressing a good tactile sensation and a molded product thereof. [Solution] A sheet expressing a good tactile sensation and a molded product thereof are provided by configuring a thermoplastic resin sheet having a base layer and hairlike bodies arranged regularly on at least one surface thereof, wherein a continuous phase is formed without a structural boundary between the base layer and the hairlike bodies.Type: GrantFiled: July 20, 2017Date of Patent: February 20, 2024Assignee: Denka Company LimitedInventors: Junpei Fujiwara, Yasushi Hirokawa, Tomohiro Osawa
-
Publication number: 20220298602Abstract: A combustion ash handling method of handling combustion ash discharged from a combustion furnace that combusts a petroleum-based fuel includes: separating the combustion ash into a heavy component and a light component by a dry-type separation technique; feeding the light component to the combustion furnace as a fuel; and recovering the heavy component. A metal such as vanadium is separated and extracted from the heavy component of the combustion ash.Type: ApplicationFiled: April 24, 2020Publication date: September 22, 2022Applicant: KAWASAKI JUKOGYO KABUSHIKI KAISHAInventors: Hiroyuki MORI, Seiji TABATA, Suguru YABARA, Tomohiro OSAWA
-
Publication number: 20190283301Abstract: [Problem] The objective of the present invention is to provide a sheet expressing a good tactile sensation and a molded product thereof. [Solution] A sheet expressing a good tactile sensation and a molded product thereof are provided by configuring a thermoplastic resin sheet having a base layer and hairlike bodies arranged regularly on at least one surface thereof, wherein a continuous phase is formed without a structural boundary between the base layer and the hairlike bodies.Type: ApplicationFiled: July 20, 2017Publication date: September 19, 2019Applicant: Denka Company LimitedInventors: Junpei FUJIWARA, Yasushi HIROKAWA, Tomohiro OSAWA
-
Patent number: 10202506Abstract: Disclosed is an electronic component packaging sheet including a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet includes (A) 80,000 to 220,000 Mw of a styrene-conjugated diene block copolymer; (B) 200,000 to 400,000 Mw of a polystyrene resin; and (C) 150,000 to 210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer includes (D) an acrylic copolymer resin; and (E) a polythiophene type polymer, particularly a polythiophene type polymer/anionic polymer ion complex. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.Type: GrantFiled: October 6, 2011Date of Patent: February 12, 2019Assignee: DENKA COMPANY LIMITEDInventors: Junpei Fujiwara, Tomohiro Osawa, Masatoshi Kawata
-
Patent number: 10137660Abstract: Provided is a water-repellent, thermoplastic resin sheet provided with a textured layer having a microtexture on one surface side, and a water repellent layer formed with an approximately constant thickness on the aforementioned one surface side of the textured layer, wherein at least the surface region on the one surface side of the textured layer is a cross-linked material which maintains the microtexture even after heated drawing, and the water-repellent layer is formed from an olefin copolymer resin containing hydrophobic oxide particles. Also provided is a molded article, such as a molded container, formed by thermoforming the thermoplastic resin sheet.Type: GrantFiled: July 18, 2013Date of Patent: November 27, 2018Assignee: Denka Company LimitedInventors: Junpei Fujiwara, Tomohiro Osawa, Shogo Hoshino, Toshio Nagano, Atsushi Takei
-
Patent number: 9908311Abstract: Provided is a water-repellent, thermoplastic resin sheet including a textured layer which is formed from a polyethylene resin composition comprising a water repellent agent and which has a microscopic texture on one surface side, wherein at least the surface region of the textured layer is a cross-linked material which maintains the microscopic texture even after heated drawing. Also provided is a molded article, such as a molded container, formed by thermoforming the thermoplastic resin sheet.Type: GrantFiled: July 18, 2013Date of Patent: March 6, 2018Assignee: DENKA COMPANY LIMITEDInventors: Junpei Fujiwara, Atsushi Takei, Tomohiro Osawa
-
Publication number: 20150314554Abstract: Provided is a water-repellent, thermoplastic resin sheet provided with a textured layer having a microtexture on one surface side, and a water repellent layer formed with an approximately constant thickness on the aforementioned one surface side of the textured layer, wherein at least the surface region on the one surface side of the textured layer is a cross-linked material which maintains the microtexture even after heated drawing, and the water-repellent layer is formed from an olefin copolymer resin containing hydrophobic oxide particles. Also provided is a molded article, such as a molded container, formed by thermoforming the thermoplastic resin sheet.Type: ApplicationFiled: July 18, 2013Publication date: November 5, 2015Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Junpei FUJIWARA, Tomohiro OSAWA, Shogo HOSHINO, Toshio NAGANO, Atsushi TAKEI
-
Publication number: 20150306852Abstract: Provided is a water-repellent, thermoplastic resin sheet including a textured layer which is formed from a polyethylene resin composition comprising a water repellent agent and which has a microscopic texture on one surface side, wherein at least the surface region of the textured layer is a cross-linked material which maintains the microscopic texture even after heated drawing. Also provided is a molded article, such as a molded container, formed by thermoforming the thermoplastic resin sheet.Type: ApplicationFiled: July 18, 2013Publication date: October 29, 2015Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Junpei FUJIWARA, Atsushi TAKEI, Tomohiro OSAWA
-
Publication number: 20130209748Abstract: Disclosed is an electronic component packaging sheet including a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet includes 80,000 to 220,000 Mw of a styrene-conjugated diene block copolymer; 200,000 to 400,000 Mw of a polystyrene resin; and 150,000 to 210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer includes an acrylic copolymer resin; and carbon nanotubes. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.Type: ApplicationFiled: October 6, 2011Publication date: August 15, 2013Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Junpei Fujiwara, Tomohiro Osawa, Masatoshi Kawata
-
Publication number: 20130189496Abstract: Disclosed is an electronic component packaging sheet including a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet includes (A) 80,000 to 220,000 Mw of a styrene-conjugated diene block copolymer; (B) 200,000 to 400,000 Mw of a polystyrene resin; and (C) 150,000 to 210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer includes (D) an acrylic copolymer resin; and (E) a polythiophene type polymer, particularly a polythiophene type polymer/anionic polymer ion complex. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.Type: ApplicationFiled: October 6, 2011Publication date: July 25, 2013Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Junpei Fujiwara, Tomohiro Osawa, Masatoshi Kawata