Patents by Inventor Tomohiro Sampei

Tomohiro Sampei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10811566
    Abstract: A light emitting module according to an embodiment comprises: a first support member having a first opening part and a second opening part; a second support member disposed in the first opening part in the first support member; a third support member disposed in the second opening part in the first support member; a first lead electrode disposed above the second support member; a second lead electrode disposed on the first support member and/or above the second support member; a light emitting chip disposed above the second support member and electrically connected to the first and second lead electrodes; a control component disposed above the third support member; and a conductive layer disposed underneath the first, second and third support members, wherein the first support member comprises a resin material, the second support material comprises a ceramic material and the third support member comprises a metal material.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: October 20, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Tomohiro Sampei
  • Publication number: 20180294380
    Abstract: A light emitting module according to an embodiment comprises: a first support member having a first opening part and a second opening part; a second support member disposed in the first opening part in the first support member; a third support member disposed in the second opening part in the first support member; a first lead electrode disposed above the second support member; a second lead electrode disposed on the first support member and/or above the second support member; a light emitting chip disposed above the second support member and electrically connected to the first and second lead electrodes; a control component disposed above the third support member; and a conductive layer disposed underneath the first, second and third support members, wherein the first support member comprises a resin material, the second support material comprises a ceramic material and the third support member comprises a metal material.
    Type: Application
    Filed: September 29, 2016
    Publication date: October 11, 2018
    Applicant: LG INNOTEK CO., LTD.
    Inventor: Tomohiro SAMPEI
  • Patent number: 9893246
    Abstract: A lighting may include a substrate, a light emitting device disposed on the substrate, a wavelength conversion layer which is disposed on the light emitting device and converts a part of first light emitted from the light emitting device into second light having a wavelength different from that of the first light, and a resin which is disposed on the substrate and buries the light emitting device and at least a portion of the wavelength conversion layer. An area of the top surface of the wavelength conversion layer is greater than that of the bottom surface of the wavelength conversion layer. The side surface of the wavelength conversion layer is inclined at a predetermined angle with respect to the top surface or the bottom surface.
    Type: Grant
    Filed: May 11, 2015
    Date of Patent: February 13, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Shuhei Matsuda, Tomohiro Sampei