Patents by Inventor Tomohiro SHIBASAKI

Tomohiro SHIBASAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240367840
    Abstract: An information processing apparatus (10) communicably connected to a plurality of packaging apparatuses (20) via a network (40) includes a controller (13) and a memory (12). The controller (13) is configured to acquire manufacturing information, including packaging material information, content information, and packaging conditions, from the plurality of packaging apparatuses (20) for a product obtainable by using the packaging apparatus and packaging material to package content in the packaging material, store the manufacturing information in the memory (12) by associating the packaging conditions with the packaging material information and the content information, and generate, for a first packaging condition among the packaging conditions, a first setting value distribution corresponding to the packaging material information and the content information.
    Type: Application
    Filed: September 2, 2022
    Publication date: November 7, 2024
    Applicant: Taisei Lamick Co., Ltd.
    Inventor: Tomohiro SHIBASAKI
  • Patent number: 11267204
    Abstract: The present invention relates to a band-like joint tape for covering a butting portion formed by butting an end portion of a one packing film to an end portion of another packing film and connecting the respective end portions of these packing films to each other. The joint tape is comprised of a laminate film formed by adhering a joint layer to a support layer at a peelable state, and covered so as to face the joint portion to the butting portion and heat-sealed so that the joint layer is fused to the butting portion and the fused portion of the joint layer is peeled off from the support layer.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: March 8, 2022
    Assignee: TAISEI LAMICK CO., LTD.
    Inventors: Naoki Yokoyama, Naoya Hamada, Tomohiro Shibasaki
  • Publication number: 20200223151
    Abstract: The present invention relates to a band-like joint tape for covering a butting portion formed by butting an end portion of a one packing film to an end portion of another packing film and connecting the respective end portions of these packing films to each other. The joint tape is comprised of a laminate film formed by adhering a joint layer to a support layer at a peelable state, and covered so as to face the joint portion. to the butting portion and heat-sealed so that the joint layer is fused to the butting portion and the fused portion of the joint layer is peeled off from the support layer.
    Type: Application
    Filed: September 24, 2019
    Publication date: July 16, 2020
    Applicant: TAISEI LAMICK CO., LTD.
    Inventors: Naoki YOKOYAMA, Naoya HAMADA, Tomohiro SHIBASAKI