Patents by Inventor Tomohiro Shimada

Tomohiro Shimada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961971
    Abstract: Provided is a production method for an all-solid-state battery having a solid electrolyte layer between a positive electrode layer and a negative electrode layer, the production method including: coating or impregnating the positive electrode layer and/or the negative electrode layer with a solid electrolyte solution in which a boron hydride compound serving as the solid electrolyte has been dissolved in a solvent; and removing the solvent from the coated or impregnated solid electrolyte solution and causing the solid electrolyte to precipitate on the positive electrode layer and/or the negative electrode layer.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: April 16, 2024
    Assignees: MITSUBISHI GAS CHEMICAL COMPANY, INC., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Genki Nogami, Masahiro Shimada, Tomohiro Ito, Aki Katori, Keita Noguchi, Naoto Yamashita, Takashi Mukai, Masahiro Yanagida
  • Patent number: 11618504
    Abstract: There is provided a bracket which connects an apron reinforcement provided below a bonnet and an upper portion of a fender provided on an outward side, in a vehicle width direction, of the bonnet. The bracket comprises a fender fixing portion fixed to a flange portion of an upper end portion of the fender, a body portion extending downwardly from the fender fixing portion and positioned on the outward side of the apron reinforcement, and an apron-reinforcement fixing portion extending from an inward side, in the vehicle width direction, of the body portion toward the apron reinforcement and fixed to the apron reinforcement. The body portion is provided with a curved part which is configured to be curved outwardly in the vehicle width direction.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: April 4, 2023
    Assignee: MAZDA MOTOR CORPORATION
    Inventors: Kuniyoshi Tashiro, Shigeaki Watanabe, Ryuichi Takahashi, Masatoki Kito, Susumu Kuroda, Reiko Yoshiura, Tomohiro Shimada, Kazumichi Takeshige, Qiang Wang, Toshihiro Nakaza, Satoru Eguchi, Hayato Miyazaki
  • Patent number: 11385590
    Abstract: An image carrier unit, insertable into and removable from an apparatus housing, includes: an image carrier; a protection cover removable from and attachable to the image carrier and including a covering portion and a block, the covering portion covering an exposed portion of the image carrier, the block being disposed on a near side in an insertion-removal direction and protruding in a direction crossing the insertion-removal direction; and a surface opposing a far side of the block in the insertion-removal direction, wherein the block is pressed by a protrusion movable toward the apparatus housing.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: July 12, 2022
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Tomohiro Shimada, Yuta Hoshino
  • Publication number: 20210261194
    Abstract: There is provided a bracket which connects an apron reinforcement provided below a bonnet and an upper portion of a fender provided on an outward side, in a vehicle width direction, of the bonnet. The bracket comprises a fender fixing portion fixed to a flange portion of an upper end portion of the fender, a body portion extending downwardly from the fender fixing portion and positioned on the outward side of the apron reinforcement, and an apron-reinforcement fixing portion extending from an inward side, in the vehicle width direction, of the body portion toward the apron reinforcement and fixed to the apron reinforcement. The body portion is provided with a curved part which is configured to be curved outwardly in the vehicle width direction.
    Type: Application
    Filed: January 28, 2021
    Publication date: August 26, 2021
    Applicant: MAZDA MOTOR CORPORATION
    Inventors: Kuniyoshi TASHIRO, Shigeaki WATANABE, Ryuichi TAKAHASHI, Masatoki KITO, Susumu KURODA, Reiko YOSHIURA, Tomohiro SHIMADA, Kazumichi TAKESHIGE, Qiang WANG, Toshihiro NAKAZA, Satoru EGUCHI, Hayato MIYAZAKI
  • Patent number: 11084814
    Abstract: The purpose of the present invention is to provide a compound that has excellent CDK4/6 inhibitory activity. The present invention is a compound represented by formula (I) or a pharmaceutically acceptable salt of the compound.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: August 10, 2021
    Assignee: Teijin Pharma Limited
    Inventors: Tsuyoshi Mizuno, Tomohiro Shimada, Gen Unoki, Akinobu Maruyama, Kosuke Sasaki, Takuya Yokosaka, Hiroshi Takahashi, Kyohei Horie, Yuri Sakai
  • Publication number: 20200365474
    Abstract: The present invention relates to a sealing lid for a package containing an optical element. For the sealing lid, a translucent material such as glass that can transmit light such as visible light is used. The present invention includes a lid main body made of the translucent material. The lid main body includes a joining region having a frame shape corresponding to an outer circumferential shape of the lid main body. A plurality of pieces of brazing material made of a eutectic alloy are fused on the joining region of the lid main body. An arrangement state of the brazing material includes aligning spherical pieces of brazing material continuously to form a frame shape along the joining region.
    Type: Application
    Filed: February 12, 2019
    Publication date: November 19, 2020
    Applicant: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Hiroyuki KUSAMORI, Tomohiro SHIMADA, Takeshi IRIBE, Noriyuki KUDO, Katsunao TANAKA
  • Publication number: 20190367510
    Abstract: The purpose of the present invention is to provide a compound that has excellent CDK4/6 inhibitory activity. The present invention is a compound represented by formula (I) or a pharmaceutically acceptable salt of the compound.
    Type: Application
    Filed: November 27, 2017
    Publication date: December 5, 2019
    Applicant: Teijin Pharma Limited
    Inventors: Tsuyoshi MIZUNO, Tomohiro SHIMADA, Gen UNOKI, Akinobu MARUYAMA, Kosuke SASAKI, Takuya YOKOSAKA, Hiroshi TAKAHASHI, Kyohei HORIE, Yuri SAKAI
  • Patent number: 10124004
    Abstract: The purpose of the present invention is to provide a compound having an excellent CDK4/6 inhibiting activity. The present invention is a compound represented by general formula (I) or a pharmaceutically acceptable salt thereof.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: November 13, 2018
    Assignee: Teijin Pharma Limited
    Inventors: Tsuyoshi Mizuno, Tomohiro Shimada, Gen Unoki, Masaru Ebisawa, Susumu Takeuchi, Kunio Minamizono, Kosuke Sasaki, Takuya Yokosaka, Junji Igarashi, Akinobu Maruyama, Hiroshi Takahashi, Kyohei Horie, Yuri Sakai
  • Publication number: 20180161329
    Abstract: The purpose of the present invention is to provide a compound having an excellent CDK4/6 inhibiting activity. The present invention is a compound represented by general formula (I) or a pharmaceutically acceptable salt thereof.
    Type: Application
    Filed: May 27, 2016
    Publication date: June 14, 2018
    Applicant: Teijin Pharma Limited
    Inventors: Tsuyoshi MIZUNO, Tomohiro SHIMADA, Gen UNOKI, Masaru EBISAWA, Susumu TAKEUCHI, Kunio MINAMIZONO, Kosuke SASAKI, Takuya YOKOSAKA, Junji IGARASHI, Akinobu MARUYAMA, Hiroshi TAKAHASHI, Kyohei HORIE, Yuri SAKAI
  • Patent number: 9604317
    Abstract: A brazing material which can be melted at a suitable temperature at which damage is not given to a device inside a package upon sealing, and besides the brazing material is not remelted, e.g., upon mounting to a board, and which has a low temperature difference between a liquidus and a solidus. The brazing material is made of a Au—Ga—In ternary alloy, wherein weight concentrations of the elements lie within a region of a polygon with a point A (Au: 90%, Ga: 10%, In: 0%), a point B (Au: 70%, Ga: 30%, In: 0%), a point C (Au: 60%, Ga: 0%, In: 40%) and a point D (Au: 80%, Ga: 0%, In: 20%) as vertexes (excluding lines on which In and Ga become 0%), in a Au—Ga—In ternary phase diagram.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: March 28, 2017
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Hiroyasu Taniguchi, Tomohiro Shimada, Kenichi Miyazaki
  • Patent number: 9438020
    Abstract: It is aimed to improve soundproofing of a wiring module. The wiring module is provided with a sheet-shaped first soundproofing member; a wire harness which contains at least one wire and is disposed at least partially along one main surface of the first soundproofing member, and a second soundproofing member. The second soundproofing member is provided partially to one main surface of the first soundproofing member and holds the wire harness interposed between the first soundproofing member and the second soundproofing member.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: September 6, 2016
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Tomohiro Shimada, Tetsuya Sonoda, Isamu Hamamoto, Yusuke Kobayashi
  • Publication number: 20150380916
    Abstract: It is aimed to improve soundproofing of a wiring module. The wiring module is provided with a sheet-shaped first soundproofing member; a wire harness which contains at least one wire and is disposed at least partially along one main surface of the first soundproofing member, and a second soundproofing member. The second soundproofing member is provided partially to one main surface of the first soundproofing member and holds the wire harness interposed between the first soundproofing member and the second soundproofing member.
    Type: Application
    Filed: February 18, 2014
    Publication date: December 31, 2015
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Tomohiro SHIMADA, Tetsuya SONODA, Isamu HAMAMOTO, Yusuke KOBAYASHI
  • Publication number: 20140356226
    Abstract: A brazing material which can be melted at a suitable temperature at which damage is not given to a device inside a package upon sealing, and besides the brazing material is not remelted, e.g., upon mounting to a board, and which has a low temperature difference between a liquidus and a solidus. The brazing material is made of a Au—Ga—In ternary alloy, wherein weight concentrations of the elements lie within a region of a polygon with a point A (Au: 90%, Ga: 10%, In: 0%), a point B (Au: 70%, Ga: 30%, In: 0%), a point C (Au: 60%, Ga: 0%, In: 40%) and a point D (Au: 80%, Ga: 0%, In: 20%) as vertexes (excluding lines on which In and Ga become 0%), in a Au—Ga—In ternary phase diagram.
    Type: Application
    Filed: August 15, 2014
    Publication date: December 4, 2014
    Inventors: Hiroyasu Taniguchi, Tomohiro Shimada, Kenichi Miyazaki
  • Publication number: 20140131093
    Abstract: An attachment orientation of a fixating member is stabilized, and the fixating member is able to be attached in an accurate position in a case where a non-woven member is hot pressed around a wire harness main body to form a protective member. The wire harness includes a wire harness main body and a protective member. The protective member is formed by hot pressing a non-woven member in a state where the non-woven member covers at least a portion of the wire harness main body. A flat support surface is formed on at least a portion of an outer circumference of the protective member and at least one positioning surface is formed so as to be adjacent to the flat support surface in a direction orthogonal to an axis direction of the wire harness main body and so as to project further than the flat support surface.
    Type: Application
    Filed: October 2, 2013
    Publication date: May 15, 2014
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Takeshi SATO, Isamu HAMAMOTO, Tetsuya SONODA, Tomohiro SHIMADA
  • Publication number: 20110171851
    Abstract: An FFC 1 as a flat circuit body includes a plurality of flat-plate-shaped electrodes 41 arranged with gaps between them at an end of the FFC 1, and configured to contact terminal blades 321a of terminals 32 included in a mating connector. Further, the FFC 1 includes an electrode-insulating film 51 for covering positions which do not contact the terminal blades 321a on surfaces of the electrodes 41 when the electrodes 41 and the terminal blades 321a of the terminals 32 contact each other.
    Type: Application
    Filed: January 11, 2011
    Publication date: July 14, 2011
    Applicants: YAZAKI CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yuuya KISHIBATA, Tomohiro SHIMADA, Yasufumi SHIBATA, Takashi NOMURA
  • Publication number: 20110076183
    Abstract: A brazing material which can be melted at a suitable temperature at which damage is not given to a device inside a package upon sealing, and besides the brazing material is not remelted, e.g., upon mounting to a board, and which has a low temperature difference between a liquid and a solid. The brazing material is made of a Au—Ga—In ternary alloy, wherein weight concentrations of the elements lie within a region of a polygon with a point A (Au: 90%. Ga: 10%, In: 0%), a point B (Au: 70%, Ga: 30%, In: 0%), a point C (Au: 60%. Ga: 0%. In: 40%) and a point D (Au: 80%, Ga: 0%. In: 20%) as vertexes. excluding lines on which In and Ga become 0%, in a Au—Ga—In ternary phase diagram.
    Type: Application
    Filed: July 15, 2009
    Publication date: March 31, 2011
    Inventors: Hiroyasu Taniguchi, Tomohiro Shimada, Kenichi Miyazaki
  • Publication number: 20100006336
    Abstract: The present invention provides a lid or a case for a sealed package, which is provided with a frame-shaped soldering material on its face to be joined, wherein the frame-shaped soldering material is formed of aligned ball-shaped soldering materials having particle sizes of 10 to 300 ?m. This lid or case can be manufactured by the steps of: (1) forming a droplet from the soldering material in a molten state; (2) discharging the soldering material which has been formed into the droplet onto the face to be joined of the lid or the case to fix the ball-shaped soldering material on the face; and (3) repeating the steps (1) and (2).
    Type: Application
    Filed: May 9, 2008
    Publication date: January 14, 2010
    Inventors: Tomohiro Shimada, Kenichi Miyazaki
  • Publication number: 20070075046
    Abstract: This method for inhibiting damage due to arc between electrical contacts involves the spreading of a grease composed of from 70% by weight to 95% by weight of a base oil and from 5% by weight to 30% by weight of a thickening agent and additives over a pair of electrical contacts in a circuit which causes terminals to move relative to each other so that they are disconnected from each other, whereby damage on the contact area due to arc occurring when the electrical contacts are isolated from each other is inhibited. As the thickening agent there is preferably used an organic bentonite. As the base oil there is preferably sued an ester oil, glycol oil or poly-?-olefin. The base oil preferably has a low density to reduce arc energy.
    Type: Application
    Filed: September 15, 2006
    Publication date: April 5, 2007
    Inventors: Hisaya Nakamura, Masakazu Harada, Shiro Sakai, Takaya Kondo, Tomohiro Shimada
  • Patent number: 7104850
    Abstract: The present invention is to provide low insertion-force connector terminals. A self-assembled monolayer is deposited on the surface of the connector terminals. The deposited connector terminals do not require a special lever for adjusting contact pressure. The connector terminals are easily manufactured without cost-up and made small size. They do not increase contact resistance and they are easily connected to each other with low insertion force so that they are applied to the connectors of vehicles.
    Type: Grant
    Filed: August 15, 2005
    Date of Patent: September 12, 2006
    Assignee: Yazaki Corporation
    Inventors: Kyoko Suzuki, Minoru Ikeda, Tomohiro Shimada
  • Publication number: 20060040569
    Abstract: The present invention is to provide low insertion-force connector terminals. A self-assembled monolayer is deposited on the surface of the connector terminals. The deposited connector terminals do not require a special lever for adjusting contact pressure. The connector terminals are easily manufactured without cost-up and made small size. They do not increase contact resistance and they are easily connected to each other with low insertion force so that they are applied to the connectors of vehicles.
    Type: Application
    Filed: August 15, 2005
    Publication date: February 23, 2006
    Applicant: YAZAKI CORPORATION
    Inventors: Kyoko Suzuki, Minoru Ikeda, Tomohiro Shimada