Abstract: A porous liquid crystal polymer sheet and a wiring circuit board have excellent handleability and excellent low repulsive properties. The porous liquid crystal polymer sheet 1 has a porosity P of 20% or more and 90% or less. The porous liquid crystal polymer sheet 1 has a thickness T of 1 ?m or more and 240 ?m or less.

Abstract: A threadlike adhesive sticking apparatus of the present invention includes, a nozzle comprising a pressing unit configured to press a threadlike adhesive against an object, a nozzle displacement unit that is attached to the nozzle and is configured to displace the nozzle by being displaced in a pressing direction, and an absorption mechanism configured to absorb a displacement of the nozzle with respect to a displacement of the nozzle displacement unit in the pressing direction.

Abstract: A threadlike adhesive sticking apparatus of the present invention includes a nozzle having an inner wall surface defining a cylindrical internal space and a tip end having a tip end opening allowing the internal space to communicate with the outside at one end of the inner wall surface, and a plurality of portions of a peripheral portion surrounding the tip end opening at the tip end function as a pressing unit that presses a threadlike adhesive, which has been allowed to pass through the internal space and has been led out to the outside from the tip end opening, against an object.

Abstract: A threadlike adhesive sticking apparatus of the present invention is a threadlike adhesive sticking apparatus configured to press a threadlike adhesive wound in a roll shape together with a release liner against an object while feeding out the threadlike adhesive, and includes a pressing unit configured to press the threadlike adhesive debonded from the release liner against the object. A compression elastic modulus of the release liner is 1.5 MPa or less.

Abstract: A threadlike adhesive sticking apparatus of the present invention is an adhesive sticking apparatus that presses a threadlike adhesive wound around a winding body against an object while feeding out the threadlike adhesive, and includes an assist mechanism configured to apply an external force in a feeding direction to the threadlike adhesive fed out from the winding body, and a pressing unit configured to press the threadlike adhesive fed out from the winding body against the object.

Abstract: A porous liquid crystal polymer sheet and a wiring circuit board have excellent handleability and excellent low repulsive properties. The porous liquid crystal polymer sheet 1 has a porosity P of 20% or more and 90% or less. The porous liquid crystal polymer sheet 1 has a thickness T of 1 ?m or more and 240 ?m or less.

Abstract: Disclosed is a sealing member for solar cell panels, which comprises an elastic layer, an insulating resin film arranged on the elastic layer, and a first water-stopping adhesive layer arranged on the insulating resin film.

Abstract: Disclosed is a sealing member for solar cell panels, which comprises an elastic layer, an insulating resin film arranged on the elastic layer, and a first water-stopping adhesive layer arranged on the insulating resin film.

Abstract: The present invention relates to a light-reflecting member including a polyolefin resin foam as a light-reflecting layer, the polyolefin resin foam being obtained by foam molding a resin composition containing a polyolefin resin. According to the light-reflecting member of the invention, since it has the above-mentioned constitution, the light-reflecting member is excellent in light reflection, impact-absorbing property, and lightness in weight. Moreover, the process for producing a light-reflecting member of the invention can provide a light-reflecting member excellent in light reflection, impact-absorbing property, and lightness in weight by using a polyolefin resin foam.

Abstract: A composition for a polyolefin resin foam, which comprises a polymer component comprising a polyolefin resin, and at least one of a rubber and a thermoplastic olefin elastomer, and powdery particles, wherein said composition has a melt tension of at least 20 cN when measured in a range between a first temperature at a melting point of said composition and a second temperature that is 20 degrees Celsius higher than said first temperature.

Abstract: The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.

Abstract: A removable pressure-sensitive adhesive sheet is disclosed which, when used for fixing adherends thereto in work processing or the like, has such a degree of tackiness as not to peel off the adherends and which, after the work processing or the like, can be easily removed from the adherends without fouling them. The removable pressure-sensitive adhesive sheet comprises a pressure-sensitive adhesive layer constituted of a pressure-sensitive adhesive comprising a polymer in which the content of low-molecular components having a molecular weight of 105 or lower is 10% by weight or lower. The polymer constituting the pressure-sensitive adhesive may be an acrylic polymer obtained by polymerizing one or more monomers in liquid or supercritical carbon dioxide. The removable pressure-sensitive adhesive sheet can be used, e.g., as a pressure-sensitive adhesive sheet for semiconductor wafer processing.

Abstract: A process for producing a polymer foam, which comprises (I) a melting step of melting a thermoplastic resin composition by heating, (II) a gas feed step of quantitatively feeding an inert gas into the molten resin composition, (III) a kneading step of mixing and kneading the inert gas and the molten resin composition, (IV) a cooling step of cooling the kneaded material, and (V) a specific expansion step of expanding the cooled kneaded material.

Abstract: A composition for a polyolefin resin foam, which comprises a polymer component comprising a polyolefin resin, and at least one of a rubber and a thermoplastic olefin elastomer, and powdery particles, wherein said composition has a melt tension of at least 20 cN when measured in a range between a first temperature at a melting point of said composition and a second temperature that is 20 degrees Celsius higher than said first temperature.

Abstract: The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.

Abstract: The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.

Abstract: An acrylic pressure-sensitive adhesive comprising an acrylic polymer which has a weight average molecular weight of 1,200,000 or higher and in which the proportion of components having a molecular weight of 100,000 or lower is 10% by weight or lower based on the weight of the whole polymer. This acrylic pressure-sensitive adhesive is produced by continuously feeding a monomer component comprising at least one alkyl (meth)acrylate and carbon dioxide as a diluent to a reactor and radical-polymerizing the monomer component under the conditions of a temperature of from 50 to 100° C. and a residence time of longer than 60 minutes to 200 minutes.

Abstract: A removable pressure-sensitive adhesive sheet is disclosed which, when used for fixing adherends thereto in work processing or the like, has such a degree of tackiness as not to peel off the adherends and which, after the work processing or the like, can be easily removed from the adherends without fouling them. The removable pressure-sensitive adhesive sheet comprises a pressure-sensitive adhesive layer constituted of a pressure-sensitive adhesive comprising a polymer in which the content of low-molecular components having a molecular weight of 105 or lower is 10% by weight or lower. The polymer constituting the pressure-sensitive adhesive may be an acrylic polymer obtained by polymerizing one or more monomers in liquid or supercritical carbon dioxide. The removable pressure-sensitive adhesive sheet can be used, e.g., as a pressure-sensitive adhesive sheet for semiconductor wafer processing.

Abstract: A heat-resistant polymer foam is disclosed which has excellent heat resistance, a fine cellular structure, and a low apparent density. The heat-resistant polymer foam comprises a heat-resistant polymer having a glass transition point of 120° C. or higher, e.g., a polyimide or polyether imide, and has an average cell diameter of from 0.01 &mgr;m to less than 10 &mgr;m. This heat-resistant polymer foam can be produced by, for example, impregnating a heat-resistant polymer under pressure with an non-reactive gas such as carbon dioxide, which is in, e.g., a supercritical state, reducing the pressure, and then heating the polymer at a temperature exceeding 120° C. to foam the polymer.

Abstract: A finely foamed pressure-sensitive adhesive tape or sheet possessing a pressure-sensitive adhesive layer having a fine cell size and cell wall thickness is disclosed. The tape or sheet is obtained by impregnating the pressure-sensitive adhesive tape or sheet with carbon dioxide in a liquid state or a supercritical state, and reducing the pressure to foam the pressure-sensitive adhesive layer. The main component of the pressure-sensitive adhesive layer is, for example, an acrylic resin or a rubber-based resin. The method provides a finely foamed pressure-sensitive adhesive tape or resin possessing a pressure-sensitive adhesive layer having a fine cell structure such that an average cell size d is from 0.01 to 1000 &mgr;m, an average cell wall thickness t is from 0.01 to 2000 &mgr;m, and the ratio t/d is in the range of from 0.5 to 3.5.