Abstract: A method and assembly are provided for mounting a solid electrolytic capacitor onto a printed circuit board including an anode pad and a cathode pad. The capacitor includes a capacitor element which has an anode and a cathode electrically separated by a dielectric substance. The cathode includes an outer cathode terminal layer formed over the element. The method includes the steps of removing a part of the cathode terminal layer to expose a flat anode terminal surface, attaching the element to the printed circuit board for bringing the cathode terminal layer into electrical connection with the cathode pad, electrically connecting the flat anode terminal surface to the anode pad via a metal wire, and enclosing the element in a resin member for protection.

Abstract: An encapsulated solid electrolytic capacitor has an anode lead terminal, a cathode lead terminal, a capacitor element and a mold which is made of a synthetic resin material and encapsulates the capacitor element entirely. The capacitor element has an anode bar protruding longitudinally from a main body and is disposed between the anode lead terminal and the cathode lead terminal with the main body being electrically connected to the cathode lead terminal. The tip of the anode bar is welded to the anode lead terminal. The anode lead terminal has integrally formed with it a raised part which is L-shaped as seen longitudinally and is capable of having the anode bar inserted under its middle part, preventing it from becoming bent when it is soldered.