Patents by Inventor Tomohiro Yamagame

Tomohiro Yamagame has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11931829
    Abstract: A flux containing 0.1 to 20 wt % of 2-hydroxyisobutyric acid as an activator, 10 to 60 wt % of a cationic surfactant and 5 to 60 wt % of a nonionic surfactant. A solder paste contains a flux containing 0.1 to 20 wt % of 2-hydroxyisobutyric acid as an activator, 10 to 60 wt % of a cationic surfactant, and 5 to 60 wt % of a nonionic surfactant and a metal powder.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: March 19, 2024
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Tomohiro Yamagame, Yo Yamada
  • Publication number: 20230256547
    Abstract: A flux containing 0.1 to 20 wt % of 2-hydroxyisobutyric acid as an activator, 10 to 60 wt % of a cationic surfactant and 5 to 60 wt % of a nonionic surfactant. A solder paste contains a flux containing 0.1 to 20 wt % of 2-hydroxyisobutyric acid as an activator, 10 to 60 wt % of a cationic surfactant, and 5 to 60 wt % of a nonionic surfactant and a metal powder.
    Type: Application
    Filed: August 20, 2021
    Publication date: August 17, 2023
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Tomohiro YAMAGAME, Yo YAMADA
  • Publication number: 20170144258
    Abstract: Using flux to suppress increase in the viscosity of solder paste during its storage and also to improve the fusibility of a solder alloy. The flux, which contains an activator and a solvent, forms solder paste by being mixed with a granular solder alloy. The flux contains a monoalkyl propylene glycol-based solvent. It is preferable that the monoalkyl propylene glycol-based solvent is butyl propylene triglycol or butyl propylene diglycol. It is also preferable that the amount of monoalkyl propylene glycol-based solvent is equal to or more than 75 percent by mass but less than 100 percent by mass of the amount of all the solvents.
    Type: Application
    Filed: February 7, 2017
    Publication date: May 25, 2017
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Tomohiro Yamagame, Daisuke Minakuchi
  • Publication number: 20150059928
    Abstract: Provided is flux which is capable of suppressing increase in the viscosity of solder paste during its storage and is also capable of improving the fusibility of a solder alloy. In the flux which contains an activator and a solvent and forms solder paste by being mixed with a granular solder alloy, this flux contains a solvent of monoalkyl propylene glycol series. It is preferable that the solvent of monoalkyl propylene glycol series is butyl propylene triglycol or butyl propylene diglycol. It is also preferable that a contented amount of the solvent of monoalkyl propylene glycol series is equal to or more than 75% but equal to or less than 100% relative to a contented amount of all the solvents.
    Type: Application
    Filed: April 5, 2012
    Publication date: March 5, 2015
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Tomohiro Yamagame, Daisuke Minakuchi