Patents by Inventor Tomohiro Yokochi

Tomohiro Yokochi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6680441
    Abstract: A printed wiring board having an embedded electric device is manufactured as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second resin films, on which a plurality of conductive layers are formed. The first and second resin films and the sheet member include thermoplastic resin. An electric device is inserted in the opening or the recess. Then, the piled body including the electric device is pressed and heated to integrate the piled body. When the piled body is pressed and heated, a plurality of electrodes of the electric device are electrically connected to the conductive layers while the first and second resin films and the sheet member plastically deformed to seal the electric device.
    Type: Grant
    Filed: June 12, 2002
    Date of Patent: January 20, 2004
    Assignee: Denso Corporation
    Inventors: Koji Kondo, Tomohiro Yokochi, Toshihiro Miyake, Satoshi Takeuchi
  • Patent number: 6667443
    Abstract: Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor patterned film which has a conductor pattern formed only one side of a resin film and an opening formed in the resin film so as to expose an electrode is laminated on the single-sided conductor patterned films. Moreover, a cover layer with an opening to expose an electrode is laminated on a bottom surface of the single-sided conductor patterned films to form a laminate. Then, by pressing while heating the laminate, a multilayer substrate having the electrodes at both sides thereof can be produced.
    Type: Grant
    Filed: December 10, 2001
    Date of Patent: December 23, 2003
    Assignee: Denso Corporation
    Inventors: Koji Kondo, Tetsuaki Kamiya, Toshikazu Harada, Ryuichi Onoda, Yasutaka Kamiya, Gentaro Masuda, Yoshitaro Yazaki, Tomohiro Yokochi
  • Publication number: 20030209796
    Abstract: Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor patterned film which has a conductor pattern formed only one side of a resin film and an opening formed in the resin film so as to expose an electrode is laminated on the single-sided conductor patterned films. Moreover, a cover layer with an opening to expose an electrode is laminated on a bottom surface of the single-sided conductor patterned films to form a laminate. Then, by pressing while heating the laminate, a multilayer substrate having the electrodes at both sides thereof can be produced.
    Type: Application
    Filed: June 11, 2003
    Publication date: November 13, 2003
    Inventors: Koji Kondo, Tetsuaki Kamiya, Toshikazu Harada, Ryuichi Onoda, Yasutaka Kamiya, Gentaro Masuda, Yoshitaro Yazaki, Tomohiro Yokochi
  • Patent number: 6641898
    Abstract: A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: November 4, 2003
    Assignee: Denso Corporation
    Inventors: Yoshitaro Yazaki, Yoshihiko Shiraishi, Koji Kondo, Toshikazu Harada, Tomohiro Yokochi
  • Publication number: 20030173105
    Abstract: In a manufacturing method of a rigid-flexible printed circuit board, slits for defining two sides of a removing portion are formed in a part of plural resin films, and the plural resin films are stacked and bonded to form a circuit board. Then, a product portion is cut from the circuit board. Before the bonding, a separation sheet is disposed between predetermined adjacent layers of the plural resin films to separate the removing portion from a residual portion of the product portion. Accordingly, while the product portion is cut from the circuit board, the removing portion is separated from the product portion, because the removing portion are defined by the separation sheet, the slits, and a cutting outline of the product portion.
    Type: Application
    Filed: March 7, 2003
    Publication date: September 18, 2003
    Inventors: Koji Kondo, Satoshi Takeuchi, Tomohiro Yokochi, Katsumi Yamazaki, Masakazu Terada
  • Publication number: 20030098339
    Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.
    Type: Application
    Filed: January 13, 2003
    Publication date: May 29, 2003
    Inventors: Makoto Totani, Toshihiro Miyake, Tomohiro Yokochi, Takehito Teramae, Yoshitaro Yazaki, Kazuyuki Deguchi, Hajime Nakagawa
  • Patent number: 6527162
    Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.
    Type: Grant
    Filed: July 19, 2001
    Date of Patent: March 4, 2003
    Assignee: Denso Corporation
    Inventors: Makoto Totani, Toshihiro Miyake, Tomohiro Yokochi, Takehito Teramae, Yoshitaro Yazaki, Kazuyuki Deguchi, Hajime Nakagawa
  • Publication number: 20020192442
    Abstract: A printed wiring board having an embedded electric device is manufactured as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second resin films, on which a plurality of conductive layers are formed. The first and second resin films and the sheet member include thermoplastic resin. An electric device is inserted in the opening or the recess. Then, the piled body including the electric device is pressed and heated to integrate the piled body. When the piled body is pressed and heated, a plurality of electrodes of the electric device are electrically connected to the conductive layers while the first and second resin films and the sheet member plastically deformed to seal the electric device.
    Type: Application
    Filed: June 12, 2002
    Publication date: December 19, 2002
    Inventors: Koji Kondo, Tomohiro Yokochi, Toshihiro Miyake, Satoshi Takeuchi
  • Patent number: 6449836
    Abstract: In interconnecting printed circuit boards: preparing a first and second printed circuit board is accomplished with the first having an insulating substrate of thermoplastic resin and a conductive pattern with a land, while the second has a conductive pattern with a land; overlapping the land of the first with the land of the second is done to form an interconnection portion; and heating the interconnection portion at a temperature approximately higher than a glass transition temperature of the thermoplastic resin while applying pressure to the interconnection portion to create an electrical interconnection sealed with a part of the thermoplastic resin constituting the insulating substrate of the first board is accomplished. The insulating substrate of the first board is overlapped with an insulating substrate of the second printed board to interpose a film, the film including material to reduce a modulus of elasticity of the insulating substrate of the first board.
    Type: Grant
    Filed: July 26, 2000
    Date of Patent: September 17, 2002
    Assignee: Denso Corporation
    Inventors: Toshihiro Miyake, Katsuaki Kojima, Hiroyasu Iwama, Makoto Totani, Yoshitaro Yazaki, Takehito Teramae, Tomohiro Yokochi, Kenzo Hirano, Tomoyuki Nanami
  • Publication number: 20020086145
    Abstract: A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.
    Type: Application
    Filed: December 21, 2001
    Publication date: July 4, 2002
    Inventors: Yoshitaro Yazaki, Yoshihiko Shiraishi, Koji Kondo, Toshikazu Harada, Tomohiro Yokochi
  • Publication number: 20020079135
    Abstract: Conductive paste containing tin particles and silver particles is packed in a substantially cylindrical via hole formed in a thermoplastic resin film that interposes between conductor patterns and is hot-pressed from both sides. When the metal particles contained in the conductive paste are sintered to form a unified conductive compound, the volume of the conductive paste shrinks. Synchronously, the resin film around the via-hole protrudes into the via-hole. Therefore, the shape of the side wall on the cross-section of the conductive compound provides an arch shape, and a side wall adjacent to a junction part of the conductive compound, which contacts the conductor pattern, is formed with an inclination. Therefore, it is possible to prevent the stress concentration due to deformation of the board.
    Type: Application
    Filed: December 20, 2001
    Publication date: June 27, 2002
    Inventors: Yoshitarou Yazaki, Tomohiro Yokochi, Koji Kondo, Toshikazu Harada, Yoshihiko Shiraishi
  • Publication number: 20020076903
    Abstract: Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor patterned film which has a conductor pattern formed only one side of a resin film and an opening formed in the resin film so as to expose an electrode is laminated on the single-sided conductor patterned films. Moreover, a cover layer with an opening to expose an electrode is laminated on a bottom surface of the single-sided conductor patterned films to form a laminate. Then, by pressing while heating the laminate, a multilayer substrate having the electrodes at both sides thereof can be produced.
    Type: Application
    Filed: December 10, 2001
    Publication date: June 20, 2002
    Inventors: Koji Kondo, Tetsuaki Kamiya, Toshikazu Harada, Ryuichi Onoda, Yasutaka Kamiya, Gentaro Masuda, Yoshitaro Yazaki, Tomohiro Yokochi
  • Publication number: 20020014518
    Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.
    Type: Application
    Filed: July 19, 2001
    Publication date: February 7, 2002
    Inventors: Makoto Totani, Toshihiro Miyake, Tomohiro Yokochi, Takehito Teramae, Yoshitaro Yazaki, Kazuyuki Deguchi, Hajime Nakagawa