Abstract: A semiconductor laser diode module having high fabrication yields and high reliability is provided. A semiconductor laser chip is fixed on a substrate and a first lens and an optical isolator are disposed between the semiconductor laser chip and an optical fiber for receiving light emitted from the semiconductor laser chip. A lens holder fixed with the first lens and a housing fixed with the optical isolator are laser-welded and fixed to clamping parts of a lens holder retainer and an optical isolator retainer, respectively. Laser welding portions of the clamping parts of the lens holder retainer and the optical isolator retainer are formed to have a thickness thinner than that on the substrate side of the clamping parts and have almost the same thickness in the height direction. Curved surfaces, for example, which tilt in the direction thickening toward the lower side, are formed on the lower side thereof.

Abstract: The present invention provides a optical module comprising a semiconductor laser diode for outputting a laser beam; a first carrier on which the semiconductor laser diode is fixedly mounted; a photodiode for receiving a monitoring laser beam outputted from the back face of the semiconductor laser diode; a second carrier on which the photodiode is fixedly mounted; and a base on which the first and second carriers are fixedly mounted through soldering. At least one soldering sheet for soldering the first and second carriers on the base is fixedly pre-mounted on the base in place through spot welding.

Abstract: A semiconductor laser module for coupling optically light radiated from a semiconductor laser device to an optical fiber using a lens and an optical isolator and a process for manufacturing the same. A lens holder for holding the lens and the optical isolator are secured on a single and common securing member.

Abstract: The present invention provides a method of assembling an optical module in which a first carrier on which a semiconductor laser element is fixedly mounted and a second carrier on which a photodiode is fixedly mounted are fixedly soldered on a base. This method has a step of applying a solder onto the base; a step of placing the first and second carriers on the base; a step of heating the solder and photographing the heated solder; a step of detecting the fused state of the solder from the image data of the photographed solder; and a step of scrubbing the first or second carrier based on the detected state of the fused solder.

Abstract: The present invention provides a optical module comprising a semiconductor laser diode for outputting a laser beam; a first carrier on which the semiconductor laser diode is fixedly mounted; a photodiode for receiving a monitoring laser beam outputted from the back face of the semiconductor laser diode; a second carrier on which the photodiode is fixedly mounted; and a base on which the first and second carriers are fixedly mounted through soldering. At least one soldering sheet for soldering the first and second carriers on the base is fixedly pre-mounted on the base in place through spot welding.

Abstract: A semiconductor laser diode module having high fabrication yields and high reliability is provided. A semiconductor laser chip is fixed on a substrate and a first lens and an optical isolator are disposed between the semiconductor laser chip and an optical fiber for receiving light emitted from the semiconductor laser chip. A lens holder fixed with the first lens and a housing fixed with the optical isolator are laser-welded and fixed to clamping parts of a lens holder retainer and an optical isolator retainer, respectively. Laser welding portions of the clamping parts of the lens holder retainer and the optical isolator retainer are formed to have a thickness thinner than that on the substrate side of the clamping parts and have almost the same thickness in the height direction. Curved surfaces, for example, which tilt in the direction thickening toward the lower side, are formed on the lower side thereof.