Abstract: There is provided a novel substrate support pin installation jig used when installing a substrate support pin for supporting a circuit substrate. The substrate support pin installation jig (hereinafter, may be simply referred to as a jig) according to the present disclosure includes a main body configured to move relative to a support base, multiple pin accommodating portions provided in the main body, and a positioned portion used for positioning on the support base. The substrate support pin is accommodated and held in at least one of multiple pin accommodating portions in the jig. The jig is placed on the support base in a state where a relative position is specified by the positioned portion. By releasing holding of the substrate support pin, the substrate support pin is installed on the support base, and then the jig is removed.

Abstract: An electronic component mounting machine including a board clamp device configured to clamp a circuit board conveyed by a conveyor by sandwiching side edge sections of the circuit board between a clamp member from below and a conveyor rail from above by raising the clamp member, the electronic component mounting machine being configured to mount electronic components on the circuit board clamped by the board clamp device; and a control device configured to control a clamping force that is a sandwiching force on the side edge sections of the circuit board sandwiched between the clamp member and the conveyor rail of the board clamp device. The control device is configured to acquire board information including at least a weight of the circuit board and to control the clamping force of the board clamp device based on the acquired board information.

Abstract: A backup pin configured to support from below a circuit board can be one of a soft backup pin or a hard backup pin. The soft backup pin includes a soft pin portion formed of a soft elastic material and configured to support from below the circuit board and an engaging pin portion configured to be held in engagement and released from engagement by an engagement holding tool attached to a mounting head of the component mounter performing raising and lowering, as well as rotating operations, the soft pin portion and the engaging pin portion being provided side by side. The engaging pin portion is formed into a shape common to an engaging portion of the hard backup pin which is held in engagement by the engagement holding tool.

Abstract: An electronic component mounting machine including a board clamp device configured to clamp a circuit board conveyed by a conveyor by sandwiching side edge sections of the circuit board between a clamp member from below and a conveyor rail from above by raising the clamp member, the electronic component mounting machine being configured to mount electronic components on the circuit board clamped by the board clamp device; and a control device configured to control a clamping force that is a sandwiching force on the side edge sections of the circuit board sandwiched between the clamp member and the conveyor rail of the board clamp device. The control device is configured to acquire board information including at least a weight of the circuit board and to control the clamping force of the board clamp device based on the acquired board information.

Abstract: A component package tape is transported to a pitch feed mechanism section by a tape transport device and is held in a first tape holding section by a tape holding releasing device. Furthermore, a top tape adhered to a carrier tape that is transported to the pitch feed mechanism section is peeled from the carrier tape by a top tape peeling section while being clamped at a leading end section, is transferred to a top tape delivery mechanism section, and is held in a second tape holding section by the tape holding releasing device.

Abstract: A component package tape is transported to a pitch feed mechanism section by a tape transport device and is held in a first tape holding section by a tape holding releasing device. Furthermore, a top tape adhered to a carrier tape that is transported to the pitch feed mechanism section is peeled from the carrier tape by a top tape peeling section while being clamped at a leading end section, is transferred to a top tape delivery mechanism section, and is held in a second tape holding section by the tape holding releasing device.