Patents by Inventor Tomohisa Kida

Tomohisa Kida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer film, laminated film, and packaging
    Patent number: 11692086
    Abstract: The multilayer film of the present disclosure has at least a heat-sealing layer and a support layer formed on one side of the heat-sealing layer, wherein the first resin composition forming the heat-sealing layer comprises (a) high-density polyethylene, (b) a propylene random copolymer, and (c) a 1-butene polymer, wherein the content of the component (a) is 30 to 60% by mass, the content of the component (b) is 8 to 42% by mass, and the content of the component (c) is 16 to 56% by mass, wherein the component (a) has a melt flow rate of 10 to 30 g/10 minutes at 190° C., the component (b) has a melt flow rate of 8 to 20 g/10 minutes at 230° C., and the component (c) has a melt flow rate of 0.3 to 3 g/10 minutes at 190° C.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: July 4, 2023
    Assignee: DIC CORPORATION
    Inventors: Takashi Moriya, Tomohisa Kida
  • MULTILAYER FILM, LAMINATED FILM, AND PACKAGING
    Publication number: 20220243043
    Abstract: The multilayer film of the present disclosure has at least a heat-sealing layer and a support layer formed on one side of the heat-sealing layer, wherein the first resin composition forming the heat-sealing layer comprises (a) high-density polyethylene, (b) a propylene random copolymer, and (c) a 1-butene polymer, wherein the content of the component (a) is 30 to 60% by mass, the content of the component (b) is 8 to 42% by mass, and the content of the component (c) is 16 to 56% by mass, wherein the component (a) has a melt flow rate of 10 to 30 g/10 minutes at 190° C., the component (b) has a melt flow rate of 8 to 20 g/10 minutes at 230° C., and the component (c) has a melt flow rate of 0.3 to 3 g/10 minutes at 190° C.
    Type: Application
    Filed: July 7, 2020
    Publication date: August 4, 2022
    Applicant: DIC Corporation
    Inventors: Takashi Moriya, Tomohisa Kida