Abstract: A motor according to an embodiment includes a stator and a plurality of terminals. The stator includes a tubular shape, and includes a lead wire. The stator is provided with the plurality of terminals. The plurality of terminals are arranged in a circumferential direction. Furthermore, the plurality of terminals are integrally formed with a member including electrical conductivity, and a recessed portion is formed at an outer peripheral wall portion of the member including electrical conductivity in a rotational axis direction. Moreover, the lead wire passes through the recessed portion and is wound around an inner peripheral portion and an outer peripheral portion of the stator.

Abstract: According to an embodiment, a maintenance management device includes an acquirer configured to acquire a maintenance request for a vehicle, a manager configured to manage information about maintenance facilities where vehicle maintenance is possible, and a selector configured to select a maintenance facility for requesting the vehicle maintenance on the basis of information about a desired date of a user of the vehicle, a place, and maintenance content included in the maintenance request acquired by the acquirer and the information about the maintenance facilities.

Abstract: A method utilized at a sintered metal layer bonding a semiconductor element and a support substrate together suppresses cracks appearing in the sintered metal layer, and damage to the semiconductor element. A semiconductor device includes a support substrate, a semiconductor element, and a sintered metal layer bonding the support substrate and the semiconductor element. The sintered metal layer has a low porosity region disposed inward of an outer edge of the semiconductor element with the sintered metal layer bonded to the semiconductor element. The region is lower in porosity than the remaining sintered metal layer, and is formed as a wall-shaped structural body having an elongated string and extending from an upper surface to a lower surface of the sintered metal layer. The low porosity region is disposed to surround a region immediately below a center of the semiconductor element along the outer edge of the semiconductor element.

Abstract: A low-cost, durable silicon carbide member for a plasma processing apparatus. The silicon carbide member for a plasma processing apparatus can be obtained by processing a sintered body which is produced with a method in which metal impurity is reduced to more than 20 ppm and 70 ppm or less, and an ?-structure silicon carbide power having an average particle diameter of 0.3 to 3 ?m and including 50 ppm or less of an Al impurity is mixed with 0.5 to 5 weight parts of a B4C sintering aid, or with a sintering aid comprising Al2O3 and Y2O3 with total amount of 3 to 15 weight parts, and then a mixture of the ?-structure silicon carbide power with the sintering aid is sintered in an argon atmosphere furnace or a high-frequency induction heating furnace.

Abstract: A hybrid stepping motor has a connector housing formed integrally with an insulator having an upper insulator and a lower insulator. The hybrid stepping motor includes a stator core and output terminals concentrically disposed outside the stator core. A wiring pattern serving as the output terminals has connector pins and land portions disposed eccentrically with respect to one another. The land portions are formed on an outer edge side of the wiring pattern. A surface, which is an uppermost surface of the wiring pattern, is located below a lowermost surface, in which jumper wires and lead wires pass, of the lower insulator. The lead wires are pulled out from a lower side, and are pulled out to guiding grooves.

Abstract: A motor according to an embodiment includes a stator. The stator includes a plurality of connection cores. The connection core includes a plurality of pieces connected via connection portions. The plurality of pieces are arranged in a circular arc shape. The plurality of connection cores are arranged in an annular shape.

Abstract: A method utilized at a sintered metal layer bonding a semiconductor element and a support substrate together suppresses cracks appearing in the sintered metal layer, and damage to the semiconductor element. A semiconductor device includes a support substrate, a semiconductor element, and a sintered metal layer bonding the support substrate and the semiconductor element. The sintered metal layer has a low porosity region disposed inward of an outer edge of the semiconductor element with the sintered metal layer bonded to the semiconductor element. The region is lower in porosity than the remaining sintered metal layer, and is formed as a wall-shaped structural body having an elongated string and extending from an upper surface to a lower surface of the sintered metal layer. The low porosity region is disposed to surround a region immediately below a center of the semiconductor element along the outer edge of the semiconductor element.

Abstract: An electrostatic chuck can be manufactured at low cost and can securely prevent arcing even if the main body of the electrostatic chuck is thin. This electrostatic chuck is provided with an electrostatic chuck main body, an arcing prevention member, and a metal base member. The electrostatic chuck main body and the metal base member are provided with a plurality of vertical cooling gas holes. The arcing prevention member includes: a ceramic plate-shaped body through which a plurality of fine holes 20-100 ?m in diameter pass; and an exterior member that secures the ceramic plate-shaped body and is disposed in an upper part of the vertical cooling gas holes. The ceramic plate-shaped body is thicker than the electrostatic chuck main body.

Abstract: The purpose of the present invention is to provide a method for controlling pests, which is effective against a variety of pests, highly safe, simple, and environmentally friendly. Provided is a pest control method for exterminating a targeted pest by the exposing the eggs, larvae or pupae of the targeted pest to visible light having a specific wavelength within a wavelength region of 400 to 500 nm at a light intensity of 7×1017 photons·m?2·s?1 or greater.

Abstract: Provided is a semiconductor module enabling to effectively reduce, with a relatively simple structure, a thermal strain occurring in a bonding section between a semiconductor chip and other conductor members. The semiconductor module is characterized by being provided with: a first wiring layer; a semiconductor element bonded on the first wiring layer via a first bonding layer; a first electrode bonded on the semiconductor element via a second bonding layer; a second electrode connected on the first electrode; and a second wiring layer connected on the second electrode. The semiconductor module is also characterized in that: the width of the second electrode, said width being in the short-side direction, is more than the thickness of the first electrode; and the second electrode is disposed at a position off the center position of the semiconductor element.

Abstract: In an image processing system, an image processing apparatus configured to recognize images of documents is connected through a network to terminal apparatuses each including an input unit and a display unit. The image processing apparatus includes: a recognition unit configured to perform character recognition processing on an image; a confidential information detecting unit configured to detect confidential information from a result of the character recognition processing; and a manipulation unit configured to generate, based on the confidential information in the image, a first manipulated image obtained by fragmenting the confidential information. Each of the terminal apparatuses includes: a display unit configured to display the first manipulated image; and an input unit configured to input corrected data for the first manipulated image.

Abstract: A motor according to an embodiment includes a stator and a plurality of terminals. The stator includes a tubular shape, and includes a lead wire. The stator is provided with the plurality of terminals. The plurality of terminals are arranged in a circumferential direction. Furthermore, the plurality of terminals are integrally formed with a member including electrical conductivity, and a recessed portion is formed at an outer peripheral wall portion of the member including electrical conductivity in a rotational axis direction. Moreover, the lead wire passes through the recessed portion and is wound around an inner peripheral portion and an outer peripheral portion of the stator.

Abstract: According to an embodiment, a recognition device includes a detector, a recognizer, and a matcher. The detector is configured to detect a character candidate from an input image. The recognizer is configured to generate recognition candidate from the character candidate. The matcher is configured to match the recognition candidate with a knowledge dictionary and contains modeled character strings to be recognized, and generate a matching result obtained by matching a character string presumed to be included in the input image with the dictionary. Any one of a real character code that represents a character and a virtual character code that specifies a command is assigned to an edge. The matcher gives, when shifting a state of the dictionary in accordance with an edge to which the virtual character code is assigned, a command specified by the virtual character code assigned to the edge to a command processor.

Abstract: According to an embodiment, a creation device creates a code table including a plurality of code words. A recognition device identifies a code word represented by a code image based on a result of character recognition of the code image formed on an object, the code table, and a confusion matrix preliminarily created. The confusion matrix represents probabilities that characters are recognized when the recognition device performs character recognition on an image. The creation device includes a change unit, an evaluation value calculation unit, and a control unit. The change unit changes the code table. The evaluation value calculation unit calculates an evaluation value of the changed code table using the confusion matrix. The control unit causes the change of the code table and the calculation of the evaluation value to be repeated such that the evaluation value becomes small.

Abstract: According to an embodiment, a recognition device includes a candidate detection unit, a recognition unit, a matching unit, and a prohibition processing unit. The candidate detection unit detects, from an input image, character candidates each being a set of pixels estimated to include a character. The recognition unit recognizes each of the character candidates and generates one or more recognition candidates each being a character of a candidate as a recognition result. The matching unit matches each of the one or more recognition candidates with a knowledge dictionary in which a recognition target character string is modeled, and generates matching results obtained by matching a character string estimated to be included in the input image with the knowledge dictionary. The prohibition processing unit deletes, from the matching results, a matching result obtained by matching a character string including a prohibition target character string with the knowledge dictionary.

Abstract: A low-cost, durable silicon carbide member for a plasma processing apparatus. The silicon carbide member for a plasma processing apparatus can be obtained by processing a sintered body which is produced with a method in which metal impurity is reduced to more than 20 ppm and 70 ppm or less, and an ?-structure silicon carbide power having an average particle diameter of 0.3 to 3 ?m and including 50 ppm or less of an Al impurity is mixed with 0.5 to 5 weight parts of a B4C sintering aid, or with a sintering aid comprising Al2O3 and Y2O3 with total amount of 3 to 15 weight parts, and then a mixture of the ?-structure silicon carbide power with the sintering aid is sintered in an argon atmosphere furnace or a high-frequency induction heating furnace.

Abstract: Provided is a semiconductor module enabling to effectively reduce, with a relatively simple structure, a thermal strain occurring in a bonding section between a semiconductor chip and other conductor members. The semiconductor module is characterized by being provided with: a first wiring layer; a semiconductor element bonded on the first wiring layer via a first bonding layer; a first electrode bonded on the semiconductor element via a second bonding layer; a second electrode connected on the first electrode; and a second wiring layer connected on the second electrode. The semiconductor module is also characterized in that: the width of the second electrode, said width being in the short-side direction, is more than the thickness of the first electrode; and the second electrode is disposed at a position off the center position of the semiconductor element.

Abstract: A motor includes a rotational shaft, a bearing supporting the rotational shaft, a magnet including plural magnetic poles in a circumferential direction, a rotor core disposed inside the magnet, and a magnetic sensor. The magnet includes a projection portion projecting toward a side of the bearing with respect to the rotor core in a direction of the rotational shaft. The magnetic sensor is positioned between the rotor core and the bearing in the direction of the rotational shaft and is positioned inside an inner peripheral surface of the projection portion.

Abstract: A hybrid stepping motor has a connector housing formed integrally with an insulator having an upper insulator and a lower insulator. The hybrid stepping motor includes a stator core and output terminals concentrically disposed outside the stator core. A wiring pattern serving as the output terminals has connector pins and land portions disposed eccentrically with respect to one another. The land portions are formed on an outer edge side of the wiring pattern. A surface, which is an uppermost surface of the wiring pattern, is located below a lowermost surface, in which jumper wires and lead wires pass, of the lower insulator. The lead wires are pulled out from a lower side, and are pulled out to guiding grooves.