Patents by Inventor Tomohisa Yagi
Tomohisa Yagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160066421Abstract: A solder paste includes: solder particles containing Sn and Bi; an epoxy resin having two or more epoxy groups; an epoxy compound having one epoxy group; and a curing agent. And an electronic part includes: a wiring board provided with an electrode pad; a part mounted on the wiring board and provided with a plurality of electrodes; and a cured product of a solder paste configured to connect the plurality of electrodes and the electrode pad, wherein the solder paste includes: solder particles containing Sn and Bi; an epoxy resin having two or more epoxy groups; an epoxy compound having one epoxy group; and a curing agent.Type: ApplicationFiled: August 21, 2015Publication date: March 3, 2016Applicant: Fujitsu LimitedInventors: Kazuhiro Kitamura, Tomohisa YAGI, HIROAKI DATE, Yasuo Yamagishi
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Patent number: 8725378Abstract: A control system for a vehicle restricts engine torque when an accelerator operation amount is large and it is determined that the direction of the driver's face changed between forward and backward of the vehicle.Type: GrantFiled: July 23, 2012Date of Patent: May 13, 2014Assignee: Toyota Jidosha Kabushiki KaishaInventors: Taku Nakamura, Tomohisa Yagi
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Publication number: 20130030669Abstract: A control system for a vehicle restricts engine torque when an accelerator operation amount is large and it is determined that the direction of the driver's face changed between forward and backward of the vehicle.Type: ApplicationFiled: July 23, 2012Publication date: January 31, 2013Applicant: Toyota Jidosha Kabushiki KaishaInventors: Taku Nakamura, Tomohisa Yagi
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Patent number: 8152953Abstract: The first support body is pressed against the second support body in response to the softening of the adhesive sheet. The fillers are allowed to reliably contact with one another between the first electrically-conductive land and the second electrically-conductive land. The fillers melt after the adhesive sheet has been softened. The intermetallic compounds are formed between the fillers and the electrically-conductive lands and between the fillers. Electrical connection is in this manner established between the first electrically-conductive land and the second electrically-conductive land. The matrix material and the adhesive sheet are then cured. The first support body and the second support body are firmly bonded to each other.Type: GrantFiled: February 4, 2009Date of Patent: April 10, 2012Assignee: Fujitsu LimitedInventors: Hideaki Yoshimura, Takashi Nakagawa, Kenji Fukuzono, Takashi Kanda, Tomohisa Yagi
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Patent number: 7943001Abstract: A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.Type: GrantFiled: January 4, 2007Date of Patent: May 17, 2011Assignee: Fujitsu LimitedInventors: Takashi Nakagawa, Seiichi Sugano, Kenji Iida, Yasutomo Maehara, Hitoshi Suzuki, Kaoru Sugimoto, Kenji Fukuzono, Takashi Kanda, Hiroaki Date, Tomohisa Yagi
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Publication number: 20110100690Abstract: An electrically conductive body includes: a first electrically conductive material; a second electrically conductive material; and a bonding material bonding the first electrically conductive material to the second electrically conductive material at least for electric conduction. The bonding material is made of a metallic structure containing copper-tin based intermetallic compound phases and tin-bismuth phases, the copper-tin based intermetallic compound phases being continuous between the first electrically conductive material and the second electrically conductive material, the tin-bismuth phases being surrounded by the copper-tin based intermetallic compound phases.Type: ApplicationFiled: October 29, 2010Publication date: May 5, 2011Applicants: FUJITSU LIMITED, SANYO SPECIAL STEEL CO., LTD.Inventors: Hideaki Yoshimura, Kenji Fukuzono, Takashi Kanda, Tomohisa Yagi, Hiroki Ikeda, Katsu Yanagimoto
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Publication number: 20090294056Abstract: The first support body is pressed against the second support body in response to the softening of the adhesive sheet. The fillers are allowed to reliably contact with one another between the first electrically-conductive land and the second electrically-conductive land. The fillers melt after the adhesive sheet has been softened. The intermetallic compounds are formed between the fillers and the electrically-conductive lands and between the fillers. Electrical connection is in this manner established between the first electrically-conductive land and the second electrically-conductive land. The matrix material and the adhesive sheet are then cured. The first support body and the second support body are firmly bonded to each other.Type: ApplicationFiled: February 4, 2009Publication date: December 3, 2009Applicant: FUJITSU LIMITEDInventors: Hideaki YOSHIMURA, Takashi NAKAGAWA, Kenji FUKUZONO, Takashi KANDA, Tomohisa YAGI
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Publication number: 20090294160Abstract: A thermosetting resin sheet is sandwiched between first and second support bodies so that a first electrically-conductive land on the first support body is opposed to a second electrically-conductive land on the second support body in an opening formed in the sheet. The opening is filled with an electrically-conductive binder. The electrically-conductive binder includes matrix material containing a thermosetting resin and fillers including copper particles dispersed in the matrix material. The copper particles have the surface coated with a tin-bismuth alloy. When heat is applied to the electrically-conductive binder, the tin-bismuth alloy melts. The tin forms an intermetallic compound on the surface of the individual copper particle. The copper-tin alloy layers serve to unit the copper particles together. Electrical connection is established. The bismuth embeds the copper particles. The bismuth is hardened or cured. The matrix material is then hardened or cured.Type: ApplicationFiled: February 20, 2009Publication date: December 3, 2009Applicant: FUJITSU LIMITEDInventors: Hideaki YOSHIMURA, Tomohisa YAGI, Kenji FUKUZONO, Takashi KANDA
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Publication number: 20070289706Abstract: A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.Type: ApplicationFiled: January 4, 2007Publication date: December 20, 2007Applicant: FUJITSU LIMITEDInventors: Takashi Nakagawa, Seiichi Sugano, Kenji Iida, Yasutomo Maehara, Hitoshi Suzuki, Kaoru Sugimoto, Kenji Fukuzono, Takashi Kanda, Hiroaki Date, Tomohisa Yagi
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Publication number: 20050110169Abstract: According to a method of making a semiconductor device, a semiconductor chip is bonded to a substrate via bumps by flip-chip bonding. Then, a sealing adhesive composition is loaded between the semiconductor chip and the substrate to provide an adhesive sealing. The sealing adhesive composition, which is capable of hardening in two stages, contains at least a first main resin ingredient, a second main resin ingredient and a hardening agent. Then, the adhesive sealing is heated for primary hardening. Then, the substrate is placed on a mother board with a solder material interposed between the substrate and the mother board. Finally, the adhesive sealing is heated for secondary hardening while the solder material is reflowed for bonding the substrate to the mother board.Type: ApplicationFiled: December 23, 2004Publication date: May 26, 2005Applicant: FUJITSU LIMITEDInventors: Tomohisa Yagi, Nobuhiro Imaizumi, Yasuhiro Usui, Kenji Fukuzono
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Patent number: 6873056Abstract: A process of making an electrode-to-electrode bond structure includes a step of forming a resin coating on a first bonding object having a first electrode portion in a manner such that the resin coating covers the first electrode portion. Then, an opening is formed in the resin coating to expose the first electrode portion. Then, the opening is filled with a metal paste containing a metal and a resin component. Then, the first bonding object is placed on a second bonding object having a second electrode portion in a manner such that the metal paste filled in the opening faces the second electrode portion while the resin coating contacts the second bonding object. Finally, heat-treatment is performed to cause the first electrode portion and the second electrode portion to be electrically connected with each other via the metal while causing the resin coating to harden.Type: GrantFiled: November 12, 2003Date of Patent: March 29, 2005Assignee: Fujitsu LimitedInventors: Seiki Sakuyama, Nobuhiro Imaizumi, Tomohisa Yagi
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Patent number: 6869822Abstract: According to a method of making a semiconductor device, a semiconductor chip is bonded to a substrate via bumps by flip-chip bonding. Then, a sealing adhesive composition is loaded between the semiconductor chip and the substrate to provide an adhesive sealing. The sealing adhesive composition, which is capable of hardening in two stages, contains at least a first main resin ingredient, a second main resin ingredient and a hardening agent. Then, the adhesive sealing is heated for primary hardening. Then, the substrate is placed on a mother board with a solder material interposed between the substrate and the mother board. Finally, the adhesive sealing is heated for secondary hardening while the solder material is reflowed for bonding the substrate to the mother board.Type: GrantFiled: March 26, 2002Date of Patent: March 22, 2005Assignee: Fujitsu LimitedInventors: Tomohisa Yagi, Nobuhiro Imaizumi, Yasuhiro Usui, Kenji Fukuzono
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Publication number: 20050001014Abstract: The method of mounting an electronic part is capable of securely mounting the electronic part having fine solder bumps without excessively heating the part. The method of comprises the steps of: applying flux-fill, which acts as flux and under-filling resin, on a surface of a mount board, in which electrodes are formed; respectively connecting solder bums of the electronic part with the electrodes; and simultaneously filling a gap between the electronic part and the mount board with the flux-fill, wherein the solder bumps are made contact with the electrodes, and ultrasonic vibration energy is applied to contact portions of the solder bumps and the electrodes in the connecting step.Type: ApplicationFiled: April 5, 2004Publication date: January 6, 2005Applicant: FUJITSU LIMITEDInventors: Shuichi Takeuchi, Hidehiko Kira, Kenji Kobae, Norio Kainuma, Hiroshi Kobayashi, Takayoshi Matsumura, Shigeo Matsunuma, Tomohisa Yagi
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Patent number: 6790881Abstract: A single-liquid type adhesive composition contains a main agent, an imidazole serving as a hardener, and a hardening promoter for increased hardening speed. The imidazole has its surface covered by a thermoplastic resin, and the hardening promoter is provided by a modified imidazole composition with its imino group (—NH—) having the H replaced by a specific reaction retarder group.Type: GrantFiled: September 26, 2002Date of Patent: September 14, 2004Assignee: Fujitsu LimitedInventors: Hiroaki Date, Tomohisa Yagi, Makoto Sasaki, Hideshi Tokuhira, Nobuhiro Imaizumi
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Publication number: 20040106232Abstract: A process of making an electrode-to-electrode bond structure includes a step of forming a resin coating on a first bonding object having a first electrode portion in a manner such that the resin coating covers the first electrode portion. Then, an opening is formed in the resin coating to expose the first electrode portion. Then, the opening is filled with a metal paste containing a metal and a resin component. Then, the first bonding object is placed on a second bonding object having a second electrode portion in a manner such that the metal paste filled in the opening faces the second electrode portion while the resin coating contacts the second bonding object. Finally, heat-treatment is performed to cause the first electrode portion and the second electrode portion to be electrically connected with each other via the metal while causing the resin coating to harden.Type: ApplicationFiled: November 12, 2003Publication date: June 3, 2004Applicant: FUJITSU LIMITEDInventors: Seiki Sakuyama, Nobuhiro Imaizumi, Tomohisa Yagi
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Patent number: 6670264Abstract: A process of making an electrode-to-electrode bond structure includes a step of forming a resin coating on a first bonding object having a first electrode portion in a manner such that the resin coating covers the first electrode portion. Then, an opening is formed in the resin coating to expose the first electrode portion. Then, the opening is filled with a metal paste containing a metal and a resin component. Then, the first bonding object is placed on a second bonding object having a second electrode portion in a manner such that the metal paste filled in the opening faces the second electrode portion while the resin coating contacts the second bonding object. Finally, heat-treatment is performed to cause the first electrode portion and the second electrode portion to be electrically connected with each other via the metal while causing the resin coating to harden.Type: GrantFiled: April 18, 2002Date of Patent: December 30, 2003Assignee: Fujitsu LimitedInventors: Seiki Sakuyama, Nobuhiro Imaizumi, Tomohisa Yagi
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Publication number: 20030080397Abstract: A process of making an electrode-to-electrode bond structure includes a step of forming a resin coating on a first bonding object having a first electrode portion in a manner such that the resin coating covers the first electrode portion. Then, an opening is formed in the resin coating to expose the first electrode portion. Then, the opening is filled with a metal paste containing a metal and a resin component. Then, the first bonding object is placed on a second bonding object having a second electrode portion in a manner such that the metal paste filled in the opening faces the second electrode portion while the resin coating contacts the second bonding object. Finally, heat-treatment is performed to cause the first electrode portion and the second electrode portion to be electrically connected with each other via the metal while causing the resin coating to harden.Type: ApplicationFiled: April 18, 2002Publication date: May 1, 2003Applicant: Fujitsu LimitedInventors: Seiki Sakuyama, Nobuhiro Imaizumi, Tomohisa Yagi
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Publication number: 20030069333Abstract: A single-liquid type adhesive composition contains a main agent, an imidazole serving as a hardener, and a hardening promoter for increased hardening speed. The imidazole has its surface covered by a thermoplastic resin, and the hardening promoter is provided by a modified imidazole composition with its imino group (—NH—) having the H replaced by a specific reaction retarder group.Type: ApplicationFiled: September 26, 2002Publication date: April 10, 2003Applicant: FUJITSU LIMITEDInventors: Hiroaki Date, Tomohisa Yagi, Makoto Sasaki, Hideshi Tokuhira, Nobuhiro Imaizumi
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Publication number: 20030049888Abstract: According to a method of making a semiconductor device, a semiconductor chip is bonded to a substrate via bumps by flip-chip bonding. Then, a sealing adhesive composition is loaded between the semiconductor chip and the substrate to provide an adhesive sealing. The sealing adhesive composition, which is capable of hardening in two stages, contains at least a first main resin ingredient, a second main resin ingredient and a hardening agent. Then, the adhesive sealing is heated for primary hardening. Then, the substrate is placed on a mother board with a solder material interposed between the substrate and the mother board. Finally, the adhesive sealing is heated for secondary hardening while the solder material is reflowed for bonding the substrate to the mother board.Type: ApplicationFiled: March 26, 2002Publication date: March 13, 2003Applicant: Fujitsu LimitedInventors: Tomohisa Yagi, Nobuhiro Imaizumi, Yasuhiro Usui, Kenji Fukuzono