Abstract: Inside a first case outer frame portion as an outer frame of the first case, a plurality of first core pieces and a partition to separate a pair of adjacent first core pieces among the plurality of first core pieces are disposed. The first case has a shape capable of accommodating at least a part of the second core piece. The first case outer frame portion includes a first case accommodating portion as a portion of the first case outer frame portion that is capable of accommodating the plurality of first core pieces, and a first case cover portion to cover a space inside the first case accommodating portion.

Abstract: A laminate coil is formed by laminating a plurality of multilayer insulating members such that a first coil, a second coil, and a third coil each formed of a flat conductor are sandwiched between the plurality of multilayer insulating members. In the laminate coil, a through-hole is provided inside the coil in planar view. The plurality of multilayer insulating members adjacent to each other in a multilayer direction are bonded to each other at an inner end of the laminate coil positioned on the through-hole side, and an inside end of each of the first coil, the second coil, and the third coil is sealed by the multilayer insulating member.

Abstract: A first leg portion is arranged between a second leg portion and a third leg portion. A first conductive member includes a first winding wound around the first leg portion and a second winding connected in series to the first winding and wound around the second leg portion. A second conductive member includes a third winding wound around the first leg portion and a fourth winding connected in series to the third winding and wound around the third leg portion. The first leg portion includes a first core member provided with a plurality of gaps and constituted of core pieces and a plurality of first gap members each made of a non-magnetic body and arranged in respective ones of the plurality of gaps in the first core member. Thus, influence by induction heating of the winding can be lessened and a coil can be reduced in size.

Abstract: A core cooling structure includes a core and a housing. The core includes an upper core and a lower core. The core is attached to the housing. The upper core includes a heat dissipation fin that extends along a magnetic path and is disposed at an interval in a direction intersecting the magnetic path. The lower core is attached so as to be fitted into the housing.

Abstract: A laminated coil includes planar coils and a first insulating member. The planar coils are arranged in a first direction intersecting a first surface. The first insulating member is in a film form and arranged between a pair of planar coils adjacent to each other in the first direction. At least one of the planar coils is wound to have a plurality of turns spaced apart from each other in a second direction along the first surface. A second insulating member is arranged between the turns adjacent to each other in the second direction of at least one of the planar coils.

Abstract: A power conversion device includes an electronic component, a first printed board, a first cooling body, a second printed board, a second cooling body, a third printed board, and a third cooling body. The second cooling body extends from a second principal surface toward a first principal surface of the first printed board. The third cooling body extends from a second principal surface toward the first principal surface of the first printed board.

Abstract: A circuit device capable of significantly improving heat dissipation performance of a printed circuit board without increasing the size includes a printed circuit board, a mounted component, a non-solid metal spacer, a cooler, and a resin layer. The mounted component is at least partially disposed on at least one main surface of printed circuit board. The non-solid metal spacer is disposed at least on one main surface of the printed circuit board. The cooler is disposed at the non-solid metal spacer on the opposite side to the printed circuit board. The resin layer is disposed between the non-solid metal spacer and the cooler. The non-solid metal spacer has a shape that allows at least one hollow portion to be formed between the printed circuit board and the cooler.

Abstract: A coil device includes: a core having a first surface and a second surface located opposite to the first surface; a coil member including a first portion and a second portion that are spaced apart from each other in a first direction along the first surface; and a support portion in contact with the first surface and the second surface to support the core. The core includes a middle leg sandwiched between the first portion and the second portion in the first direction. The core is provided with a first slit as a first recessed portion recessed relative to the first surface and reaching the middle leg. The support portion includes a first protruding portion disposed inside the first slit and in contact with the middle leg.

Abstract: In a coil device of a power conversion device, a laminated coil includes planar coils laminated on a surface of a support. A plurality of cores are spaced apart from each other and aligned in a longitudinal direction of the planar coils, and each core includes a portion around which the laminated coil is wound on the surface of the support. A first protruding member (is arranged between a pair of cores adjacent to each other with respect to a longitudinal direction and is fixed to the support. A first fixing member is arranged above the first protruding member. The laminated coil is sandwiched and fixed between the first fixing member and the first protruding member such that a first surface is in contact with the first protruding member and a second surface is in contact with the first fixing member.

Abstract: A coil apparatus includes a coil unit including a coil, a base core that is a first core component, and a core module that is a second core component. The first core component includes a center leg that is a leg around which the coil is wound. The second core component includes a plurality of core segments arranged in a row with gaps between them. The second core component is connected to the leg to form a magnetic path together with the first core component.

Abstract: Inside a first case outer frame portion as an outer frame of the first case, a plurality of first core pieces and a partition to separate a pair of adjacent first core pieces among the plurality of first core pieces are disposed. The first case has a shape capable of accommodating at least a part of the second core piece. The first case outer frame portion includes a first case accommodating portion as a portion of the first case outer frame portion that is capable of accommodating the plurality of first core pieces, and a first case cover portion to cover a space inside the first case accommodating portion.

Abstract: A circuit device includes a core, a first circuit board, a second circuit board, a heat dissipation member, a first heat transfer member, and a second heat transfer member. The first circuit board includes a first coil pattern surrounding at least a part of the core. The second circuit board includes a second coil pattern surrounding at least a part of the core. The first heat transfer member is in surface contact with the first circuit board and the heat dissipation member. The second heat transfer member is in surface contact with the first circuit board and the second circuit board.

Abstract: The present invention has an object of providing a reactor including cores with higher heat dissipation and a coil with less eddy-current loss. A reactor according to the present invention includes: a plurality of divided cores having a shape obtained by dividing an annular core in a circumferential direction, the divided cores being made of a soft magnetic material; a core gap part disposed between the divided cores in the annular core formed by combining the plurality of divided cores, the core gap part being made of a non-magnetic material; annular heat-dissipating cases that house the divided cores and the core gap part; and a coil wound around the heat-dissipating cases, wherein the heat-dissipating cases are made of a material whose thermal conductivity is as high as 100 W/(m·K) or more.

Abstract: A circuit device capable of significantly improving heat dissipation performance of a printed circuit board without increasing the size includes a printed circuit board, a mounted component, a non-solid metal spacer, a cooler, and a resin layer. The mounted component is at least partially disposed on at least one main surface of printed circuit board. The non-solid metal spacer is disposed at least on one main surface of the printed circuit board. The cooler is disposed at the non-solid metal spacer on the opposite side to the printed circuit board. The resin layer is disposed between the non-solid metal spacer and the cooler. The non-solid metal spacer has a shape that allows at least one hollow portion to be formed between the printed circuit board and the cooler.

Abstract: A power conversion device that provides high heat dissipation and is easy to assemble. A power conversion device includes: a first heat dissipator; a second heat dissipator; a printed board having a first circuit pattern formed thereon; a first insulating member provided between first heat dissipator and printed board; a switching element including an electrode portion electrically bonded to first circuit pattern with a first bonding member interposed therebetween; a first fixing member bonded to an exposed surface of electrode portion; a heat dissipating member having one end bonded to first fixing member, and the other end provided between the switching element and second heat dissipator; a second insulating member sandwiched between second heat dissipator and switching element; and an installation portion.

Abstract: A power conversion device which converts power between a power grid and a DC power supply, includes: AC/DC converters for performing conversion from AC power to DC power or from DC power to AC power between the power grid and the DC power supply; a capacitor provided on the DC power supply side of the AC/DC converters and storing DC power; and a step-up unit for charging the capacitor.

Abstract: A power conversion device which converts power between a power grid and a DC power supply, includes: AC/DC converters for performing conversion from AC power to DC power or from DC power to AC power between the power grid and the DC power supply; a capacitor provided on the DC power supply side of the AC/DC converters and storing DC power; and a step-up unit for charging the capacitor.