Abstract: There is provided a holding unit that holds a target object by a holding surface of a holding table. The holding unit includes a fixing mechanism that fixes the target object to the holding surface, a movement mechanism that moves the fixing mechanism, and a controller. The fixing mechanism includes a fastening member allowed to be disposed at a fixing position at which the fastening member fastens the target object and fixes the target object to the holding surface and a release position at which the fastening member releases the target object and a biasing member that biases the fastening member toward the side of the fixing position. The movement mechanism includes a pressing member that presses the fastening member and an actuator that moves the pressing member to position the fastening member to the release position.

Abstract: An expanding apparatus includes a frame fixing part that fixes an annular frame of a workpiece unit, a holding table that holds a workpiece, an expanding unit that expands a sheet, a heating unit that heats the sheet between an outer circumferential side of the workpiece and an inner circumferential edge of the annular frame, and a cover that covers the workpiece held by the holding table. The cover covers the workpiece when the sheet is heated by the heating unit.

Abstract: A wafer dividing apparatus for dividing a wafer stuck to an adhesive tape and supported at an opening of a frame into individual chips along a scheduled division line is provided. The wafer dividing apparatus includes a cassette table movable upwardly and downwardly in a Z axis direction, a first carry-out/in unit that carries out the frame from the cassette placed on the cassette table or carry in the frame to the cassette, a first temporary receiving unit including a pair of first guide rails extending in the X axis direction and a guide rail opening/closing portion that increases the distance between the pair of first guide rails, a reversing unit including a holding portion that holds the frame and rotates by 180 degrees to reverse the front and back of the frame, and a transport unit that moves the reversed frame.

Abstract: A wafer dividing apparatus for dividing a wafer stuck to an adhesive tape and supported at an opening of a frame into individual chips along a scheduled division line is provided. The wafer dividing apparatus includes a cassette table movable upwardly and downwardly in a Z axis direction, a first carry-out/in unit that carries out the frame from the cassette placed on the cassette table or carry in the frame to the cassette, a first temporary receiving unit including a pair of first guide rails extending in the X axis direction and a guide rail opening/closing portion that increases the distance between the pair of first guide rails, a reversing unit including a holding portion that holds the frame and rotates by 180 degrees to reverse the front and back of the frame, and a transport unit that moves the reversed frame.