Abstract: The purpose of the present disclosure is to provide a method for manufacturing a polyimide (PI) precursor resin composition that has excellent resolution performance, a broad range of available exposure and good handling properties. Provided is a method for manufacturing a PI precursor resin composition that comprises a PI precursor resin, an exposure light absorber, a photopolymerization initiator and a solvent. The PI precursor resin is selected from among materials having an absorbance parameter Xp for a light species within a range of 0.001-0.20, the exposure light absorber is selected from among materials having an absorbance parameter Xt for the light species within a range of 0.01-0.05, and the photopolymerization initiator is selected from among materials having an absorbance parameter Xr for the light species within a range of 0-0.04.

Abstract: A method of producing a copper-clad laminate by laminating a copper foil on a polyimide layer, wherein the polyimide layer is produced by imidating a polyamide acid which is obtained by reacting one of an aromatic diacid anhydride and alicyclic diacid anhydride and one of an aliphatic diamine and alicyclic diamine, with an acid having a pKa of 3 to 5.

Abstract: A method of preparing a poly(amic acid) includes a step of reacting an aromatic diacid anhydride or alicyclic diacid anhydride, an aliphatic diamine or alicyclic diamine, and an acid having a pKa of 3 to 5. A method of preparing a polyimide by imidating the resulting poly(amic acid) is also disclosed.