Patents by Inventor Tomohito Sekine

Tomohito Sekine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220239296
    Abstract: A light, flexible, and tough thin film having high total light transmittance that can be formed on various three dimensional shapes, and also provides a stably driven tactile sensor, which is an electronic device having the switching function thereof, is provided. The tactile sensor is formed on a polyimide thin film having high total light transmittance, thermal resistance, and a polar component of surface free energy with a specific value, and has a switching device that emits a voltage signal which, through an electronic circuit for controlling noise, stably drives another device. This tactile sensor has a curved or flat surface and has a first electrode, a ferroelectric layer, and a second electrode formed over the polyimide thin film. The switching device as a tactile sensor can drive another device merely by a light touch with a finger, and can be manufactured at a high non-defective rate.
    Type: Application
    Filed: June 15, 2020
    Publication date: July 28, 2022
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Jun OKABE, Tadahiro SUNAGA, Shizuo TOKITO, Tomohito SEKINE
  • Publication number: 20210408367
    Abstract: A method for producing a ferroelectric polymer element includes: disposing one electrode on a substrate; applying polymer solution in which a polyvinylidene fluoride-based polymer is dissolved in a solvent including an aprotic polar solvent onto the one electrode by forme-based printing; firing the polymer solution to crystallize the polyvinylidene fluoride-based polymer, so that a ferroelectric layer is formed; and disposing the other electrode on the ferroelectric layer.
    Type: Application
    Filed: December 27, 2019
    Publication date: December 30, 2021
    Inventors: TOMOHITO SEKINE, TAKEO SHIBA, SHIZUO TOKITO
  • Patent number: 9773989
    Abstract: The metal thin film production method of the present invention includes, in the following order, the steps of: preparing a substrate (1) having thereon an underlayer (2) formed of an insulating resin; subjecting a surface of the underlayer (2) to a physical surface treatment for breaking bonds of organic molecules constituting the insulating resin; subjecting the substrate (1) to a heat treatment at a temperature of 200° C. or lower; applying a metal nanoparticle ink to the underlayer (2); and sintering metal nanoparticles contained in the metal nanoparticle ink at a temperature equal to or higher than a glass transition temperature of the underlayer (2). A fused layer (4) having a thickness of 100 nm or less is formed between the underlayer (2) and a metal thin film (3) formed by sintering the metal nanoparticles.
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: September 26, 2017
    Assignee: NATIONAL UNIVERSITY CORPORATION YAMAGATA UNIVERSITY
    Inventors: Daisuke Kumaki, Tomohito Sekine, Shizuo Tokito, Kenjiro Fukuda
  • Publication number: 20160372693
    Abstract: The metal thin film production method of the present invention includes, in the following order, the steps of: preparing a substrate (1) having thereon an underlayer (2) formed of an insulating resin; subjecting a surface of the underlayer (2) to a physical surface treatment for breaking bonds of organic molecules constituting the insulating resin; subjecting the substrate (1) to a heat treatment at a temperature of 200° C. or lower; applying a metal nanoparticle ink to the underlayer (2); and sintering metal nanoparticles contained in the metal nanoparticle ink at a temperature equal to or higher than a glass transition temperature of the underlayer (2). A fused layer (4) having a thickness of 100 nm or less is formed between the underlayer (2) and a metal thin film (3) formed by sintering the metal nanoparticles.
    Type: Application
    Filed: September 11, 2014
    Publication date: December 22, 2016
    Inventors: Daisuke Kumaki, Tomohito Sekine, Shizuo Tokito, Kenjiro Fukuda