Patents by Inventor Tomohito TANIUCHI

Tomohito TANIUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor inspection jig
    Patent number: 11016137
    Abstract: A semiconductor inspection jig includes: a jig body having a recessed part provided on a top surface of the jig body; a printed circuit board provided on the top surface of the jig body; a GND block provided in the recessed part and having first and second side faces opposite to each other; first and second blocks provided in the recessed part and sandwiching the GND block; a push-up part pushing up the GND block from a bottom surface of the recessed part; a first press part pressing the first block against the first side face of the GND block; and a second press part pressing the second block against the second side face of the GND block.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: May 25, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventor: Tomohito Taniuchi
  • Semiconductor inspection jig
    Patent number: 10895586
    Abstract: A semiconductor inspection jig includes: a base on which a semiconductor device is placed; and a substrate provided on the base and including a conductive pattern, wherein the conductive pattern intersects with a lead of the semiconductor device placed on the base from a direction other than a horizontal direction with respect to the lead, and is in contact with an intermediate part of the lead without being in contact with a leading end of the lead.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: January 19, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tetsuya Kitagawa, Masayuki Kubota, Motoyoshi Koyanagi, Tomohito Taniuchi, Daisuke Ikeda, Kazuhiro Sasano, Yuji Kobayashi
  • SEMICONDUCTOR INSPECTION JIG
    Publication number: 20190137561
    Abstract: A semiconductor inspection jig includes: a jig body having a recessed part provided on a top surface of the jig body; a printed circuit board provided on the top surface of the jig body; a GND block provided in the recessed part and having first and second side faces opposite to each other; first and second blocks provided in the recessed part and sandwiching the GND block; a push-up part pushing up the GND block from a bottom surface of the recessed part; a first press part pressing the first block against the first side face of the GND block; and a second press part pressing the second block against the second side face of the GND block.
    Type: Application
    Filed: May 3, 2018
    Publication date: May 9, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventor: Tomohito TANIUCHI
  • SEMICONDUCTOR INSPECTION JIG
    Publication number: 20180164344
    Abstract: A semiconductor inspection jig includes: a base on which a semiconductor device is placed; and a substrate provided on the base and including a conductive pattern, wherein the conductive pattern intersects with a lead of the semiconductor device placed on the base from a direction other than a horizontal direction with respect to the lead, and is in contact with an intermediate part of the lead without being in contact with a leading end of the lead.
    Type: Application
    Filed: August 17, 2017
    Publication date: June 14, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Tetsuya KITAGAWA, Masayuki KUBOTA, Motoyoshi KOYANAGI, Tomohito TANIUCHI, Daisuke IKEDA, Kazuhiro SASANO, Yuji KOBAYASHI