Patents by Inventor Tomoji Amanai

Tomoji Amanai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing semiconductor device
    Patent number: 8377751
    Abstract: A semiconductor device manufacturing method prevents the occurrence of a short-circuit between leads caused by peeling-off of residual resin formed on lead side faces or lead lower portions. A laser beam is radiated a plurality of times from a main surface side of leads and also a plurality of times from a back surface side of the leads to intra-dam resin formed in a dam portion, the dam portion being enclosed with adjacent leads, a dam bar and a sealing body, thereby removing all the intra-dam resin formed on lead side faces and lead lower portions. The laser beam radiation of the intra-dam resin may leave behind a sealing body-side resin portion and a projecting resin portion which projects outwardly from the sealing body.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: February 19, 2013
    Assignee: Renesas Electronics Corporation
    Inventors: Tomoji Amanai, Toshiyuki Okabe
  • Method for Manufacturing Semiconductor Device
    Publication number: 20110198739
    Abstract: A semiconductor device manufacturing method prevents the occurrence of a short-circuit between leads caused by peeling-off of residual resin formed on lead side faces or lead lower portions. A laser beam is radiated a plurality of times from a main surface side of leads and also a plurality of times from a back surface side of the leads to intra-dam resin formed in a dam portion, the dam portion being enclosed with adjacent leads, a dam bar and a sealing body, thereby removing all the intra-dam resin formed on lead side faces and lead lower portions. The laser beam radiation of the intra-dam resin may leave behind a sealing body-side resin portion and a projecting resin portion which projects outwardly from the sealing body.
    Type: Application
    Filed: February 10, 2011
    Publication date: August 18, 2011
    Applicant: Renesas Electronics Corporation
    Inventors: Tomoji Amanai, Toshiyuki Okabe