Abstract: A method of writing data into a semiconductor memory (11) in which nonvolatile memory cells (MC) each having a gate connected to a word line (WL) are connected in series, the method comprising selecting (S13) a scrambling method for the data according to a word line address for memory cells (MC) into which data is to be written, scrambling (S14) the data, and writing (S15) the scrambled data into the memory cells (MC) according to the word line address. The data is scrambled using the selected scrambling method.

Abstract: A semiconductor memory device includes first memory cell transistors, a memory block, and word lines. Each of the first memory cell transistors has a stacked gate including a charge accumulation layer and a control gate and is capable of holding M bits (M?2i, where i is a natural number and M is a natural number greater than or equal to 3) of data. The memory block includes the first memory cell transistors and is erase unit of the data. The data held in the first memory cell transistors included in the memory block is erased simultaneously. The size of data the memory block is capable of holding is L bits (L=2k, where k is a natural number). The word lines connect in common the control gates of the first memory cell transistors.

Abstract: A method for controlling a semiconductor storage device including memory cells each configured to hold data of 2 bits or more, the method includes starting first signal processing, and inputting lower bits into the semiconductor storage device in a ready state, writing the lower bits to the memory cells, changing the semiconductor storage device from the ready state into a busy state, changing the semiconductor storage device from the busy state into the ready state, and finishing the first signal processing, starting second signal processing, and inputting upper bits into the semiconductor storage device in the ready state, and writing the upper bits to the memory cells. A period for the writing the upper bits is longer than a period for the writing the lower bits. A period for performing the second signal processing is longer than a period for performing the first signal processing.

Abstract: A semiconductor memory has a plurality of blocks, and each of the blocks comprises a plurality of pages, and further, each of the pages has a plurality of memory cells. A block having defective bits less than N (N is an integer number more than 0) in all pages of the block stores a first data showing a normal block. A block including at least one page having defective bits more than N and including no page having defective bits more than M (M is an integer number of M>N) stores a second data showing a psedo-pass block as a pseudo-normal block. A block including at least one page having defective bits more than M stores a third data showing a defective block.

Abstract: A semiconductor memory device includes first memory cell transistors, a memory block, and word lines. Each of the first memory cell transistors has a stacked gate including a charge accumulation layer and a control gate and is capable of holding M bits (M?2i, where i is a natural number and M is a natural number greater than or equal to 3) of data. The memory block includes the first memory cell transistors and is erase unit of the data. The data held in the first memory cell transistors included in the memory block is erased simultaneously. The size of data the memory block is capable of holding is L bits (L=2k, where k is a natural number). The word lines connect in common the control gates of the first memory cell transistors.

Abstract: A semiconductor memory device includes first memory cell transistors, a memory block, and word lines. Each of the first memory cell transistors has a stacked gate including a charge accumulation layer and a control gate and is capable of holding M bits (M?2i, where i is a natural number and M is a natural number greater than or equal to 3) of data. The memory block includes the first memory cell transistors and is erase unit of the data. The data held in the first memory cell transistors included in the memory block is erased simultaneously. The size of data the memory block is capable of holding is L bits (L=2k, where k is a natural number). The word lines connect in common the control gates of the first memory cell transistors.

Abstract: A semiconductor memory has a plurality of blocks, and each of the blocks comprises a plurality of pages, and further, each of the pages has a plurality of memory cells. A block having defective bits less than N (N is an integer number more than 0) in all pages of the block stores a first data showing a normal block. A block including at least one page having defective bits more than N and including no page having defective bits more than M (M is an integer number of M>N) stores a second data showing a psedo-pass block as a pseudo-normal block. A block including at least one page having defective bits more than M stores a third data showing a defective block.

Abstract: A method of writing data into a semiconductor memory (11) in which nonvolatile memory cells (MC) each having a gate connected to a word line (WL) are connected in series, the method comprising selecting (S13) a scrambling method for the data according to a word line address for memory cells (MC) into which data is to be written, scrambling (S14) the data, and writing (S15) the scrambled data into the memory cells (MC) according to the word line address. The data is scrambled using the selected scrambling method.

Abstract: A method for controlling a semiconductor storage device including memory cells each configured to hold data of 2 bits or more, the method includes starting first signal processing, and inputting lower bits into the semiconductor storage device in a ready state, writing the lower bits to the memory cells, changing the semiconductor storage device from the ready state into a busy state, changing the semiconductor storage device from the busy state into the ready state, and finishing the first signal processing, starting second signal processing, and inputting upper bits into the semiconductor storage device in the ready state, and writing the upper bits to the memory cells. A period for the writing the upper bits is longer than a period for the writing the lower bits. A period for performing the second signal processing is longer than a period for performing the first signal processing.

Abstract: A method for controlling a semiconductor storage device including memory cells each configured to hold data of 2 bits or more, the method includes starting first signal processing, and inputting lower bits into the semiconductor storage device in a ready state, writing the lower bits to the memory cells, changing the semiconductor storage device from the ready state into a busy state, changing the semiconductor storage device from the busy state into the ready state, and finishing the first signal processing, starting second signal processing, and inputting upper bits into the semiconductor storage device in the ready state, and writing the upper bits to the memory cells. A period for the writing the upper bits is longer than a period for the writing the lower bits. A period for performing the second signal processing is longer than a period for performing the first signal processing.

Abstract: A semiconductor memory device includes first memory cell transistors, a memory block, and word lines. Each of the first memory cell transistors has a stacked gate including a charge accumulation layer and a control gate and is capable of holding M bits (M?2i, where i is a natural number and M is a natural number greater than or equal to 3) of data. The memory block includes the first memory cell transistors and is erase unit of the data. The data held in the first memory cell transistors included in the memory block is erased simultaneously. The size of data the memory block is capable of holding is L bits (L=2k, where k is a natural number). The word lines connect in common the control gates of the first memory cell transistors.

Abstract: A method for controlling a semiconductor storage device including memory cells each configured to hold data of 2 bits or more, the method includes starting first signal processing, and inputting lower bits into the semiconductor storage device in a ready state, writing the lower bits to the memory cells, changing the semiconductor storage device from the ready state into a busy state, changing the semiconductor storage device from the busy state into the ready state, and finishing the first signal processing, starting second signal processing, and inputting upper bits into the semiconductor storage device in the ready state, and writing the upper bits to the memory cells. A period for the writing the upper bits is longer than a period for the writing the lower bits. A period for performing the second signal processing is longer than a period for performing the first signal processing.

Abstract: A master slice type LSI is constructed as a three port memory circuit in which respective cells exclusively utilized as memory circuits constituting respective memory regions can be accessed simultaneously. More particularly each cell exclusively used as a memory circuit is constituted by a flip-flop circuit including two inverters (31, 32) which are connected in parallel opposition, a single write data input line (39) and two read out data output lines (40, 41) which are connected to the flip-flop circuit through transfer gate circuits (33,34,35), respectively, and at least three word lines (36, 37, 38) along which independent word signals are transmitted. The three transfer gate circuits (33, 34, 35) are independently enabled and disenabled based on the word signals transmitted over the word lines (36, 37, 38).