Patents by Inventor Tomokatsu UCHINO

Tomokatsu UCHINO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer inspection method and wafer inspection apparatus
    Patent number: 10161883
    Abstract: Provided is a wafer inspection method capable of examining whether pits are formed in wafer surfaces. The wafer inspection method includes the steps of: choosing defects of a wafer using a first optical system; selecting potential pits from the chosen defects; and classifying the potential pits into pits and defects other than the pits using a second optical system.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: December 25, 2018
    Assignee: SUMCO CORPORATION
    Inventors: Tatsuya Osada, Masahiko Egashira, Tomokatsu Uchino
  • WAFER INSPECTION METHOD AND WAFER INSPECTION APPARATUS
    Publication number: 20180328859
    Abstract: Provided is a wafer inspection method capable of examining whether pits are formed in wafer surfaces. The wafer inspection method includes the steps of: choosing defects of a wafer using a first optical system; selecting potential pits from the chosen defects; and classifying the potential pits into pits and defects other than the pits using a second optical system.
    Type: Application
    Filed: August 3, 2016
    Publication date: November 15, 2018
    Applicants: SUMCO CORPORATION, SUMCO CORPORATION
    Inventors: Tatsuya OSADA, Masahiko EGASHIRA, Tomokatsu UCHINO