Abstract: By adding a viable lactic acid bacterium to a fat or oil composition, the present invention has succeeded in producing a lactic acid bacterium-containing fat or oil composition that has a high viability of the lactic acid bacterium and an excellent resistance to acids. By adding lactic acid bacteria powder or a chocolate with a high lactic acid bacterium concentration to a chocolate dough after tempering and before molding, moreover, the present invention has succeeded in producing a lactic acid bacterium-containing chocolate including a viable lactic acid bacterium by a simple producing method. Thus, provided is a lactic acid bacterium-containing chocolate with high palatability that contains a viable lactic acid bacterium.

Abstract: Disclosed is a polishing slurry which enables to suppress damages to an under layer while securing an adequate polishing rate. The polishing slurry contains a resin (A) having an amide group and an organic resin (B).

Abstract: The present invention provides a material that is less likely to cause flex cracking, has high scratch resistance, and is suitable for a protective layer for a thermosensitive material. A thermosensitive recording material according to the present invention includes a base, a thermosensitive recording layer formed on the base, and a protective layer formed on the thermosensitive recording layer, wherein the protective layer is formed from a mixture that contains an emulsion (a) containing particles formed of a hydrophobic polymer (1) and a hydrophilic polymer (2); and a non-crosslinking urea compound (b). Preferably, the hydrophobic polymer (1) contains an acrylonitrile-derived constitutional unit. Preferably, the non-crosslinking urea compound (b) is urea or a urea derivative.

Abstract: A heat-sensitive recording material includes a heat-sensitive recording layer on a support which layer produces a color upon heating, and a protective layer on the heat-sensitive recording layer. The protective layer is obtained from a composition (A) based on an emulsion of a copolymer resin (a). The copolymer resin (a) includes a vinyl monomer component having a carboxyl group, and a vinyl monomer component copolymerizable with the vinyl monomer component. The copolymer resin (a) contains 1 to 10 parts by weight of the vinyl monomer component having a carboxyl group. The copolymer resin has a SP value (solubility parameter) of not less than 9.5 (cal/cm3)1/2 and a glass transition temperature (Tg) of 20 to 130° C. The emulsion of the copolymer resin (a) has a minimum film-forming temperature (MFT) of more than 5° C.

Abstract: Disclosed is a polishing composition containing not less than 1 wt % of a water-soluble resin, which is obtained by polymerizing a vinyl monomer containing an amino group and/or an amide group, based on the total weight of the polishing composition.

Abstract: The present invention provides a material that is less likely to cause flex cracking, has high scratch resistance, and is suitable for a protective layer for a thermosensitive material. A thermosensitive recording material according to the present invention includes a base, a thermosensitive recording layer formed on the base, and a protective layer formed on the thermosensitive recording layer, wherein the protective layer is formed from a mixture that contains an emulsion (a) containing particles formed of a hydrophobic polymer (1) and a hydrophilic polymer (2); and a non-crosslinking urea compound (b). Preferably, the hydrophobic polymer (1) contains an acrylonitrile-derived constitutional unit. Preferably, the non-crosslinking urea compound (b) is urea or a urea derivative.

Abstract: Disclosed is a polishing composition containing not less than 1 wt % of a water-soluble resin, which is obtained by polymerizing a vinyl monomer containing an amino group and/or an amide group, based on the total weight of the polishing composition.

Abstract: A heat-sensitive recording material includes a heat-sensitive recording layer on a support which layer produces a color upon heating, and a protective layer on the heat-sensitive recording layer. The protective layer is obtained from a composition (A) based on an emulsion of a copolymer resin (a). The copolymer resin (a) includes a vinyl monomer component having a carboxyl group, and a vinyl monomer component copolymerizable with the vinyl monomer component. The copolymer resin (a) contains 1 to 10 parts by weight of the vinyl monomer component having a carboxyl group. The copolymer resin has a SP value (solubility parameter) of not less than 9.5 (cal/cm3)1/2 and a glass transition temperature (Tg) of 20 to 130° C. The emulsion of the copolymer resin (a) has a minimum film-forming temperature (MFT) of more than 5° C.

Abstract: Disclosed is a polishing slurry which enables to suppress damages to an under layer while securing an adequate polishing rate. The polishing slurry contains a resin (A) having an amide group and an organic resin (B).

Abstract: The present invention provides a polishing slurry which remarkably inhibits the occurrence of scratch, dishing or erosion.

Abstract: A protective material for a heat sensitive paper, which is an emulsion including water, a water soluble polymer (A), and a hydrophobic polymer (B), at least one of (A) and (B) containing a structural unit derived from a monomer (C) having a sulfonic acid group or a salt thereof. The protective material can provide a higher level of durability (e.g., water resistance, plasticizer resistance, alcohol resistance) against various materials, and can ensure good running stability, as compared with the conventional protective material.